EP1S30F780C7N

IC FPGA 597 I/O 780FBGA
Part Description

Stratix® Field Programmable Gate Array (FPGA) IC 597 3317184 32470 780-BBGA, FCBGA

Quantity 887 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package780-FBGA (29x29)GradeCommercialOperating Temperature0°C – 85°C
Package / Case780-BBGA, FCBGANumber of I/O597Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs3247Number of Logic Elements/Cells32470
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits3317184

Overview of EP1S30F780C7N – Stratix® Field Programmable Gate Array (FPGA), 780‑FBGA

The EP1S30F780C7N is a Stratix® Field Programmable Gate Array (FPGA) IC from Intel (Altera), offered in a 780‑ball FCBGA package. It provides a programmable fabric based on the Stratix device architecture and is intended for commercial‑grade embedded and digital logic applications.

With 32,470 logic elements, on‑chip embedded memory and a high I/O count, the device is suited for designs that require dense logic integration, flexible I/O connectivity, and on‑chip memory resources within a surface‑mount FCBGA package.

Key Features

  • Logic Capacity — 32,470 logic elements (LEs) for implementing complex digital functions and custom logic.
  • Embedded Memory — Approximately 3.32 Mbits of on‑chip RAM (3,317,184 total RAM bits) for buffering, FIFOs, and local storage.
  • I/O Resources — 597 user I/O pins to support dense external interfacing and multi‑lane connectivity.
  • Stratix Architecture (documented) — Device handbook content for the Stratix family describes architecture elements such as Logic Array Blocks, TriMatrix memory, multiplier blocks, DSP block interfaces, and advanced I/O structures to guide system integration.
  • Clocking & PLLs — The device documentation includes PLLs and hierarchical clocking schemes for advanced timing and clock distribution strategies.
  • Configuration & Test Support — Datasheet material covers configuration modes, JTAG boundary‑scan support and embedded logic analysis features for development and production testing.
  • Package & Mounting — 780‑BBGA FCBGA package (supplier package noted as 780‑FBGA, 29×29) designed for surface‑mount PCB assembly.
  • Power & Operating Range — Core supply voltage range of 1.425 V to 1.575 V and commercial operating temperature range of 0 °C to 85 °C.
  • Compliance — RoHS compliant and delivered in a commercial grade classification.

Typical Applications

  • Communications Infrastructure — Programmable logic and abundant I/O allow implementation of custom protocol engines, data path processing and interface bridging.
  • Digital Signal Processing — On‑chip RAM and documented multiplier/DSP block interfaces support FIR filters, FFT stages and stream processing pipelines.
  • Embedded System Prototyping — Dense logic resources and flexible configuration options make the device suitable for prototyping custom SoC functions and hardware accelerators.
  • High‑Density I/O Control — Large I/O count supports board‑level aggregation, multi‑lane IO, and complex peripheral interfacing in compact packages.

Unique Advantages

  • Substantial Logic Density: 32,470 logic elements enable consolidation of multiple functions into a single FPGA, reducing BOM and board complexity.
  • Significant Embedded Memory: Approximately 3.32 Mbits of on‑chip RAM provides local storage for buffering and state, reducing reliance on external memory.
  • High I/O Count: 597 I/O pins allow flexible interfacing to peripherals, transceivers and parallel data channels without extensive external bridging.
  • Documented Stratix Architecture: Comprehensive device handbook material covering LEs, memory modes, PLLs, I/O features and configuration options helps accelerate design and integration.
  • Commercial Temperature & RoHS Compliance: Rated for 0 °C to 85 °C operation and RoHS compliant for broad commercial applications and standard manufacturing flows.
  • FCBGA Packaging for Dense Boards: 780‑FBGA (29×29) package supports high pin density in space‑constrained layouts while enabling surface‑mount assembly.

Why Choose EP1S30F780C7N?

The EP1S30F780C7N positions itself as a Stratix family FPGA option that balances sizable logic resources, multi‑megabit embedded memory, and a high I/O count within a compact 780‑ball FCBGA package. It is suitable for commercial designs that require integrated digital processing, flexible I/O connectivity and established Stratix documentation for architecture and integration guidance.

Design teams targeting embedded DSP, protocol handling or custom logic consolidation will find the EP1S30F780C7N offers a measurable combination of capacity and package density backed by device handbook content from the Stratix family to support implementation and testing.

Request a quote or submit an inquiry to obtain pricing, lead‑time and availability for the EP1S30F780C7N.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up