APA450-FGG484

The APA450-FGG484 is a ProASICPLUS Flash-based field programmable gate array (FPGA) from Microchip Technology, offered in a 484-ball FPBGA (23×23) package. It provides a mid-range logic density with 12,288 logic elements, 344 user I/O pins and on-chip embedded memory, suited to commercial-grade digital designs.

Designed for surface-mount assembly and RoHS-compliant production, this device targets applications that require moderate embedded memory, substantial I/O count and a compact BGA package while operating within a 2.3 V to 2.7 V supply and a 0 °C to 70 °C commercial temperature range.

Key Features

• Logic Capacity — 12,288 logic elements (LEs) providing substantial resources for implementing custom digital logic, state machines and control functions.
• On‑Chip Memory — Approximately 0.11 Mbits of embedded RAM (110,592 bits) to support buffering, small data tables and local storage without external memory.
• I/O Density — 344 user I/O pins to support wide parallel interfaces, multiple peripherals and flexible board-level connectivity.
• Logic Gate Equivalence — 450,000 gates equivalent, enabling integration of complex combinational and sequential logic blocks.
• Power and Supply — Operates from a 2.3 V to 2.7 V supply range to match common device rails in modern commercial designs.
• Package and Mounting — 484-ball FPBGA (23×23) surface-mount package for compact board footprint and reliable soldered connections.
• Commercial Grade and Temperature Range — Rated for commercial-grade operation from 0 °C to 70 °C.
• Environmental Compliance — RoHS-compliant for global lead-free manufacturing requirements.

Typical Applications

• Custom Digital Control — Implement application-specific control logic, sequencers and state machines using the device’s 12,288 logic elements and on-chip RAM.
• I/O-Intensive Interfaces — Support parallel buses, multi-channel sensor interfaces or peripheral glue logic with 344 user I/Os.
• Embedded System Glue — Serve as a bridge or glue logic between processors, peripherals and custom modules where moderate gate count and local RAM reduce external components.

Unique Advantages

• Balanced Logic and Memory — 12,288 logic elements combined with approximately 0.11 Mbits of RAM provide a practical balance for mid-density designs without immediate need for external memory.
• High I/O Count — 344 user I/Os enable flexible interfacing and reduce the need for additional I/O expanders on the PCB.
• Compact BGA Packaging — 484-ball FPBGA (23×23) reduces board area while supporting high pin count connectivity for dense designs.
• Commercial‑Grade Reliability — Specified for 0 °C to 70 °C operation and RoHS compliance to meet common commercial product requirements.
• Supply Compatibility — 2.3 V to 2.7 V operating range aligns with modern logic power rails for straightforward integration.

Why Choose APA450-FGG484?

The APA450-FGG484 delivers a practical mix of logic capacity, embedded memory and generous I/O in a compact 484-ball BGA package, making it suitable for commercial designs that require medium-density FPGA resources and high connectivity. Its specified voltage range, surface-mount package and RoHS compliance simplify integration into contemporary PCB assemblies.

From custom control logic to I/O-rich interface hubs, this Microchip Technology ProASICPLUS device is positioned for engineers and procurement teams building cost‑sensitive commercial products that need reliable programmable logic with on-chip memory and ample I/O without moving to larger, higher-cost devices.

Request a quote or submit an inquiry to receive pricing and availability information for the APA450-FGG484. Our team can provide lead-time details and supply options to support your design schedule.