EP1S30F1020C6

The EP1S30F1020C6 is a Stratix® family Field Programmable Gate Array (FPGA) in a 1020-BBGA (33×33 FBGA) package, offering a high-density programmable logic fabric with extensive on-chip memory and a large I/O count. The device implements the Stratix architecture documented in the Stratix Device Handbook and provides a combination of logic elements, embedded RAM, and advanced I/O resources suitable for complex digital designs.

With 32,470 logic elements, approximately 3.3 Mbits of embedded memory, and 726 I/O pins, this commercial-grade, surface-mount FPGA addresses applications that require substantial logic capacity, memory capacity, and high-connectivity in a compact FBGA footprint.

Key Features

• Logic Capacity  32,470 logic elements (LEs) to implement complex custom logic, state machines, and datapaths.
• Embedded Memory  Approximately 3.3 Mbits of on-chip RAM for buffering, FIFOs, and on-chip data storage.
• I/O Density  726 I/O pins provide extensive external connectivity for multi-channel interfaces and high-pin-count systems.
• Stratix Architecture  Device handbook references describe logic array blocks, TriMatrix memory, DSP block interface, PLLs, and clock networks available across the Stratix family.
• Package & Mounting  1020-BBGA package (supplier device package: 1020-FBGA, 33×33) in a surface-mount form factor for compact board designs.
• Power Supply  Core voltage range of 1.425 V to 1.575 V, enabling integration with regulated power rails.
• Commercial Temperature Grade  Rated for 0 °C to 85 °C operating temperature for commercial applications.
• RoHS Compliance  Lead-free and RoHS compliant for global manufacturing requirements.

Typical Applications

• High-density digital systems  Use the 32,470 logic elements to implement complex logic functions, protocol processing, and custom datapaths on a single device.
• Memory-intensive designs  Leverage approximately 3.3 Mbits of embedded RAM for packet buffering, frame storage, and on-chip data structures.
• Multi-channel I/O systems  The 726 I/O pins support parallel interfaces, multi-lane connectivity, and high-pin-count peripheral integration.
• Prototyping and system integration  Surface-mount 1020-FBGA package enables compact board-level prototyping and integration into production PCBs.

Unique Advantages

• High logic density: 32,470 logic elements provide headroom for large, integrated designs without partitioning across multiple devices.
• Substantial on-chip memory: Approximately 3.3 Mbits of RAM reduces external memory dependence, lowering BOM complexity and improving performance for buffering tasks.
• Extensive external connectivity: 726 I/O pins enable flexible interfacing options for multi-channel systems and complex board-level routing.
• Standard FBGA packaging: 1020-BBGA (33×33) balances pin count and board footprint for dense system layouts.
• Commercial-grade qualification: 0 °C to 85 °C rating aligns with a wide range of commercial electronic products and environments.
• Regulatory and manufacturing readiness: RoHS compliance supports lead-free manufacturing and global supply chains.

Why Choose EP1S30F1020C6?

The EP1S30F1020C6 combines a high logic element count, multi-megabit embedded RAM, and a large I/O complement in a compact 1020-FBGA package, making it a robust choice for engineers who need integrated programmable logic with significant on-chip resources. Its Stratix family architecture—documented in the Stratix Device Handbook—provides the architectural building blocks (memory modes, PLLs, advanced I/O and DSP interfaces) to support sophisticated system designs.

This device is well suited for development teams and product designs that require scalable programmable logic capacity, substantial on-chip memory, and high connectivity while maintaining commercial temperature and RoHS-compliant manufacturing requirements.

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