EP1S25F780C6

The EP1S25F780C6 is a Stratix® series field programmable gate array from Intel, supplied in a 780-ball BGA/FBGA (29×29) package for surface-mount assembly. It integrates 25,660 logic elements across 2,566 logic array blocks, approximately 1.94 Mbits of embedded RAM, and up to 597 general-purpose I/Os, providing a dense, configurable silicon solution for complex digital designs.

Designed for commercial-grade applications, this device operates from a core supply of 1.425 V to 1.575 V and is specified for an ambient operating temperature range of 0 °C to 85 °C. The device is RoHS compliant and documented in the Stratix Device Handbook referenced in the available technical literature.

Key Features

• Core Logic — 25,660 logic elements organized within 2,566 logic array blocks (LABs) to implement complex logic and control functions.
• Embedded Memory — Approximately 1.94 Mbits of on-chip RAM for buffering, FIFOs, and local storage close to logic.
• High I/O Count — Up to 597 I/O pins supporting a variety of external interfaces and high pin-count connectivity.
• Package & Mounting — 780-ball BGA (780-BBGA) with supplier package 780-FBGA (29×29), optimized for surface-mount PCB assembly and high-density board layouts.
• Power Supply — Core supply range 1.425 V to 1.575 V for integration with common FPGA power rails.
• Operating Conditions & Grade — Commercial-grade device rated for 0 °C to 85 °C operation and RoHS compliant.
• Stratix Architecture (Series-Level) — Documentation for the Stratix family describes features such as logic array blocks, LUT/register chains, TriMatrix memory modes, DSP block interfaces, PLLs and clock networks, and advanced I/O structures.
• Configuration & Test Support — Series documentation includes IEEE 1149.1 (JTAG) boundary-scan support and in-system debugging/configuration features described in the Stratix Device Handbook.

Typical Applications

• High‑performance digital processing — Use the device’s 25,660 logic elements and embedded memory for compute-intensive algorithms and custom data-paths.
• High‑pin‑count interface hubs — The 597 I/Os enable aggregation and protocol bridging for multi-channel I/O systems.
• Interface and memory bridging — On-chip RAM and documented external RAM interfacing capabilities support buffering and memory controller implementations.
• Clocking‑sensitive designs — Stratix family clocking resources and PLLs documented for precise timing and multi-clock-domain designs.

Unique Advantages

• Substantial logic capacity: 25,660 logic elements provide the resources needed to implement large custom logic functions without external glue logic.
• Significant embedded memory: Approximately 1.94 Mbits of on-chip RAM reduces external memory dependence and improves data locality.
• High connectivity: Up to 597 I/Os enable complex multi-device interfaces and dense external connectivity options.
• Compact, high-density package: 780-BBGA / 780-FBGA (29×29) packaging supports high signal density while remaining compatible with surface-mount PCB assembly.
• Verified documentation and support: The device is part of the Stratix family with comprehensive handbook documentation covering architecture, configuration, I/O, and timing.
• Regulatory and assembly readiness: Commercial-grade rating, RoHS compliance, and surface-mount packaging simplify supply-chain and manufacturing considerations.

Why Choose EP1S25F780C6?

The EP1S25F780C6 combines a large logic element count, substantial embedded memory, and a very high I/O count in a compact 780-ball BGA package, making it suitable for demanding commercial FPGA applications that require dense integration and flexible interfaces. Its Stratix-family architecture and accompanying handbook provide documented primitives and design guidance to accelerate development.

This device is best suited for engineering teams developing complex digital systems that need on-chip memory, extensive I/O, and proven architecture documentation for configuration, clocking, and I/O management. The combination of package density, electrical specifications, and available technical documentation supports robust platform design and integration.

Request a quote or submit an inquiry to receive pricing, availability, and ordering information for EP1S25F780C6. Our team can provide additional technical documentation and support materials to help validate the device for your design.