EP1S25F780I6

The EP1S25F780I6 is an Intel Stratix® family field programmable gate array (FPGA) packaged in a 780-ball BGA. It provides a high-density programmable fabric with substantial on-chip memory and a large I/O count for complex, configurable digital designs.

Designed for industrial applications, the device combines a large number of logic elements and LABs with on-chip RAM and advanced I/O capabilities, enabling integration of control, signal processing, and interface functions within a single FPGA. Key device-level documentation—such as the Stratix device handbook and data sheet—describes architecture elements like logic array blocks, memory modes, DSP interfaces, and clocking resources.

Key Features

• Logic Fabric 
  Contains 2566 LABs and 25,660 logic elements (cells) to implement complex custom logic and state-machines.
• Embedded Memory 
  Approximately 1.94 Mbits of on-chip RAM for buffering, FIFOs, and small data structures.
• I/O Density 
  597 user I/O pins to support wide parallel interfaces, multiple peripherals, and high pin-count system connections.
• DSP & Arithmetic Blocks 
  Device documentation includes multiplier and DSP block descriptions suitable for implementing fixed-point and integer signal-processing kernels.
• Clocking & PLL Resources 
  Stratix device handbook coverage of PLLs and clock networks indicates integrated clock-management resources for multi‑domain timing control.
• Package & Mounting 
  780‑BBGA supplier package (780‑FBGA, 29×29) in a surface-mount form factor for high-density board designs.
• Power Supply 
  Core voltage supply range: 1.425 V to 1.575 V.
• Industrial Temperature Grade 
  Qualified for an operating range of −40 °C to 100 °C, suitable for industrial environments.
• Environmental Compliance 
  RoHS compliant.

Typical Applications

• Industrial Control & Automation 
  Industrial-grade temperature range and a high I/O count enable sensor/actuator interfacing, real-time control logic, and protocol bridging in factory and process automation systems.
• Signal Processing & DSP 
  On-chip RAM combined with documented multiplier and DSP block support makes the device suitable for implementating custom filtering, data aggregation, and fixed-point signal-processing pipelines.
• Communications & Networking 
  Large logic capacity, extensive I/O, and device clocking resources support protocol handling, framing, and custom PHY-level logic for networking equipment and infrastructure modules.
• Test, Measurement & Instrumentation 
  Reconfigurable logic and boundary-scan/configuration features described in the device documentation are useful for custom test systems, embedded instrumentation, and development platforms.

Unique Advantages

• High logic density: 25,660 logic elements and 2566 LABs enable integration of multiple functions that would otherwise require a discrete ASIC or multiple FPGAs.
• Substantial on-chip RAM: Approximately 1.94 Mbits of embedded memory reduces external memory dependency for many buffering and state-storage needs.
• Extensive I/O capability: 597 I/Os provide flexibility for parallel interfaces, wide data buses, and mixed-signal front-end connections.
• Industrial-ready thermal range: Rated from −40 °C to 100 °C to meet the demands of industrial deployments.
• Compact, high-pin-count package: 780‑ball BGA (780‑FBGA, 29×29) supports dense PCB implementations while maintaining a surface-mount footprint.
• Documented architecture and features: Stratix device handbook and datasheet detail logic array blocks, memory modes, PLLs, DSP blocks, and configuration/testing features to support engineering evaluation and system integration.

Why Choose EP1S25F780I6?

The EP1S25F780I6 positions itself as a versatile Stratix FPGA option for industrial and high-density digital designs that require a balance of logic capacity, embedded memory, and extensive I/O. Its documented architecture—covering LABs, memory modes, DSP resources, and clocking—helps engineers map complex functions into a single programmable device.

With RoHS compliance, industrial temperature rating, and a compact 780‑ball BGA package, this device is suited to systems that demand robustness and integration while relying on Stratix-level documentation for design and verification. It is appropriate for engineering teams building configurable control, signal processing, communications, or test applications that benefit from a field-programmable approach.

If you would like pricing, availability, or a formal quote for EP1S25F780I6, please request a quote or contact sales with your part number and quantity requirements.