EP1S30F780C7
| Part Description |
Stratix® Field Programmable Gate Array (FPGA) IC 597 3317184 32470 780-BBGA, FCBGA |
|---|---|
| Quantity | 580 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 780-FBGA (29x29) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 780-BBGA, FCBGA | Number of I/O | 597 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 3247 | Number of Logic Elements/Cells | 32470 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 3317184 |
Overview of EP1S30F780C7 – Stratix Field Programmable Gate Array (780‑BBGA, FCBGA)
The EP1S30F780C7 is a Stratix® family Field Programmable Gate Array (FPGA) in a 780‑ball FCBGA package designed for commercial embedded systems. It combines a high count of programmable logic, substantial on‑chip memory, and a large I/O complement to support dense digital designs.
Key on‑device resources include 32,470 logic elements, approximately 3.32 Mbits of embedded memory, and up to 597 user I/O pins—delivering the capacity required for complex signal processing, bridging, and control applications within its specified 0 °C to 85 °C operating range.
Key Features
- Logic Capacity — 32,470 logic elements to implement substantial combinational and sequential logic in a single device.
- Embedded Memory — Approximately 3.32 Mbits of on‑chip RAM for buffers, FIFOs, and local data storage.
- I/O Density — Up to 597 user I/O pins to support wide buses, multiple interfaces, and high pin‑count designs.
- Power Supply — Core supply range of 1.425 V to 1.575 V, enabling precise power sequencing and board design around the FPGA core requirements.
- Package & Mounting — 780‑BBGA (FCBGA) surface‑mount package; supplier device package listed as 780‑FBGA (29×29) for consistent footprint reference.
- Commercial Grade Temperature — Rated for 0 °C to 85 °C operation for standard commercial applications.
- Stratix Architecture Elements — Series documentation details advanced architecture building blocks including LUT‑based logic elements, LAB interconnects, programmable PLLs and clock networks, DSP block interfaces, and multiple memory modes.
- Configuration & Test Support — Series materials include support for boundary‑scan (JTAG) and configuration features documented in the Stratix Device Handbook.
- RoHS Compliant — Declared RoHS compliance for environmental regulatory alignment.
Typical Applications
- High‑density digital processing — Use the large pool of logic elements and on‑chip RAM for packet processing, protocol handling, and custom compute accelerators.
- Interface bridging and I/O aggregation — Leverage 597 I/Os to consolidate multiple peripheral buses, handle wide data paths, or implement multi‑lane interfaces.
- Embedded control and signal conditioning — Combine logic, memory, and DSP resources for motor control, sensor data aggregation, and real‑time signal paths in commercial systems.
- Prototyping and system validation — Suitable for developers needing a high‑resource FPGA platform for algorithm development and hardware/software co‑validation.
Unique Advantages
- Substantial on‑chip resources: 32,470 logic elements and ~3.32 Mbits of embedded RAM reduce external component needs and simplify board layouts.
- High I/O count: 597 user I/Os allow direct interfacing to multiple peripherals and wide buses without complex multiplexing.
- Flexible clocking and DSP support: Stratix family documentation includes programmable PLLs and DSP block interfaces that enable precise timing control and arithmetic acceleration as implemented in the series.
- Commercial temperature rating: Specified 0 °C to 85 °C operation aligns the device to mainstream industrial and consumer electronics use cases.
- Industry standard packaging: 780‑ball FCBGA footprint (29×29 reference) supports surface‑mount assembly for volume production.
- Regulatory readiness: RoHS compliance supports deployment in regulated supply chains.
Why Choose EP1S30F780C7?
EP1S30F780C7 positions itself as a high‑capacity Stratix FPGA option for commercial designs that require a combination of large logic fabric, significant embedded memory, and a high number of I/Os in a single FCBGA package. The device’s documented architecture elements—clocking, memory modes, and DSP interfaces—support complex timing and processing requirements typical in sophisticated embedded systems.
For teams building mid‑to‑high complexity hardware, this FPGA delivers the integration and scalability to consolidate functions, reduce board BOM, and expedite development using the Stratix family reference material and configuration features.
To request pricing, availability, or a formal quote for EP1S30F780C7, submit an inquiry referencing the full part number and intended quantity for procurement evaluation.

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