EP1S25F672C7N

IC FPGA 473 I/O 672FBGA
Part Description

Stratix® Field Programmable Gate Array (FPGA) IC 473 1944576 25660 672-BBGA

Quantity 926 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package672-FBGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case672-BBGANumber of I/O473Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2566Number of Logic Elements/Cells25660
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits1944576

Overview of EP1S25F672C7N – Stratix® Field Programmable Gate Array (FPGA) IC 473 1944576 25660 672-BBGA

The EP1S25F672C7N is a Stratix-series Field Programmable Gate Array designed for commercial embedded and system-level designs that require substantial programmable logic and on-chip memory. It combines a high logic-element count and significant embedded RAM with a large I/O complement in a compact BGA package.

Architected for complex digital processing and system integration tasks, the device is suited to applications that benefit from programmable logic, embedded memory, and extensive I/O connectivity within a surface-mount 672-ball BGA footprint.

Key Features

  • Logic Capacity — 25,660 logic elements provide a solid resource pool for implementing custom digital functions, state machines, and control logic.
  • Embedded Memory — Approximately 1.94 Mbits of on-chip RAM (1,944,576 total RAM bits) for FIFOs, buffers, and local data storage.
  • I/O Resources — 473 I/O pins to support dense peripheral interfacing and multi-channel external device connections.
  • Package and Mounting — 672-ball BGA package (supplier device package: 672-FBGA, 27×27) with surface-mount assembly for compact board-level integration.
  • Power Supply — Core voltage range specified at 1.425 V to 1.575 V, enabling defined power sequencing and supply design.
  • Operating Range & Grade — Commercial grade device with specified operating temperature from 0 °C to 85 °C.
  • Standards & Compliance — RoHS-compliant manufacturing.
  • Stratix Architecture (Series Reference) — Device belongs to the Stratix family; related documentation includes comprehensive architecture, I/O, PLL, memory, and DSP block descriptions to guide system design and configuration.

Typical Applications

  • High-speed data interface and protocol bridging — Use the large I/O complement and on-chip memory for buffering and implementing custom interface logic.
  • Digital signal processing and algorithm acceleration — The Stratix architecture documentation describes DSP and multiplier resources useful for on-chip digital processing tasks.
  • Custom control and embedded system integration — The combination of logic density and embedded RAM supports system control, glue logic, and local data handling.

Unique Advantages

  • Substantial programmable logic: 25,660 logic elements allow implementation of complex custom logic without immediately resorting to multiple devices.
  • On-chip memory capacity: Approximately 1.94 Mbits of RAM reduces external memory dependence for many buffering and storage needs.
  • High I/O count: 473 I/O pins support broad external interfacing, simplifying board-level connectivity for multi-channel designs.
  • Compact BGA package: 672-ball package (27×27) enables a high-density board layout while keeping the device footprint manageable.
  • Controlled supply range: Defined core voltage range (1.425–1.575 V) helps ensure predictable power design and sequencing.
  • Design documentation available: Stratix device family handbook and detailed sections on architecture, memory, PLLs, I/O, and configuration are provided to support implementation and verification.

Why Choose EP1S25F672C7N?

The EP1S25F672C7N offers a balanced mix of logic density, embedded memory, and a large I/O complement in a 672-BBGA package, making it a practical choice for commercial designs that require on-chip programmability and flexible interfacing. Its specified power and temperature ranges, together with Stratix-family design documentation, provide a clear technical foundation for system integration and validation.

This device is well suited for engineers developing complex digital systems, protocol bridges, or on-board processing functions where predictable electrical specs and substantial internal resources reduce external component count and simplify board architecture.

Request a quote or submit a procurement inquiry to obtain pricing, availability, and additional technical support for EP1S25F672C7N.

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