EP1S30F1020C5

IC FPGA 726 I/O 1020FBGA
Part Description

Stratix® Field Programmable Gate Array (FPGA) IC 726 3317184 32470 1020-BBGA

Quantity 662 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1020-FBGA (33x33)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1020-BBGANumber of I/O726Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs3247Number of Logic Elements/Cells32470
Number of GatesN/AECCN3A001A2AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits3317184

Overview of EP1S30F1020C5 – Stratix FPGA, 32,470 Logic Elements, 1020-BBGA

The EP1S30F1020C5 is a Stratix field-programmable gate array (FPGA) from Intel designed for complex, programmable digital designs. It combines a large logic fabric with on-chip memory and a high I/O count to support integrated system functions in commercial-grade applications.

With 32,470 logic elements, approximately 3.3 Mbits of embedded RAM, and up to 726 I/O pins in a 1020-BBGA package (supplier package: 1020-FBGA, 33×33), this device is suited to designs that require significant local memory, extensive I/O connectivity, and flexible clocking and configuration options. The device operates from a core supply range of 1.425 V to 1.575 V and is specified for 0 °C to 85 °C operation.

Key Features

  • Core Logic  Approximately 32,470 logic elements (LEs) provide the programmable fabric for implementing custom digital functions and control logic.
  • Embedded Memory  Approximately 3.3 Mbits of on-chip RAM (total RAM bits: 3,317,184) for buffering, FIFOs, and on-chip data storage.
  • I/O & Interfaces  Up to 726 I/O pins to support wide external interfacing and multiple parallel or serial connections.
  • Package & Mounting  1020-BBGA package (supplier device package: 1020-FBGA, 33×33) optimized for surface-mount assembly on dense PCBs.
  • Power & Operating Conditions  Core voltage supply specified at 1.425 V to 1.575 V and commercial operating temperature range of 0 °C to 85 °C.
  • Configuration & Testing  Device documentation includes Stratix configuration and testing features such as IEEE Std. 1149.1 (JTAG) boundary-scan support, embedded logic analysis (SignalTap II), and partial reconfiguration capabilities.
  • Clocking & Timing  Stratix architecture documentation covers PLLs and clock networks, enabling flexible clocking schemes and hierarchical/global clock distribution described in the device handbook.
  • RoHS Compliance  RoHS-compliant status supports environmental regulatory considerations for commercial products.

Typical Applications

  • High-performance digital processing  Implement custom data-paths, state machines, and parallel processing blocks using the device's large logic array and embedded RAM.
  • Interface bridging and protocol implementation  High I/O count enables implementation of multi-channel interfaces, protocol translation, and board-level glue logic.
  • Memory-centric on-board functions  Embedded RAM supports buffering, packet FIFOs, and local storage for embedded systems and communications functions.
  • Prototyping and development  JTAG boundary-scan and embedded logic analysis capabilities aid in bring-up, debug, and iterative development workflows.

Unique Advantages

  • High logic density: 32,470 logic elements allow consolidation of multiple functions into a single FPGA, reducing external component count.
  • Substantial on-chip memory: Approximately 3.3 Mbits of embedded RAM enables large on-chip buffers and on-device data processing without immediate external memory dependence.
  • Extensive I/O capacity: Up to 726 I/O pins support complex board-level integration and multiple simultaneous interfaces.
  • Compact, high-pin-count package: The 1020-BBGA / 1020-FBGA (33×33) package delivers high connectivity in a compact surface-mount form factor for PCB-dense designs.
  • Configurable clocking and test support: Stratix device documentation includes PLL and clock network options plus JTAG and embedded logic analysis for reliable configuration and debug.
  • Commercial-grade readiness: Specified operating range (0 °C to 85 °C) and RoHS compliance align with commercial product deployment requirements.

Why Choose EP1S30F1020C5?

The EP1S30F1020C5 positions itself as a flexible, high-capacity Stratix FPGA for commercial designs that need a balance of large logic resources, significant embedded memory, and comprehensive I/O. Its documented Stratix architecture features—clocking, configuration, and embedded test support—help streamline design integration and validation.

This device is well-suited for engineering teams building complex digital systems, interface-rich boards, or memory-intensive on-board functions who require a commercially graded FPGA platform with detailed device handbook guidance and standard configuration/test capabilities.

Request a quote or contact sales to discuss availability, pricing, and how EP1S30F1020C5 can fit into your next design.

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