EP1S30F780C8

IC FPGA 597 I/O 780FBGA
Part Description

Stratix® Field Programmable Gate Array (FPGA) IC 597 3317184 32470 780-BBGA, FCBGA

Quantity 671 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package780-FBGA (29x29)GradeCommercialOperating Temperature0°C – 85°C
Package / Case780-BBGA, FCBGANumber of I/O597Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs3247Number of Logic Elements/Cells32470
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits3317184

Overview of EP1S30F780C8 – Stratix® Field Programmable Gate Array (FPGA) IC 597 3317184 32470 780-BBGA, FCBGA

The EP1S30F780C8 is a Stratix® family field programmable gate array (FPGA) provided in a 780-ball FCBGA package. It delivers a high-density logic fabric with substantial on-chip memory and a large I/O count for complex digital designs.

Built for commercial applications, this device combines approximately 32,470 logic elements, roughly 3.3 Mbits of embedded memory, and 597 I/O pins, making it suitable for designs that require dense logic integration, significant buffering or state storage, and broad external interfacing. The device operates from a 1.425–1.575 V core supply and is specified for 0 °C to 85 °C operation.

Key Features

  • High Logic Density — Approximately 32,470 logic elements support complex combinational and sequential logic implementations within a single device.
  • Embedded Memory — Approximately 3.3 Mbits of on-chip RAM provide ample internal storage for buffering, FIFOs, and lookup tables.
  • Extensive I/O — 597 I/O pins facilitate broad external connectivity for parallel interfaces, bus bridges, or multi-channel systems.
  • Stratix Architecture — Device is part of the Stratix family; the device handbook documents architecture elements such as logic array blocks, TriMatrix memory, DSP/multiplier resources, PLLs, and flexible clock networks.
  • Package & Mounting — 780-FBGA (29 × 29 mm) surface-mount package enables compact, high-density board layouts.
  • Power Supply — Core supply specified from 1.425 V to 1.575 V for predictable power planning and regulator selection.
  • Commercial Temperature Grade — Rated for 0 °C to 85 °C operation for standard commercial environments.
  • RoHS Compliant — Meets RoHS requirements for lead-free manufacturing processes.

Typical Applications

  • High-density digital systems — Implement complex glue logic, protocol bridges, and custom state machines using the device's large logic element count and abundant I/O.
  • Signal processing and DSP — Leverage the Stratix family architecture (including multiplier/DSP resources described in the device handbook) together with on-chip memory for packet buffering and streaming datapaths.
  • Prototyping and platform development — Use the device’s logic and memory resources to validate board-level designs and multi-function prototypes before production.
  • Interface aggregation — With 597 I/Os, consolidate multiple peripheral interfaces or high-pin-count buses into a single programmable device.

Unique Advantages

  • Substantial on-chip resources: Approximately 32,470 logic elements and ~3.3 Mbits of RAM reduce the need for external glue logic and memory, simplifying BOM and board routing.
  • Large I/O capacity: 597 I/O pins enable direct interfacing to many peripherals and parallel buses without additional expander ICs.
  • Stratix family capabilities: Access to Stratix architecture features documented in the device handbook (clock management, memory modes, DSP and multiplier blocks) helps accelerate system design and timing strategies.
  • Compact BGA packaging: The 780-FBGA (29×29) package provides a dense footprint for space-constrained designs while supporting high-pin-count connectivity.
  • Commercial-grade suitability: Specified 0 °C to 85 °C operation and RoHS compliance align the device with standard commercial product deployments.

Why Choose EP1S30F780C8?

The EP1S30F780C8 positions itself as a high-density Stratix FPGA option for engineers who need significant logic resources, substantial embedded memory, and a very large I/O footprint in a single surface-mount package. Its documented Stratix architecture features and on-chip resources make it well suited for complex digital systems, signal-processing tasks, and prototype platforms where consolidation and reprogrammability are priorities.

For design teams and procurement sourcing commercial-grade FPGAs, this device offers a balanced combination of integration, predictable power requirements (1.425–1.575 V), and package density to support medium-to-high complexity designs while retaining compliance with RoHS manufacturing requirements.

If you would like pricing, availability, or a formal quote for EP1S30F780C8, submit a request to receive a quote or further procurement details.

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