EP1S25F672C6N
| Part Description |
Stratix® Field Programmable Gate Array (FPGA) IC 473 1944576 25660 672-BBGA |
|---|---|
| Quantity | 502 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 672-FBGA (27x27) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 672-BBGA | Number of I/O | 473 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2566 | Number of Logic Elements/Cells | 25660 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1944576 |
Overview of EP1S25F672C6N – Stratix® Field Programmable Gate Array (FPGA) IC 473 1944576 25660 672-BBGA
The EP1S25F672C6N is a Stratix® family Field Programmable Gate Array from Intel, offering a hardware platform for custom digital logic implementation. The device combines a high count of logic elements, embedded RAM, and a large number of I/O pins in a 672-ball BGA package for surface-mount assembly.
This FPGA is aimed at designs that require substantial on-chip logic capacity and memory with flexible I/O options while operating within commercial temperature ranges and a core supply range of 1.425 V to 1.575 V.
Key Features
- Core logic density 25,660 logic elements and 2,566 logic array blocks provide a sizeable fabric for custom digital functions and complex logic implementation.
- Embedded memory Approximately 1.94 Mbits of on-chip RAM to support buffering, state storage, and memory-intensive logic structures.
- I/O capability 473 user I/O pins enable extensive external interfacing and connectivity options for parallel buses, control signals, and sensor/actuator interfaces.
- Power and operating range Core voltage supply specified between 1.425 V and 1.575 V; device is graded for commercial operation from 0 °C to 85 °C.
- Package & mounting 672-ball BGA package (supplier device package listed as 672-FBGA, 27 × 27 mm) for surface-mount PCB assembly and compact system integration.
- Stratix architecture (device handbook) Architecture documentation describes logic array blocks, memory modes, PLLs and clock networks, I/O structure, and configuration/testing features for system design reference.
- Compliance RoHS compliant, supporting regulatory requirements for lead-free assembly processes.
Typical Applications
- High-density digital processing Use the device where substantial logic element count and on-chip RAM are needed to implement custom accelerators, state machines, or complex control logic.
- Custom I/O interfacing The large number of I/O pins makes the FPGA suitable for designs that require many parallel interfaces or mixed signal routing to external peripherals.
- Prototype and development platforms Leverage the Stratix architecture and embedded resources for hardware prototyping and iterative design of advanced digital systems.
Unique Advantages
- Substantial logic capacity: 25,660 logic elements enable implementation of complex, large-scale digital designs without immediate need for multiple devices.
- Integrated memory resources: Approximately 1.94 Mbits of on-chip RAM reduce dependence on external memory for many buffering and temporary-storage tasks.
- Extensive external connectivity: 473 I/O pins provide flexibility to connect numerous peripherals, buses, and control signals directly to the FPGA fabric.
- Compact surface-mount package: The 672-ball BGA (27 × 27 mm) offers a high pin-count solution in a compact form factor suitable for space-constrained boards.
- Documented architecture and design reference: Stratix device handbook material covers logic array blocks, clocking, memory modes, and configuration/testing details to support design and verification.
- Regulatory readiness: RoHS compliance supports lead-free manufacturing and aligns with common environmental requirements.
Why Choose EP1S25F672C6N?
The EP1S25F672C6N positions itself as a high-capacity Stratix FPGA that balances a large logic element count, nearly 2 Mbits of embedded RAM, and extensive I/O in a single surface-mount BGA package. Its documented Stratix architecture and device handbook information provide engineers with the design reference material needed to integrate complex digital logic, clocking and memory modes into their systems.
This device is appropriate for teams and projects that require significant on-chip resources and a commercial-grade operating range, delivering a scalable platform for development, prototyping, and deployment where those characteristics are required.
Request a quote or submit a pricing inquiry to evaluate EP1S25F672C6N for your next design and to obtain availability and lead-time information.

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