APA450-FGG484A

IC FPGA 344 I/O 484FBGA
Part Description

ProASICPLUS Field Programmable Gate Array (FPGA) IC 344 110592 484-BGA

Quantity 334 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeAutomotiveOperating Temperature-40°C – 125°C
Package / Case484-BGANumber of I/O344Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs12288Number of Logic Elements/Cells12288
Number of Gates450000ECCN3A991DHTS Code8542.39.0001
QualificationAEC-Q100Total RAM Bits110592

Overview of APA450-FGG484A – ProASICPLUS Field Programmable Gate Array (FPGA) IC 344 110592 484-BGA

The APA450-FGG484A is a ProASICPLUS field programmable gate array from Microchip Technology, offering 12288 logic elements, approximately 0.11 Mbits of embedded memory and 344 general-purpose I/Os in a 484-ball BGA package. Engineered for applications that require dense logic integration, high I/O count and operation across a broad temperature range, this device provides an automotive-qualified FPGA option for embedded-system designs.

Key Features

  • Core Logic  12288 logic elements (equivalent to 450,000 gates) for implementing combinational and sequential logic functions.
  • Embedded Memory  110,592 total RAM bits (approximately 0.11 Mbits) for on-chip buffering, state storage and small data tables.
  • I/O and Integration  344 user I/Os to support dense sensor, actuator and peripheral interfacing within a single FPGA package.
  • Power Supply  Operates from a supply range of 2.375 V to 2.625 V to match targeted system voltages.
  • Package and Mounting  Supplied in a 484-FPBGA (23×23) 484-BGA package for surface-mount PCB assembly and compact board integration.
  • Automotive Qualification  AEC-Q100 qualified and graded for automotive use, supporting designs that require automotive-level robustness.
  • Temperature Range  Specified for operation from -40 °C to 125 °C for deployment in temperature-challenging environments.
  • Environmental Compliance  RoHS compliant for adherence to common environmental regulations.

Typical Applications

  • Automotive Control Systems  Implement custom logic, signal processing and I/O aggregation in engine control, body electronics or gateway modules where AEC-Q100 qualification is required.
  • Sensor and Actuator Interfaces  High I/O count supports interfacing multiple sensors and actuators for real-time signal conditioning and aggregation.
  • Industrial Automation  Use in factory equipment and motion-control systems that benefit from on-chip logic density and extended temperature operation.
  • Communication and Protocol Bridging  Consolidate protocol translation and I/O buffering within a single programmable device to simplify system architecture.

Unique Advantages

  • Highly integrated logic capacity: 12288 logic elements and 450,000 gates enable implementation of complex state machines and processing blocks on-chip, reducing external component count.
  • Large native I/O count: 344 I/Os allow direct connection to multiple peripherals and sensors without additional multiplexing hardware.
  • Automotive-grade reliability: AEC-Q100 qualification and a -40 °C to 125 °C operating range support deployment in automotive environments.
  • Compact BGA footprint: 484-FPBGA (23×23) package balances board space efficiency with high I/O density for compact system designs.
  • Precise supply compatibility: Narrow supply range (2.375 V–2.625 V) for predictable power design and easy integration with matched system rails.
  • Regulatory alignment: RoHS compliance supports environmental and manufacturing requirements.

Why Choose APA450-FGG484A?

The APA450-FGG484A positions itself as a versatile, automotive-qualified FPGA for designs that require substantial logic density, a large number of I/Os and reliable operation across extended temperatures. Its combination of 12288 logic elements, embedded memory and 344 I/Os in a compact 484-BGA package makes it suitable for engineers looking to consolidate functions and reduce board-level complexity.

Backed by Microchip Technology and AEC-Q100 qualification, this device is well suited for customers building automotive and temperature-sensitive embedded systems who need a robust, high-integration programmable logic component with clear electrical and thermal operating specifications.

Request a quote or submit an inquiry to start a procurement process for the APA450-FGG484A and evaluate its fit for your next design.

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