APA450-FGG256I

IC FPGA 186 I/O 256FBGA
Part Description

ProASICPLUS Field Programmable Gate Array (FPGA) IC 186 110592 256-LBGA

Quantity 252 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package256-FPBGA (17x17)GradeIndustrialOperating Temperature-40°C – 85°C
Package / Case256-LBGANumber of I/O186Voltage2.3 V - 2.7 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs12288Number of Logic Elements/Cells12288
Number of Gates450000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits110592

Overview of APA450-FGG256I – ProASICPLUS Field Programmable Gate Array (FPGA) IC 186 110592 256-LBGA

The APA450-FGG256I is a ProASICPLUS field programmable gate array (FPGA) provided in a 256-LBGA package. It integrates programmable logic, on-chip RAM, and a broad set of I/O in a surface-mount form factor suitable for industrial-temperature operation.

With 12,288 logic elements, approximately 0.11 Mbits of embedded memory, 186 I/O pins and support for a 2.3 V to 2.7 V supply, the device is designed to provide a compact, industrial-grade programmable logic option where moderate logic density, on-chip RAM and a high I/O count are required.

Key Features

  • Core Logic 12,288 logic elements (equivalent logic cells) and an advertised 450,000 gates provide on-chip programmable logic capacity for custom digital functions.
  • Embedded Memory Total on-chip RAM of 110,592 bits (approximately 0.11 Mbits) for internal buffering, state storage and small memory structures.
  • I/O 186 general-purpose I/O pins to support a wide range of external device interfacing and board-level connectivity.
  • Power Supports a core/operating voltage supply range of 2.3 V to 2.7 V, enabling operation within a defined low-voltage envelope.
  • Package & Mounting Supplied in a 256-LBGA (256-FPBGA, 17 × 17) package for surface-mount assembly and compact PCB footprint.
  • Temperature & Grade Industrial-grade device with an operating temperature range of −40 °C to 85 °C for use in temperature-variable environments.
  • Compliance RoHS-compliant material declaration.

Unique Advantages

  • Balanced logic density: 12,288 logic elements and 450,000 gates provide a middle-ground capacity for custom logic without excessive board-level complexity.
  • On-chip memory for local buffering: Approximately 0.11 Mbits of embedded RAM reduces dependence on external memory for smaller data storage needs.
  • High I/O count: 186 I/O pins enable broad connectivity to peripherals, sensors and other system components.
  • Industrial temperature rating: Specified operation from −40 °C to 85 °C supports deployment in temperature-variable industrial environments.
  • Compact surface-mount package: 256-LBGA (17 × 17) minimizes board area while supporting the device’s I/O and power requirements.
  • Low-voltage operation: 2.3 V to 2.7 V supply range supports low-voltage system designs.

Why Choose APA450-FGG256I?

The APA450-FGG256I positions itself as a compact, industrial-grade ProASICPLUS FPGA option offering a mix of logic density, on-chip memory and a high I/O count in a 256-LBGA package. Its specifications make it suitable for designs that require moderate programmable logic capacity, local embedded RAM and extensive external interfacing while operating over an industrial temperature range.

Choose this device when a surface-mount FPGA with defined low-voltage operation, RoHS compliance, and a balance of logic, memory and I/O is needed. The APA450-FGG256I supports scalable implementation of custom digital functions with on-chip resources that simplify board-level integration.

Request a quote or submit a procurement inquiry to get pricing and availability for the APA450-FGG256I. Our team can assist with ordering and lead-time information.

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