APA450-FGG256A

IC FPGA 186 I/O 256FBGA
Part Description

ProASICPLUS Field Programmable Gate Array (FPGA) IC 186 110592 256-LBGA

Quantity 1,819 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package256-FPBGA (17x17)GradeAutomotiveOperating Temperature-40°C – 125°C
Package / Case256-LBGANumber of I/O186Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs12288Number of Logic Elements/Cells12288
Number of Gates450000ECCN3A991DHTS Code8542.39.0001
QualificationAEC-Q100Total RAM Bits110592

Overview of APA450-FGG256A – ProASICPLUS Field Programmable Gate Array (FPGA) IC 186 110592 256-LBGA

The APA450-FGG256A is a ProASICPLUS field programmable gate array (FPGA) provided in a 256-LBGA surface-mount package. It integrates 12,288 logic elements, approximately 0.11 Mbits of embedded RAM, and 186 I/O to support mid-density programmable logic implementations.

Designed and qualified for automotive use (AEC-Q100), this device targets applications that require moderate logic density, a wide operating temperature range, and a compact BGA package with a defined supply voltage window for stable operation.

Key Features

  • Logic Capacity  Provides 12,288 logic elements (CLBs) and an equivalent gate count of 450,000 for implementing combinational and sequential logic functions.
  • Embedded Memory  Includes a total of 110,592 bits of on-chip RAM (approximately 0.11 Mbits) for buffering, state storage, and small lookup tables.
  • I/O Resources  186 general-purpose I/O pins to support multiple peripheral interfaces and signal routing in compact designs.
  • Automotive Qualification  AEC-Q100 qualified and designated as automotive grade to meet automotive electronics qualification requirements.
  • Package and Mounting  256-LBGA (supplier device package: 256-FPBGA, 17×17) in a surface-mount form factor for space-constrained boards.
  • Power Supply  Specified supply voltage range of 2.375 V to 2.625 V to match systems with tight core-voltage requirements.
  • Temperature Range  Rated for operation from −40 °C to 125 °C to support deployment across wide-temperature environments.

Typical Applications

  • Automotive Control Systems  Leverages AEC-Q100 qualification, wide operating temperature, and I/O count for functions such as sensor interface, body electronics, and control logic.
  • Embedded Control  Offers a balance of logic resources and on-chip RAM suitable for embedded control tasks, state machines, and custom peripheral aggregation.
  • Communications and Interface Bridging  Provides sufficient I/O and logic elements for protocol conversion, signal conditioning, and medium-complexity interface logic.

Unique Advantages

  • Automotive-qualified device: AEC-Q100 qualification and automotive grade designation provide a clear fit for vehicle electronics and other high-reliability applications.
  • Balanced logic and memory: 12,288 logic elements combined with approximately 0.11 Mbits of on-chip RAM supports a broad range of mid-density programmable designs.
  • Generous I/O count: 186 I/Os enable multiple peripheral connections and flexible board-level integration without large external GPIO expanders.
  • Compact BGA package: 256-LBGA (17×17 FPBGA) provides a space-efficient footprint for compact systems while maintaining thermal and routing characteristics of a BGA.
  • Wide temperature and controlled supply: Operation from −40 °C to 125 °C and a defined 2.375–2.625 V supply range simplify thermal and power provisioning for demanding environments.

Why Choose APA450-FGG256A?

The APA450-FGG256A positions itself as a mid-density, automotive-qualified FPGA that combines a substantial logic element count, embedded RAM, and a high I/O count in a compact 256-LBGA package. Its AEC-Q100 qualification and wide operating temperature range make it appropriate for designs where reliability across temperature extremes is required.

This device is well suited to engineers and procurement teams seeking a programmable logic solution for automotive control, embedded control, and communications interface tasks where predictable supply and thermal parameters, moderate logic density, and robust I/O are key selection criteria.

Request a quote or submit an inquiry to receive pricing and availability for the APA450-FGG256A.

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