EP1S30F780C8N

The EP1S30F780C8N is a Stratix® family Field Programmable Gate Array (FPGA) device provided in a 780-ball FCBGA package. It delivers a combination of high logic density, substantial on‑chip memory, and a large I/O count suitable for complex programmable logic integration.

Built for commercial-grade deployments, the device supports a core supply voltage range of 1.425 V to 1.575 V and operates across a 0 °C to 85 °C temperature range. The Stratix device handbook that accompanies this family documents architecture features such as logic array blocks, memory modes, PLLs and clock networks, and I/O structure useful for system-level design.

Key Features

• Logic Resources — 32,470 logic elements providing substantial combinational and sequential logic capacity for complex designs.
• Logic Array Blocks (LABs) — 3,247 LABs (Logic Array Blocks) for structured placement of logic resources and predictable design scaling.
• Embedded Memory — Approximately 3.317 Mbits of on-chip RAM for buffering, FIFOs, and local data storage.
• I/O Capacity — 597 user I/Os to support dense external interfaces and board-level connectivity.
• Package & Mounting — 780-FBGA (29×29) surface-mount package (780-BBGA, FCBGA supplier device package) for high-density board integration.
• Power & Temperature — Core supply voltage of 1.425 V to 1.575 V; commercial operating temperature range of 0 °C to 85 °C.
• Compliance — RoHS compliant.
• Architecture Documentation — Stratix device handbook coverage includes clock networks, PLLs, DSP/multiplier blocks, memory modes, and I/O structure to support system design and verification.

Typical Applications

• Complex Programmable Logic — Implement custom state machines, control logic, and glue logic where high logic density is required.
• Memory-Intensive Functions — Use on-chip RAM for buffering, packet or frame storage, and local data manipulation inside single-chip designs.
• High-IO Integration — Drive multi-device interfaces, parallel buses, and dense connector arrays with the device’s 597 I/Os.
• DSP and Arithmetic Blocks — Leverage the Stratix family’s documented multiplier and DSP block features for arithmetic-heavy processing tasks.

Unique Advantages

• High Logic Density: 32,470 logic elements enable consolidation of complex functions into a single FPGA, reducing board-level component count.
• Substantial On-Chip Memory: Approximately 3.317 Mbits of embedded RAM supports local storage needs and reduces dependence on external memory.
• Large I/O Count: 597 I/Os accommodate extensive external interfacing without additional I/O expanders.
• Package Flexibility: 780-FBGA (29×29) surface-mount package balances pin count and board area for dense system implementations.
• Commercial Grade and RoHS Compliant: Designed for commercial temperature operation (0 °C to 85 °C) and environmental compliance for mainstream product applications.
• Documented Architecture: Comprehensive Stratix handbook material covering PLLs, clocking, memory modes, and I/O helps accelerate design and verification.

Why Choose EP1S30F780C8N?

The EP1S30F780C8N positions itself as a high‑density Stratix FPGA option for commercial applications that require significant logic resources, embedded memory, and a large number of I/Os in a single device. Its documented architecture support and package options enable integrators to implement complex digital systems with reduced component count and clearer system partitioning.

This device is suited to engineering teams and OEMs seeking a commercially graded Stratix FPGA with on-chip memory and extensive connectivity, backed by detailed family documentation to support design, configuration, and testing workflows.

Request a quote or submit a purchase inquiry to evaluate the EP1S30F780C8N for your next design requirement.