EP1S25F672I7

The EP1S25F672I7 is an Intel Stratix® series FPGA delivered in a 672-ball BGA package tailored for surface-mount assembly. The device integrates 25,660 logic elements across 2,566 logic array blocks and approximately 1.94 Mbits of embedded RAM, together with 473 user I/Os, making it suitable for complex programmable logic tasks in industrial environments.

Designed for applications that require significant on-chip logic, memory resources, and a wide I/O complement, this industrial-grade FPGA supports a core supply range of 1.425 V to 1.575 V and an operating temperature range of −40 °C to 100 °C. The Stratix device handbook referenced in the documentation details family-level architecture and configuration features available to designers.

Key Features

• Core Logic 25,660 logic elements implemented across 2,566 logic array blocks (LABs) for implementing complex finite-state machines, glue logic, and custom datapaths.
• Embedded Memory Approximately 1.94 Mbits of on-chip RAM to support FIFOs, buffering, and localized storage without external memory.
• I/O Density & Package 473 user I/O pins in a 672-ball BGA package (supplier package: 672-FBGA, 27 × 27 mm) optimized for high pin-count systems and compact board layout.
• Supply Voltage Core voltage range of 1.425 V to 1.575 V for the device core domain.
• Industrial Temperature Range Rated for operation from −40 °C to 100 °C to meet temperature demands of industrial applications.
• Mounting & Package Details Surface-mount device in a 672-BBGA package for standard PCB assembly processes.
• Compliance RoHS compliant, supporting regulatory requirements for lead-free assembly.
• Stratix Family Documentation Supported by the Stratix device handbook, which documents architecture, memory modes, I/O structure, PLLs, and configuration/testing features at the family level.

Typical Applications

• Industrial Control Leverages the industrial temperature rating and large logic capacity for programmable controllers, motor control interfaces, and automation logic.
• High‑I/O Systems Suited for applications requiring many signals or buses due to its 473 I/O pins and dense BGA package.
• On‑chip Memory Dependent Designs Designs that need embedded buffering or localized memory can utilize the approximately 1.94 Mbits of RAM for FIFOs, packet buffering, or state storage.
• Embedded Logic and Prototyping High logic element count supports complex glue logic, custom accelerators, and FPGA-based prototyping within industrial environments.

Unique Advantages

• Large Logic Capacity: 25,660 logic elements enable implementation of substantial combinational and sequential logic without partitioning across multiple devices.
• Generous On‑Chip Memory: Approximately 1.94 Mbits of embedded RAM reduces reliance on external memory for many buffering and storage needs.
• High Pin Count in Compact Footprint: 473 I/Os in a 672-ball BGA (27 × 27 mm) give designers high connectivity while maintaining board space efficiency.
• Industrial-Grade Operation: Rated for −40 °C to 100 °C, providing deployment flexibility in temperature-challenging environments.
• Standards-Friendly Packaging: Surface-mount 672-BBGA supports standard manufacturing flows and RoHS-compliant assembly.
• Documented Family-Level Features: Backed by Stratix family documentation covering architecture, I/O structures, PLL and clock networks, and configuration/testing options.

Why Choose EP1S25F672I7?

The EP1S25F672I7 combines a substantial logic element count, significant on-chip RAM, and a broad I/O complement in a 672-ball BGA package rated for industrial temperatures. Its electrical and mechanical specifications make it a practical choice for engineers developing FPGA-based solutions that require dense logic, embedded memory, and numerous external interfaces.

This device is well suited to teams designing industrial and embedded systems that need a single-chip programmable solution with documented Stratix family architecture and configuration options. The combination of capacity, I/O, package, and RoHS compliance supports long-term deployment and standard assembly processes.

Request a quote or submit a pricing inquiry to begin procurement of EP1S25F672I7 and evaluate its fit for your next FPGA-based design.