APA450-FGG484I

The APA450-FGG484I is a ProASICPLUS field programmable gate array (FPGA) from Microchip Technology, offering 12,288 logic elements and 450,000 gates in a compact 484-ball BGA package. Designed for industrial-grade embedded designs, it combines substantial on-chip memory and a high I/O count to support complex digital logic integration and system interfacing.

With a supply voltage range of 2.3 V to 2.7 V and an operating temperature range of –40 °C to 85 °C, the APA450-FGG484I is specified for applications that require robust performance across standard industrial environments.

Key Features

• Logic Capacity  12,288 logic elements (approximate representation of the device’s programmable logic resources) supporting up to 450,000 logic gates for mid-density FPGA designs.
• Embedded Memory  110,592 bits of on-chip RAM, approximately 0.11 Mbits of embedded memory for buffering, FIFOs, and small data tables.
• I/O Density  344 user I/O pins to support wide parallel buses, multiple interfaces, and complex I/O routing requirements.
• Power and Voltage  Operates from a 2.3 V to 2.7 V supply range to match common FPGA power rails and system designs.
• Package and Mounting  484-ball BGA (supplier package: 484-FPBGA, 23×23) in a surface-mount form factor for compact board-level integration.
• Industrial Temperature Grade  Specified for operation from –40 °C to 85 °C to meet industrial temperature requirements.
• Compliance  RoHS-compliant construction to meet environmental and manufacturing requirements.

Typical Applications

• Industrial Control  Use in programmable logic and control interfaces where industrial temperature range and dense I/O are required for sensors, actuators, and control buses.
• Embedded Systems  Integration into mid-density embedded designs that need on-chip RAM and significant logic capacity for protocol handling and data processing.
• Interface Bridging  Implement protocol bridging and parallel/serial interface aggregation using the high I/O count and available logic resources.
• Data Acquisition  Front-end aggregation and buffering tasks that benefit from embedded RAM and multiple I/O channels for sensor inputs and timing signals.

Unique Advantages

• Substantial Logic Resource:  12,288 logic elements provide a balanced platform for mid-density FPGA implementations without excessive board area.
• Generous I/O Count:  344 I/O pins enable extensive external connectivity and flexible interface implementations on a single device.
• On-Chip Memory:  Approximately 0.11 Mbits of embedded RAM reduces the need for external memory for small buffers and lookup tables.
• Industrial Temperature Support:  Rated from –40 °C to 85 °C for reliable operation in industrial environments and equipment.
• Compact BGA Packaging:  484-ball BGA (23×23) offers a space-efficient solution for high-density designs while maintaining robust solder joint reliability in surface-mount assemblies.
• RoHS Compliance:  Manufactured to meet RoHS requirements for environmentally conscious production and assembly.

Why Choose APA450-FGG484I?

The APA450-FGG484I positions itself as a practical mid-density FPGA option for engineers balancing logic capacity, on-chip memory, and high I/O requirements within an industrial temperature envelope. Its combination of 12,288 logic elements, substantial I/O, and compact 484-BGA package makes it suitable for embedded control, interface aggregation, and data acquisition designs that demand robust performance and board-level integration.

Customers targeting reliable, scalable designs will find value in the APA450-FGG484I’s clear electrical and environmental specifications, RoHS compliance, and the packaging options that support dense system integration and consistent manufacturing.

Request a quote or submit an inquiry to get pricing and availability for APA450-FGG484I and to discuss how this FPGA can fit your next design.