EP1S25F780I6N

IC FPGA 597 I/O 780FBGA
Part Description

Stratix® Field Programmable Gate Array (FPGA) IC 597 1944576 25660 780-BBGA

Quantity 140 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package780-FBGA (29x29)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case780-BBGANumber of I/O597Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2566Number of Logic Elements/Cells25660
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits1944576

Overview of EP1S25F780I6N – Stratix® Field Programmable Gate Array (FPGA) IC 597 1944576 25660 780-BBGA

The EP1S25F780I6N is a Stratix® family FPGA from Intel, offered in a 780-ball BGA-style package with a 29 × 29 supplier package outline. This device provides a high-density programmable fabric with 25,660 logic elements and approximately 1.94 Mbits of embedded memory, making it suitable for complex, board-level digital designs.

Designed for industrial-grade operation, the device supports a wide I/O complement (597 pins), on-chip clocking and PLL capabilities, and a defined core supply range of 1.425 V to 1.575 V. It targets applications that require substantial logic density, significant embedded memory, and advanced I/O and clocking resources.

Key Features

  • Logic Density — 25,660 logic elements provide a large programmable fabric for implementing complex logic, state machines, and custom datapaths.
  • Embedded Memory — Approximately 1.94 Mbits of on-chip RAM to support buffering, FIFOs, and memory-mapped functions without external SRAM.
  • I/O Capacity & Packaging — 597 user I/O pins in a 780-BBGA package (supplier package: 780-FBGA, 29×29) for dense board-level connectivity and compact surface-mount integration.
  • Clocking & Timing Resources — Device documentation includes dedicated PLLs and global/hierarchical clock networks for flexible clock management and phase/clock synthesis.
  • Configuration & Test — Stratix device family features documented configuration options and JTAG boundary-scan support for programming and board-level test.
  • Power & Supply — Core supply operating range from 1.425 V to 1.575 V, enabling defined power sequencing and system integration planning.
  • Industrial Temperature Range — Rated for operation from -40 °C to 100 °C for deployment in industrial environments.
  • Compliance & Mounting — Surface-mount package with RoHS compliance for modern assembly and environmental requirements.

Typical Applications

  • Industrial Control & Automation — Implement control logic, I/O aggregation, and protocol handling in systems that require extended temperature operation and high logic capacity.
  • High-Performance Signal Processing — Use the device’s logic density and on-chip memory for custom DSP pipelines and buffering.
  • Communications & Interface Bridging — Large I/O count and clocking resources support multiple high-density board-level interfaces and timing domains.
  • System Prototyping & Custom ASIC Offload — Rapidly validate hardware functions and offload complex logic from CPUs using the programmable fabric and embedded resources.

Unique Advantages

  • High logic capacity: 25,660 logic elements enable consolidation of multiple functions into a single device, reducing overall BOM count.
  • Significant embedded memory: Approximately 1.94 Mbits of on-chip RAM reduces reliance on external memory for many buffering and state-storage needs.
  • Extensive I/O availability: 597 I/O pins in a 780-ball BGA footprint support dense external connectivity and mixed-signal interface routing.
  • Industrial thermal range: –40 °C to 100 °C rating supports deployment in harsher environments without additional thermal derating assumptions.
  • Integrated clocking and configuration features: Documented PLLs, clock networks, and configuration modes provide design flexibility for complex timing architectures.
  • RoHS-compliant surface-mount package: Facilitates modern assembly processes and regulatory compliance for commercial and industrial products.

Why Choose EP1S25F780I6N?

The EP1S25F780I6N positions itself as a high-density Stratix FPGA option for designs that require substantial programmable logic, embedded memory, and broad I/O in a compact BGA footprint. Its industrial temperature rating and RoHS-compliant surface-mount packaging make it suited for production systems where environmental range and assembly compatibility matter.

Engineers targeting medium-to-high complexity FPGA implementations will find the combination of logic elements, on-chip RAM, advanced clocking resources, and a large I/O count beneficial for consolidating functions, accelerating prototyping, and scaling designs within the Stratix device family.

Request a quote or submit your requirements to receive pricing, availability, and lead-time information for EP1S25F780I6N. Our team can help with volume inquiries and supply options.

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