EP1S25F780I6N
| Part Description |
Stratix® Field Programmable Gate Array (FPGA) IC 597 1944576 25660 780-BBGA |
|---|---|
| Quantity | 140 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 780-FBGA (29x29) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 780-BBGA | Number of I/O | 597 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2566 | Number of Logic Elements/Cells | 25660 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1944576 |
Overview of EP1S25F780I6N – Stratix® Field Programmable Gate Array (FPGA) IC 597 1944576 25660 780-BBGA
The EP1S25F780I6N is a Stratix® family FPGA from Intel, offered in a 780-ball BGA-style package with a 29 × 29 supplier package outline. This device provides a high-density programmable fabric with 25,660 logic elements and approximately 1.94 Mbits of embedded memory, making it suitable for complex, board-level digital designs.
Designed for industrial-grade operation, the device supports a wide I/O complement (597 pins), on-chip clocking and PLL capabilities, and a defined core supply range of 1.425 V to 1.575 V. It targets applications that require substantial logic density, significant embedded memory, and advanced I/O and clocking resources.
Key Features
- Logic Density — 25,660 logic elements provide a large programmable fabric for implementing complex logic, state machines, and custom datapaths.
- Embedded Memory — Approximately 1.94 Mbits of on-chip RAM to support buffering, FIFOs, and memory-mapped functions without external SRAM.
- I/O Capacity & Packaging — 597 user I/O pins in a 780-BBGA package (supplier package: 780-FBGA, 29×29) for dense board-level connectivity and compact surface-mount integration.
- Clocking & Timing Resources — Device documentation includes dedicated PLLs and global/hierarchical clock networks for flexible clock management and phase/clock synthesis.
- Configuration & Test — Stratix device family features documented configuration options and JTAG boundary-scan support for programming and board-level test.
- Power & Supply — Core supply operating range from 1.425 V to 1.575 V, enabling defined power sequencing and system integration planning.
- Industrial Temperature Range — Rated for operation from -40 °C to 100 °C for deployment in industrial environments.
- Compliance & Mounting — Surface-mount package with RoHS compliance for modern assembly and environmental requirements.
Typical Applications
- Industrial Control & Automation — Implement control logic, I/O aggregation, and protocol handling in systems that require extended temperature operation and high logic capacity.
- High-Performance Signal Processing — Use the device’s logic density and on-chip memory for custom DSP pipelines and buffering.
- Communications & Interface Bridging — Large I/O count and clocking resources support multiple high-density board-level interfaces and timing domains.
- System Prototyping & Custom ASIC Offload — Rapidly validate hardware functions and offload complex logic from CPUs using the programmable fabric and embedded resources.
Unique Advantages
- High logic capacity: 25,660 logic elements enable consolidation of multiple functions into a single device, reducing overall BOM count.
- Significant embedded memory: Approximately 1.94 Mbits of on-chip RAM reduces reliance on external memory for many buffering and state-storage needs.
- Extensive I/O availability: 597 I/O pins in a 780-ball BGA footprint support dense external connectivity and mixed-signal interface routing.
- Industrial thermal range: –40 °C to 100 °C rating supports deployment in harsher environments without additional thermal derating assumptions.
- Integrated clocking and configuration features: Documented PLLs, clock networks, and configuration modes provide design flexibility for complex timing architectures.
- RoHS-compliant surface-mount package: Facilitates modern assembly processes and regulatory compliance for commercial and industrial products.
Why Choose EP1S25F780I6N?
The EP1S25F780I6N positions itself as a high-density Stratix FPGA option for designs that require substantial programmable logic, embedded memory, and broad I/O in a compact BGA footprint. Its industrial temperature rating and RoHS-compliant surface-mount packaging make it suited for production systems where environmental range and assembly compatibility matter.
Engineers targeting medium-to-high complexity FPGA implementations will find the combination of logic elements, on-chip RAM, advanced clocking resources, and a large I/O count beneficial for consolidating functions, accelerating prototyping, and scaling designs within the Stratix device family.
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