EP1S30F1020C7

IC FPGA 726 I/O 1020FBGA
Part Description

Stratix® Field Programmable Gate Array (FPGA) IC 726 3317184 32470 1020-BBGA, FCBGA

Quantity 1,145 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAltera
Manufacturing StatusActive
Manufacturer Standard Lead Time1 Weeks
Datasheet

Specifications & Environmental

Device Package1020-FBGA (33x33)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1020-BBGA, FCBGANumber of I/O726Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs3247Number of Logic Elements/Cells32470
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits3317184

Overview of EP1S30F1020C7 – Stratix® Field Programmable Gate Array (FPGA) IC

The EP1S30F1020C7 is a Stratix® FPGA from Altera designed for configurable digital logic implementation. It provides a combination of logic capacity, embedded memory, and a high I/O count in a 1020-BBGA (FCBGA) package.

Targeted at commercial-grade designs, this device is suited for applications that require substantial on-chip logic and memory with a compact surface-mount package and standard commercial temperature operation.

Key Features

  • Logic Capacity — 32,470 logic elements to implement sizable custom digital functions and control logic.
  • Embedded Memory — Approximately 3.3 Mbits of on-chip RAM for data buffering, state storage, and intermediate processing.
  • High I/O Density — 726 I/O pins for extensive external interfacing and peripheral connectivity.
  • Package and Mounting — 1020-BBGA (FCBGA), supplier package 1020-FBGA (33×33); Surface-mount for board-level integration.
  • Power — Core supply range 1.425 V to 1.575 V for defined power system planning.
  • Operating Range — Commercial grade operation from 0 °C to 85 °C.
  • Environmental — RoHS compliant.

Typical Applications

  • Custom Digital Logic — Implement application-specific processing, state machines, and glue logic using the device's 32,470 logic elements.
  • High-Density I/O Interfacing — Use 726 I/Os for complex peripheral integration, multi-channel sensor or bus interfacing, and board-level I/O expansion.
  • On-Chip Buffering and Storage — Leverage approximately 3.3 Mbits of embedded memory for data buffering, packet handling, and temporary storage in real-time flows.

Unique Advantages

  • Substantial Logic Resources: 32,470 logic elements enable implementation of complex control and processing functions without immediate external logic.
  • Significant On-Chip Memory: Approximately 3.3 Mbits of embedded RAM reduces reliance on external memory for many buffering and state-storage tasks.
  • Very High I/O Count: 726 I/Os support dense connectivity and multiple parallel interfaces on a single device.
  • Compact FCBGA Package: 1020-BBGA (33×33) package provides a high-pin-count solution in a surface-mount form factor for space-constrained boards.
  • Commercial Temperature Range: Rated 0 °C to 85 °C for standard commercial environments and deployments.
  • RoHS Compliance: Meets lead-free environmental requirements for assembly and distribution.

Why Choose EP1S30F1020C7?

The EP1S30F1020C7 delivers a balance of logic capacity, embedded memory, and extensive I/O in a compact FCBGA package, making it well suited to commercial designs that demand mid-to-high complexity programmable logic. As an Altera Stratix® device, it provides a predictable core voltage window and clear thermal operating limits to support reliable board-level integration.

This device is ideal for designers who need to consolidate discrete logic and memory tasks into a single FPGA, reduce bill-of-materials, and maintain a high I/O count in a surface-mount footprint while operating within commercial temperature and supply constraints.

Request a quote or submit a procurement inquiry to receive pricing and availability for EP1S30F1020C7.

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