APA450-FGG256A
| Part Description |
ProASICPLUS Field Programmable Gate Array (FPGA) IC 186 110592 256-LBGA |
|---|---|
| Quantity | 1,819 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FPBGA (17x17) | Grade | Automotive | Operating Temperature | -40°C – 125°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LBGA | Number of I/O | 186 | Voltage | 2.375 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 12288 | Number of Logic Elements/Cells | 12288 | ||
| Number of Gates | 450000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | AEC-Q100 | Total RAM Bits | 110592 |
Overview of APA450-FGG256A – ProASICPLUS Field Programmable Gate Array (FPGA) IC 186 110592 256-LBGA
The APA450-FGG256A is a ProASICPLUS field programmable gate array (FPGA) provided in a 256-LBGA surface-mount package. It integrates 12,288 logic elements, approximately 0.11 Mbits of embedded RAM, and 186 I/O to support mid-density programmable logic implementations.
Designed and qualified for automotive use (AEC-Q100), this device targets applications that require moderate logic density, a wide operating temperature range, and a compact BGA package with a defined supply voltage window for stable operation.
Key Features
- Logic Capacity Provides 12,288 logic elements (CLBs) and an equivalent gate count of 450,000 for implementing combinational and sequential logic functions.
- Embedded Memory Includes a total of 110,592 bits of on-chip RAM (approximately 0.11 Mbits) for buffering, state storage, and small lookup tables.
- I/O Resources 186 general-purpose I/O pins to support multiple peripheral interfaces and signal routing in compact designs.
- Automotive Qualification AEC-Q100 qualified and designated as automotive grade to meet automotive electronics qualification requirements.
- Package and Mounting 256-LBGA (supplier device package: 256-FPBGA, 17×17) in a surface-mount form factor for space-constrained boards.
- Power Supply Specified supply voltage range of 2.375 V to 2.625 V to match systems with tight core-voltage requirements.
- Temperature Range Rated for operation from −40 °C to 125 °C to support deployment across wide-temperature environments.
Typical Applications
- Automotive Control Systems Leverages AEC-Q100 qualification, wide operating temperature, and I/O count for functions such as sensor interface, body electronics, and control logic.
- Embedded Control Offers a balance of logic resources and on-chip RAM suitable for embedded control tasks, state machines, and custom peripheral aggregation.
- Communications and Interface Bridging Provides sufficient I/O and logic elements for protocol conversion, signal conditioning, and medium-complexity interface logic.
Unique Advantages
- Automotive-qualified device: AEC-Q100 qualification and automotive grade designation provide a clear fit for vehicle electronics and other high-reliability applications.
- Balanced logic and memory: 12,288 logic elements combined with approximately 0.11 Mbits of on-chip RAM supports a broad range of mid-density programmable designs.
- Generous I/O count: 186 I/Os enable multiple peripheral connections and flexible board-level integration without large external GPIO expanders.
- Compact BGA package: 256-LBGA (17×17 FPBGA) provides a space-efficient footprint for compact systems while maintaining thermal and routing characteristics of a BGA.
- Wide temperature and controlled supply: Operation from −40 °C to 125 °C and a defined 2.375–2.625 V supply range simplify thermal and power provisioning for demanding environments.
Why Choose APA450-FGG256A?
The APA450-FGG256A positions itself as a mid-density, automotive-qualified FPGA that combines a substantial logic element count, embedded RAM, and a high I/O count in a compact 256-LBGA package. Its AEC-Q100 qualification and wide operating temperature range make it appropriate for designs where reliability across temperature extremes is required.
This device is well suited to engineers and procurement teams seeking a programmable logic solution for automotive control, embedded control, and communications interface tasks where predictable supply and thermal parameters, moderate logic density, and robust I/O are key selection criteria.
Request a quote or submit an inquiry to receive pricing and availability for the APA450-FGG256A.

Date Founded: 1989
Headquarters: Chandler, Arizona, USA
Employees: 22,000+
Revenue: $8.349 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016, AS 9100D