EP1S30F1020I6N

IC FPGA 726 I/O 1020FBGA
Part Description

Stratix® Field Programmable Gate Array (FPGA) IC 726 3317184 32470 1020-BBGA

Quantity 1,350 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1020-FBGA (33x33)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1020-BBGANumber of I/O726Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs3247Number of Logic Elements/Cells32470
Number of GatesN/AECCN3A001A2AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits3317184

Overview of EP1S30F1020I6N – Stratix® Field Programmable Gate Array (FPGA) IC 726 3317184 32470 1020-BBGA

The EP1S30F1020I6N is a Stratix® FPGA from Intel delivered in a 1020-FBGA (33×33) surface-mount package. The device integrates 32,470 logic elements across 3,247 LABs and provides approximately 3.3 Mbits of embedded memory (3,317,184 bits) together with 726 I/O pins.

On-chip resources and architecture documented in the Stratix device handbook—including PLLs and clock networks, DSP/multiplier blocks, high-speed I/O features, and robust configuration/debug options—make this device appropriate for designs that require high logic and I/O density within an industrial temperature range.

Key Features

  • Core Density 32,470 logic elements organized into 3,247 LABs provide high-density programmable logic for complex designs.
  • Embedded Memory Approximately 3.3 Mbits of on-chip RAM (3,317,184 bits) supporting multiple memory modes and TriMatrix memory structures for flexible data storage and buffering.
  • I/O Resources 726 I/O pins with support for advanced I/O capabilities noted in the device handbook, including double-data-rate I/O, programmable drive strength, differential on-chip termination, and high-speed differential interfaces.
  • Clocking and DSP Integrated PLLs and hierarchical clock networks, enhanced and fast PLL options, plus dedicated DSP and multiplier blocks for signal processing and timing-critical functions.
  • Configuration & Debug IEEE 1149.1 (JTAG) boundary-scan support, SignalTap II embedded logic analyzer, and multiple configuration schemes including partial and remote update modes as described in the device documentation.
  • Package & Power Surface-mount 1020-FBGA (33×33) package; specified supply voltage range of 1.425 V to 1.575 V to match system power requirements.
  • Temperature & Compliance Industrial-grade device with an operating temperature range of −40 °C to 100 °C and RoHS compliance for environmental requirements.

Typical Applications

  • High-speed communications — Leverages the device’s high I/O count and high-speed differential I/O support for network interface logic and protocol bridging.
  • Signal processing and DSP — On-chip DSP blocks and multiplier resources enable real-time data processing and algorithm acceleration.
  • Memory interface and controllers — Embedded RAM plus documented external RAM interfacing modes support buffering, caching, and memory-controller implementations.
  • Industrial control and automation — Industrial-grade temperature range and dense I/O make the device suitable for control logic, sensor aggregation, and machine I/O tasks.

Unique Advantages

  • High logic and I/O density: 32,470 logic elements and 726 I/Os reduce the need for external glue logic and simplify integration of complex functions.
  • Substantial on-chip memory: Approximately 3.3 Mbits of embedded RAM enables local buffering and reduces external memory bandwidth requirements.
  • Flexible clocking and DSP resources: Integrated PLLs, hierarchical clocking, and dedicated DSP/multiplier blocks support timing-critical and signal-processing designs.
  • Comprehensive configuration and debug: JTAG, SignalTap II, and partial configuration support facilitate development, testing, and field updates.
  • Industrial temperature support: Rated for −40 °C to 100 °C, aligning with demanding environmental requirements for industrial applications.
  • Standard surface-mount packaging: 1020-FBGA (33×33) offers a compact, manufacturable footprint for volume production.

Why Choose EP1S30F1020I6N?

The EP1S30F1020I6N combines a high logic element count, abundant on-chip memory, and a large I/O complement in a single industrial-grade Stratix FPGA package. Its documented architecture—including advanced I/O, clocking, DSP resources, and mature configuration/debug features—suits teams building complex embedded systems, high-speed interfaces, and industrial controllers who require a dense, configurable logic platform.

Backed by the Stratix device family documentation, the part provides a clear specification set for system design, allowing engineering and procurement teams to evaluate integration, thermal, and power requirements precisely.

Request a quote or submit an inquiry to receive pricing, availability, and additional technical support information for the EP1S30F1020I6N.

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