EP1S30F780C6

The EP1S30F780C6 is a Stratix® Field Programmable Gate Array (FPGA) IC designed for high-density programmable logic applications. It combines a large array of logic elements, substantial embedded RAM, and a very high I/O count in a 780-ball FCBGA package for surface-mount board-level integration.

This device targets designs that require dense logic integration, on-chip memory, flexible clocking and DSP support, and large numbers of I/O signals—delivering integration and configurability for communication, signal-processing and complex system control functions.

Key Features

• Logic Capacity 32,470 logic elements (LEs) to implement complex combinational and sequential logic functions.
• Embedded Memory Approximately 3.3 Mbits of on-chip RAM for buffering, FIFOs, and local data storage.
• I/O Density 597 user I/O pins to support wide parallel interfaces and multi-channel connectivity.
• Stratix Architecture Elements Device handbook topics include TriMatrix memory, multiplier blocks, DSP block interface, and LAB/LUT structures as part of the Stratix family architecture.
• Clocking & Timing Includes Stratix family features for PLLs and clock networks as described in the device handbook for flexible clock domain management.
• Configuration & Test Support Documentation references JTAG boundary-scan support, configuration schemes and an embedded logic analyzer (SignalTap II) for development and debug.
• Package & Mounting 780-BBGA (FCBGA) package; supplier device package listed as 780-FBGA (29×29). Surface-mount mounting type for standard PCB assembly.
• Power & Temperature Core supply voltage range: 1.425 V to 1.575 V. Commercial operating temperature: 0 °C to 85 °C.
• Regulatory RoHS compliant.

Typical Applications

• High‑Speed Communications Use the device’s large logic fabric and high I/O count to implement protocol handling, packet processing and custom interface logic.
• Digital Signal Processing On-chip memory and documented DSP/multiplier blocks make the device suitable for real-time filtering, transforms and signal pipelines.
• System Prototyping & Integration Dense logic and abundant I/O simplify consolidating multiple discrete functions into a single programmable device for prototype and production systems.
• Custom Control & Interfaces Implement complex state machines, bus bridges and multi-channel I/O controllers leveraging the device’s logic density and memory resources.

Unique Advantages

• High Logic Density: 32,470 logic elements enable compact implementation of complex digital designs, reducing board-level component count.
• Substantial On‑Chip Memory: Approximately 3.3 Mbits of embedded RAM supports local buffering and intermediate data storage without external memory.
• Very High I/O Count: 597 I/O pins allow wide parallel buses, multiple interfaces and flexible system partitioning on a single device.
• Comprehensive Device Documentation: The Stratix device handbook provides detailed coverage of architecture, memory modes, PLLs, I/O structure and configuration options to accelerate design and debug.
• Surface‑Mount 780‑FBGA Packaging: A compact 29×29 ball FCBGA package supports dense board layouts and modern assembly processes.
• RoHS Compliant: Meets RoHS requirements for lead‑free assembly and regulatory alignment.

Why Choose EP1S30F780C6?

The EP1S30F780C6 positions itself as a high-density Stratix FPGA option for designs that need significant logic capacity, embedded RAM and very large I/O capability in a compact FCBGA package. Its documented architecture and configuration features support complex digital signal processing, interface aggregation and system-level integration.

Ideal for engineering teams building communications modules, DSP subsystems, or integrated control logic, this device offers a balance of integration and documented support to help accelerate development and reduce bill-of-material complexity.

Request a quote today to discuss availability, lead times and pricing for EP1S30F780C6.