EP1S30F1020C5N

The EP1S30F1020C5N is a Stratix® series Field Programmable Gate Array (FPGA) offered in a 1020-BBGA surface-mount package. It provides substantial programmable logic capacity, embedded memory, and a high I/O count for designs that require dense, programmable digital logic and flexible interfacing.

Built on the Stratix architecture documented in the device handbook, this commercial-grade device balances logic density, on-chip RAM, and I/O resources to support complex custom logic, memory buffering and high-density system interconnect within a 0 °C to 85 °C operating range.

Key Features

• Logic Capacity — 32,470 logic elements distributed across 3,247 LABs, enabling substantial custom logic implementation and parallel datapath designs.
• Embedded Memory — Approximately 3.317 Mbits of on-chip RAM (3,317,184 bits) for FIFOs, frame buffers, and local data storage.
• High I/O Density — 726 user I/O pins to support broad peripheral, memory and board-level interconnect requirements.
• Stratix Architecture Features — The Stratix family documentation lists architecture-level capabilities such as TriMatrix memory organization, DSP block interfaces, PLLs and clock networks, MultiTrack interconnect and advanced I/O structures that this device is built around.
• Package & Mounting — 1020-BBGA (supplier package listed as 1020-FBGA, 33 × 33) in a surface-mount format for compact board integration.
• Power & Temperature — Core supply range 1.425 V to 1.575 V and commercial operating temperature 0 °C to 85 °C; RoHS compliant.

Typical Applications

• Custom Digital Logic — Implement glue logic, state machines, protocol translation and other application-specific digital functions using the device's logic element capacity.
• Embedded Memory & Buffering — Use the approximately 3.317 Mbits of on-chip RAM for data buffering, FIFOs and temporary storage close to logic.
• High-Density I/O Control — Leverage 726 I/O pins for multi-channel interfacing, wide data buses, or high-pin-count peripheral connectivity.

Unique Advantages

• High Logic Density: 32,470 logic elements enable complex combinational and sequential designs without immediate need for additional devices.
• Substantial On-Chip RAM: Approximately 3.317 Mbits of embedded memory reduces external memory dependency and simplifies board design for many buffering tasks.
• Extensive I/O Count: 726 I/O pins provide flexibility for interfacing multiple peripherals, buses, or memory devices directly to the FPGA.
• Stratix Architecture Foundation: Built on the Stratix device family, with architecture-level features such as advanced clock networks, DSP block interfaces and programmable I/O documented in the device handbook.
• Compact Surface-Mount Package: 1020-BBGA (1020-FBGA, 33×33) balances I/O density and board footprint for space-constrained designs.
• Commercial-Grade Operation: Specified for 0 °C to 85 °C operation and RoHS compliance for standard commercial deployments.

Why Choose EP1S30F1020C5N?

The EP1S30F1020C5N positions itself as a capable Stratix FPGA option for designs needing a balanced combination of logic density, embedded memory and large I/O capability in a compact BGA package. Its electrical and thermal specifications support commercial applications where on-chip resources and high pin count simplify board-level system architecture.

Designers targeting complex control logic, data buffering, and dense interfacing will find the EP1S30F1020C5N suited for projects that benefit from the Stratix architecture and the device's integration of programmable logic, memory, and extensive I/O resources.

Request a quote or submit an inquiry to begin procurement for the EP1S30F1020C5N and learn about availability and pricing options.