EP1S25F672C7N
| Part Description |
Stratix® Field Programmable Gate Array (FPGA) IC 473 1944576 25660 672-BBGA |
|---|---|
| Quantity | 926 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 672-FBGA (27x27) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 672-BBGA | Number of I/O | 473 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2566 | Number of Logic Elements/Cells | 25660 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1944576 |
Overview of EP1S25F672C7N – Stratix® Field Programmable Gate Array (FPGA) IC 473 1944576 25660 672-BBGA
The EP1S25F672C7N is a Stratix-series Field Programmable Gate Array designed for commercial embedded and system-level designs that require substantial programmable logic and on-chip memory. It combines a high logic-element count and significant embedded RAM with a large I/O complement in a compact BGA package.
Architected for complex digital processing and system integration tasks, the device is suited to applications that benefit from programmable logic, embedded memory, and extensive I/O connectivity within a surface-mount 672-ball BGA footprint.
Key Features
- Logic Capacity — 25,660 logic elements provide a solid resource pool for implementing custom digital functions, state machines, and control logic.
- Embedded Memory — Approximately 1.94 Mbits of on-chip RAM (1,944,576 total RAM bits) for FIFOs, buffers, and local data storage.
- I/O Resources — 473 I/O pins to support dense peripheral interfacing and multi-channel external device connections.
- Package and Mounting — 672-ball BGA package (supplier device package: 672-FBGA, 27×27) with surface-mount assembly for compact board-level integration.
- Power Supply — Core voltage range specified at 1.425 V to 1.575 V, enabling defined power sequencing and supply design.
- Operating Range & Grade — Commercial grade device with specified operating temperature from 0 °C to 85 °C.
- Standards & Compliance — RoHS-compliant manufacturing.
- Stratix Architecture (Series Reference) — Device belongs to the Stratix family; related documentation includes comprehensive architecture, I/O, PLL, memory, and DSP block descriptions to guide system design and configuration.
Typical Applications
- High-speed data interface and protocol bridging — Use the large I/O complement and on-chip memory for buffering and implementing custom interface logic.
- Digital signal processing and algorithm acceleration — The Stratix architecture documentation describes DSP and multiplier resources useful for on-chip digital processing tasks.
- Custom control and embedded system integration — The combination of logic density and embedded RAM supports system control, glue logic, and local data handling.
Unique Advantages
- Substantial programmable logic: 25,660 logic elements allow implementation of complex custom logic without immediately resorting to multiple devices.
- On-chip memory capacity: Approximately 1.94 Mbits of RAM reduces external memory dependence for many buffering and storage needs.
- High I/O count: 473 I/O pins support broad external interfacing, simplifying board-level connectivity for multi-channel designs.
- Compact BGA package: 672-ball package (27×27) enables a high-density board layout while keeping the device footprint manageable.
- Controlled supply range: Defined core voltage range (1.425–1.575 V) helps ensure predictable power design and sequencing.
- Design documentation available: Stratix device family handbook and detailed sections on architecture, memory, PLLs, I/O, and configuration are provided to support implementation and verification.
Why Choose EP1S25F672C7N?
The EP1S25F672C7N offers a balanced mix of logic density, embedded memory, and a large I/O complement in a 672-BBGA package, making it a practical choice for commercial designs that require on-chip programmability and flexible interfacing. Its specified power and temperature ranges, together with Stratix-family design documentation, provide a clear technical foundation for system integration and validation.
This device is well suited for engineers developing complex digital systems, protocol bridges, or on-board processing functions where predictable electrical specs and substantial internal resources reduce external component count and simplify board architecture.
Request a quote or submit a procurement inquiry to obtain pricing, availability, and additional technical support for EP1S25F672C7N.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018