EP1S40B956C6N

The EP1S40B956C6N is a Stratix® field programmable gate array (FPGA) in a 956-BBGA (40×40) package, delivering substantial on-chip logic and memory resources combined with high I/O density. It is designed for commercial-grade applications where a combination of logic capacity, embedded memory, and large I/O counts are required within a surface-mount BGA footprint.

Key technical attributes include 41,250 logic elements, approximately 3.42 Mbits of embedded memory, and 683 I/Os, with a core supply range of 1.425 V to 1.575 V and an operating temperature range of 0 °C to 85 °C.

Key Features

• Logic Capacity  Provides 41,250 logic elements to implement complex custom logic, state machines, and datapath designs.
• Embedded Memory  Approximately 3.42 Mbits of on-chip RAM to support buffering, FIFOs, and local data storage without external memory.
• High I/O Count  683 general-purpose I/O pins support multiple interfaces and parallel connectivity in a single device.
• Power and Core Supply  Core voltage range of 1.425 V to 1.575 V to match system power design requirements.
• Package and Mounting  956-BBGA (40×40) package in a surface-mount form factor for compact PCB integration.
• Temperature and Grade  Commercial grade device rated for 0 °C to 85 °C operation.
• Environmental Compliance  RoHS compliant for lead-free assembly and regulatory alignment.

Typical Applications

• High-density I/O systems  Large I/O count supports multi-interface boards and systems that require extensive external connectivity.
• Embedded logic and prototyping  Substantial logic element count and on-chip memory enable development and validation of complex custom logic functions.
• Interface bridging and protocol handling  Use the device to consolidate multiple interface standards and perform real-time protocol translation.
• Data aggregation and buffering  On-chip memory is suitable for local buffering and aggregation of data streams prior to further processing.

Unique Advantages

• High integration density: 41,250 logic elements and approximately 3.42 Mbits of embedded memory reduce the need for external logic and memory components.
• Extensive connectivity: 683 I/Os provide flexibility to connect numerous peripherals and high-pin-count interfaces without multiple devices.
• Compact BGA package: 956-BBGA (40×40) enables a small PCB footprint while maintaining thermal and routing efficiency for dense designs.
• Commercial temperature rating: Rated for 0 °C to 85 °C, aligning with standard commercial electronic product environments.
• RoHS compliance: Conforms to lead-free manufacturing requirements for regulatory and assembly compatibility.

Why Choose EP1S40B956C6N?

The EP1S40B956C6N delivers a balanced combination of logic capacity, embedded memory, and high I/O density in a compact 956-BBGA surface-mount package. Its specifications make it well suited to commercial designs that require significant on-chip resources and extensive external connectivity while maintaining a constrained board footprint.

Engineers and procurement teams targeting scalable FPGA-based solutions will find this device appropriate for mid-to-high complexity applications where integration, predictable operating conditions, and RoHS compliance are priorities.

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