EP1S30F1020I6
| Part Description |
Stratix® Field Programmable Gate Array (FPGA) IC 726 3317184 32470 1020-BBGA |
|---|---|
| Quantity | 119 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1020-FBGA (33x33) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1020-BBGA | Number of I/O | 726 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 3247 | Number of Logic Elements/Cells | 32470 | ||
| Number of Gates | N/A | ECCN | 3A001A2A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 3317184 |
Overview of EP1S30F1020I6 – Stratix® Field Programmable Gate Array (FPGA) IC 726 3317184 32470 1020-BBGA
The EP1S30F1020I6 is an Intel Stratix® family FPGA supplied in a 1020-FBGA (33×33) package. It provides a large programmable fabric with 32,470 logic elements, approximately 3.3 Mbits of embedded memory, and 726 I/O pins in a surface-mount package designed for industrial-grade applications.
Engineered for systems that require high I/O density, substantial on-chip memory, and robust operating temperature range, this device is suitable for industrial control, embedded processing, and complex interface bridging where FPGA-based flexibility and integration are required.
Key Features
- Programmable Logic Capacity 32,470 logic elements provide a substantial fabric for implementing complex logic, state machines, and custom accelerators.
- On-Chip Memory Approximately 3.3 Mbits of embedded RAM for buffering, packet storage, or local data processing.
- High I/O Count 726 programmable I/O pins support dense interfacing to peripherals, memory, and external logic.
- Package & Mounting 1020-FBGA (33×33) package, surface-mount mounting type suitable for compact board designs.
- Industrial Temperature Range Rated for operation from −40 °C to 100 °C to meet industrial environment requirements.
- Supply Voltage Core supply range specified at 1.425 V to 1.575 V for predictable power design.
- Configuration & Debug Support Family-level features include IEEE 1149.1 (JTAG) boundary-scan support and SignalTap II embedded logic analyzer capabilities for in-system debug and verification.
- Advanced I/O & Clocking Stratix family documentation indicates support for Double-Data Rate I/O, programmable drive strength, differential on-chip termination, and integrated PLLs and clock networks for flexible timing and high-speed interfacing.
- Memory & DSP Architecture TriMatrix memory organization, multiple memory modes, and dedicated multiplier/DSP block interfaces are documented for complex data-path implementations and efficient resource use.
- Configuration Flexibility The Stratix device family supports multiple configuration schemes, partial reconfiguration, and remote update modes to facilitate system-level update strategies.
Typical Applications
- Industrial Control & Automation Use the industrial-grade temperature range and high I/O density for motor control, real-time logic, and sensor aggregation in factory and process automation equipment.
- Embedded Processing & Acceleration Leverage the 32,470 logic elements and embedded RAM to implement protocol offloads, custom accelerators, and data-path processing within embedded systems.
- High-Density Interface Bridging With 726 I/O and advanced I/O features, implement protocol translation, high-speed interfaces, and multi-channel data routing for instrumentation and communications front-ends.
- Memory-Intensive Functions Approximately 3.3 Mbits of on-chip RAM supports buffering, packet queues, and local storage for streaming or burst-mode data applications.
Unique Advantages
- High Logic Integration: 32,470 logic elements enable consolidation of multiple functions onto a single device, reducing BOM and board area.
- Substantial On-Chip Memory: Approximately 3.3 Mbits of embedded RAM reduces external memory dependence and improves throughput for latency-sensitive tasks.
- Extensive I/O Connectivity: 726 I/O pins support dense peripheral and memory connections, simplifying routing for complex system interfaces.
- Industrial Reliability: −40 °C to 100 °C operating range and industrial grade classification make the device suitable for harsh environments.
- Flexible Clocking & Timing: Integrated PLLs and clock network features documented in the Stratix family provide adaptable clocking options for synchronous designs.
- In-System Debug & Configuration: JTAG boundary-scan and SignalTap II support facilitate board bring-up, diagnostics, and iterative development workflows.
Why Choose EP1S30F1020I6?
The EP1S30F1020I6 combines a large logic element count, significant embedded memory, and very high I/O density in a compact 1020-FBGA package, targeted at industrial applications that demand robust thermal performance and flexible system integration. Its documented Stratix family features—advanced I/O support, configurable clocking, and on-device debug/configuration capabilities—help accelerate development and reduce system complexity.
This device is well suited for engineers designing industrial controls, embedded accelerators, and high-density interface solutions who need a scalable, well-documented FPGA fabric with industry-grade operating conditions and comprehensive configuration options.
Request a quote or submit an inquiry to get pricing, lead time, and ordering information for the EP1S30F1020I6. Our team can provide availability and support information to help integrate this Stratix FPGA into your next design.

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