EP1S30F780I6N

IC FPGA 597 I/O 780FBGA
Part Description

Stratix® Field Programmable Gate Array (FPGA) IC 597 3317184 32470 780-BBGA, FCBGA

Quantity 1,493 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package780-FBGA (29x29)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case780-BBGA, FCBGANumber of I/O597Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs3247Number of Logic Elements/Cells32470
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits3317184

Overview of EP1S30F780I6N – Stratix® Field Programmable Gate Array (FPGA) IC 597 3317184 32470 780-BBGA, FCBGA

The EP1S30F780I6N is a Stratix® family field programmable gate array (FPGA) in a 780-ball FCBGA package. It provides a combination of on-chip logic, embedded RAM and a high pin count to support complex, configurable digital designs.

Designed around the Stratix architecture, the device integrates programmable logic and system-level resources documented in the Stratix Device Handbook, making it suitable for applications requiring substantial logic capacity, significant embedded memory, and extensive I/O connectivity.

Key Features

  • Logic Capacity — 32,470 logic elements and 3,247 logic array blocks (LABs) for implementing complex digital functions and custom datapaths.
  • Embedded Memory — Approximately 3.3 Mbits of on-chip RAM (3,317,184 total RAM bits) for FIFOs, buffers, and on-chip data storage.
  • I/O Resources — 597 I/O pins to support broad external device interfacing and multi-channel connectivity.
  • Clocking & DSP Resources — Stratix family features include PLLs and clock networks plus dedicated multiplier/DSP blocks for timing control and arithmetic acceleration (as documented in the Stratix Device Handbook).
  • High‑Speed I/O & Memory Interfaces — Family-level support for double-data-rate I/O, differential signaling, advanced I/O standards, and external RAM interfacing per Stratix documentation.
  • Configuration & Debug — Family-level support for JTAG boundary-scan, SignalTap embedded logic analysis, and partial reconfiguration options described in Stratix technical documentation.
  • Package & Mounting — 780‑ball FCBGA (780-FBGA, 29 × 29) surface-mount package for high-density board designs.
  • Power — Core supply voltage range of 1.425 V to 1.575 V for standard Stratix core operation.
  • Operating Range & Grade — Industrial grade with an operating temperature range of −40 °C to 100 °C and RoHS compliance for regulatory compatibility.

Typical Applications

  • High‑performance DSP and signal processing — Use the device’s logic elements, embedded RAM, and multiplier/DSP resources for custom filtering, transforms, and real‑time processing pipelines.
  • Memory interface and buffering — Leverage approximately 3.3 Mbits of on‑chip RAM and Stratix external RAM interfacing features for memory controllers, caches, and data staging.
  • High‑pin-count system controllers — The 597 I/O pins and advanced I/O features enable dense peripheral connectivity for communication and control systems.
  • Configurable prototyping and system integration — Implement system-level functions, glue logic, and rapid design iterations using the Stratix family configuration and debug capabilities.

Unique Advantages

  • Substantial logic density: 32,470 logic elements provide headroom for large, integrated digital designs without immediate partitioning across multiple devices.
  • Significant on‑chip memory: Approximately 3.3 Mbits of embedded RAM reduces external memory dependencies and lowers board complexity for many buffering and storage needs.
  • Extensive I/O count: 597 I/Os support broad peripheral and multi-channel interfacing, minimizing the need for external expanders.
  • Industrial temperature capability: −40 °C to 100 °C operation supports deployment in industrial environments where extended temperature tolerance is required.
  • Complete Stratix family ecosystem: Documentation and device-level features such as PLLs, clock networks, DSP blocks, JTAG, and SignalTap are available in the Stratix Device Handbook to support design, verification, and debugging.
  • High-density packaging: The 780-ball FCBGA (29 × 29) package enables compact board layouts for space-constrained applications.

Why Choose EP1S30F780I6N?

EP1S30F780I6N combines a large complement of logic elements, substantial embedded RAM, and a high I/O count in a rugged industrial-grade Stratix FPGA package. The device is positioned for designers who need a configurable, high‑capacity FPGA with documented Stratix family features for clocking, DSP, I/O signaling, configuration and embedded debug.

Backed by the Stratix Device Handbook and family-level documentation, this FPGA provides verifiable architecture and resources to support medium-to-large scale FPGA designs while meeting industrial temperature and RoHS requirements.

Request a quote or submit an RFQ to evaluate EP1S30F780I6N for your next design project.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up