EP1S30F1020C6N

The EP1S30F1020C6N is an Intel Stratix® FPGA delivering substantial programmable logic, on-chip memory, and high I/O density in a compact 1020-FBGA (33×33) surface-mount package. Key on-chip resources include 32,470 logic elements, approximately 3.317 Mbits of embedded memory, and 726 user I/O pins.

Designed for commercial-grade designs, the device operates from a core supply range of 1.425 V to 1.575 V and across an ambient temperature range of 0 °C to 85 °C. The part is RoHS compliant and follows Stratix device family architecture and configuration features described in the Stratix Device Handbook.

Key Features

• Stratix family architecture — Leverages the Stratix device handbook architecture including flexible clocking, PLLs, DSP/multiplier resources, TriMatrix memory modes, and advanced I/O structures as documented for the series.
• High logic density — 32,470 logic elements provide the capacity for complex parallel logic and custom datapaths.
• Embedded memory — Approximately 3.317 Mbits of on-chip RAM for buffering, FIFOs, and state storage without external memory.
• Large I/O count — 726 I/O pins support wide parallel interfaces and extensive board-level connectivity.
• Package and mounting — 1020-FBGA (33×33) supplier package in a 1020-BBGA case, designed for surface-mount assembly.
• Power supply — Core voltage supply range of 1.425 V to 1.575 V to match system power rails.
• Commercial temperature grade — Rated for operation from 0 °C to 85 °C for commercial applications.
• RoHS compliant — Meets lead-free and hazardous-substance compliance for modern manufacturing requirements.
• Configuration and debug support — Series-level documentation describes JTAG boundary-scan, SignalTap II embedded logic analysis, and configuration tools and flows for Stratix devices.

Typical Applications

• High-performance signal processing — Use the large logic element count and Stratix DSP/multiplier resources to implement parallel filters, transforms, and data-path accelerators.
• High-density I/O subsystems — 726 I/O pins in a 1020-FBGA package enable wide bus interfaces, multi-channel front-ends, and extensive sensor or peripheral connectivity.
• Memory-intensive FPGA functions — Approximately 3.317 Mbits of embedded RAM supports buffering, packet queues, and state machines without immediate need for external memory.
• Prototyping and system validation — Series configuration and debug capabilities described in the Stratix documentation support board bring-up and iterative development.

Unique Advantages

• Substantial logic capacity: 32,470 logic elements enable large-scale custom logic implementations and complex control systems.
• Significant on-chip memory: Approximately 3.317 Mbits of embedded RAM reduces dependency on external memory for many designs.
• Exceptional I/O density: 726 I/Os allow broad connectivity and support for multi-lane and parallel interfaces in a single device.
• Compact BGA package: 1020-FBGA (33×33) balances board space and pin count for dense system designs.
• Commercial-grade operation: 0 °C to 85 °C rating aligns with a wide range of commercial electronic products.
• Standards-based compliance: RoHS compliance supports contemporary manufacturing and regulatory requirements.

Why Choose EP1S30F1020C6N?

The EP1S30F1020C6N positions itself as a high-density Stratix FPGA option for designs that require a combination of large logic capacity, significant on-chip memory, and extensive I/O in a compact surface-mount FBGA package. Its supply voltage range, commercial temperature rating, and RoHS compliance make it suitable for a broad set of commercial embedded applications.

Backed by the Stratix device documentation and series-level configuration tools and debug features, this device is well suited for engineering teams building complex programmable logic solutions that benefit from documented Stratix architecture capabilities and standard configuration flows.

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