EP1S30F780I6N
| Part Description |
Stratix® Field Programmable Gate Array (FPGA) IC 597 3317184 32470 780-BBGA, FCBGA |
|---|---|
| Quantity | 1,493 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 780-FBGA (29x29) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 780-BBGA, FCBGA | Number of I/O | 597 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 3247 | Number of Logic Elements/Cells | 32470 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 3317184 |
Overview of EP1S30F780I6N – Stratix® Field Programmable Gate Array (FPGA) IC 597 3317184 32470 780-BBGA, FCBGA
The EP1S30F780I6N is a Stratix® family field programmable gate array (FPGA) in a 780-ball FCBGA package. It provides a combination of on-chip logic, embedded RAM and a high pin count to support complex, configurable digital designs.
Designed around the Stratix architecture, the device integrates programmable logic and system-level resources documented in the Stratix Device Handbook, making it suitable for applications requiring substantial logic capacity, significant embedded memory, and extensive I/O connectivity.
Key Features
- Logic Capacity — 32,470 logic elements and 3,247 logic array blocks (LABs) for implementing complex digital functions and custom datapaths.
- Embedded Memory — Approximately 3.3 Mbits of on-chip RAM (3,317,184 total RAM bits) for FIFOs, buffers, and on-chip data storage.
- I/O Resources — 597 I/O pins to support broad external device interfacing and multi-channel connectivity.
- Clocking & DSP Resources — Stratix family features include PLLs and clock networks plus dedicated multiplier/DSP blocks for timing control and arithmetic acceleration (as documented in the Stratix Device Handbook).
- High‑Speed I/O & Memory Interfaces — Family-level support for double-data-rate I/O, differential signaling, advanced I/O standards, and external RAM interfacing per Stratix documentation.
- Configuration & Debug — Family-level support for JTAG boundary-scan, SignalTap embedded logic analysis, and partial reconfiguration options described in Stratix technical documentation.
- Package & Mounting — 780‑ball FCBGA (780-FBGA, 29 × 29) surface-mount package for high-density board designs.
- Power — Core supply voltage range of 1.425 V to 1.575 V for standard Stratix core operation.
- Operating Range & Grade — Industrial grade with an operating temperature range of −40 °C to 100 °C and RoHS compliance for regulatory compatibility.
Typical Applications
- High‑performance DSP and signal processing — Use the device’s logic elements, embedded RAM, and multiplier/DSP resources for custom filtering, transforms, and real‑time processing pipelines.
- Memory interface and buffering — Leverage approximately 3.3 Mbits of on‑chip RAM and Stratix external RAM interfacing features for memory controllers, caches, and data staging.
- High‑pin-count system controllers — The 597 I/O pins and advanced I/O features enable dense peripheral connectivity for communication and control systems.
- Configurable prototyping and system integration — Implement system-level functions, glue logic, and rapid design iterations using the Stratix family configuration and debug capabilities.
Unique Advantages
- Substantial logic density: 32,470 logic elements provide headroom for large, integrated digital designs without immediate partitioning across multiple devices.
- Significant on‑chip memory: Approximately 3.3 Mbits of embedded RAM reduces external memory dependencies and lowers board complexity for many buffering and storage needs.
- Extensive I/O count: 597 I/Os support broad peripheral and multi-channel interfacing, minimizing the need for external expanders.
- Industrial temperature capability: −40 °C to 100 °C operation supports deployment in industrial environments where extended temperature tolerance is required.
- Complete Stratix family ecosystem: Documentation and device-level features such as PLLs, clock networks, DSP blocks, JTAG, and SignalTap are available in the Stratix Device Handbook to support design, verification, and debugging.
- High-density packaging: The 780-ball FCBGA (29 × 29) package enables compact board layouts for space-constrained applications.
Why Choose EP1S30F780I6N?
EP1S30F780I6N combines a large complement of logic elements, substantial embedded RAM, and a high I/O count in a rugged industrial-grade Stratix FPGA package. The device is positioned for designers who need a configurable, high‑capacity FPGA with documented Stratix family features for clocking, DSP, I/O signaling, configuration and embedded debug.
Backed by the Stratix Device Handbook and family-level documentation, this FPGA provides verifiable architecture and resources to support medium-to-large scale FPGA designs while meeting industrial temperature and RoHS requirements.
Request a quote or submit an RFQ to evaluate EP1S30F780I6N for your next design project.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018