EP1S25F672C7

The EP1S25F672C7 is a Stratix® family Field Programmable Gate Array (FPGA) offered in a 672-ball BGA package. It combines a sizable logic fabric and on-chip memory with a large I/O count to address compute- and I/O-intensive designs.

Architecturally consistent with the Stratix device family, the device benefits from the series' documented features such as programmable clocking (PLLs), flexible I/O structures, embedded memory modes, DSP/multiplier resources, and standard configuration and test support. Typical market segments include communications, signal processing, and general-purpose embedded systems requiring commercial-grade operation.

Key Features

• Logic Capacity  Provides 25,660 logic elements to implement complex combinational and sequential logic.
• Embedded Memory  Approximately 1.94 Mbits of on-chip RAM to support buffering, FIFOs, and embedded data storage across diverse memory modes described for the Stratix family.
• I/O Density  473 I/O pins for broad external interfacing and high-pin-count designs.
• Clocking and DSP Support  Built on the Stratix architecture that includes PLLs, clock networks, and dedicated multiplier/DSP block interfaces for deterministic clocking and arithmetic acceleration.
• I/O Features  Series-level documentation includes high-speed differential I/O support, programmable drive strength, slew-rate control, and additional advanced I/O capabilities suitable for multi-standard interfacing.
• Package & Mounting  672-ball BGA package (Supplier Device Package: 672-FBGA, 27×27) with surface-mount mounting for board-level integration.
• Power & Voltage  Core supply voltage range: 1.425 V to 1.575 V to support specified device operation.
• Commercial Temperature Grade  Rated for operation from 0 °C to 85 °C, appropriate for commercial applications.
• Standards & Test  Family-level features include IEEE 1149.1 JTAG boundary-scan and configuration/testing support as documented in the Stratix device handbook.
• Compliance  RoHS compliant.

Typical Applications

• High-bandwidth Communications  Large I/O count and series-level high-speed I/O capabilities enable interfaces and protocol handling for communications equipment.
• Signal Processing & DSP  On-chip memory and Stratix-family DSP/multiplier interfaces support data-path acceleration, filtering, and real-time processing tasks.
• Embedded System Integration  Substantial logic resources and configurable I/O make the device suitable for embedded control, protocol bridging, and custom peripheral integration.
• Memory Interfacing  Documented external RAM interfacing modes in the Stratix family support designs that require external memory controllers or large buffers.

Unique Advantages

• Significant Logic Engine:  25,660 logic elements provide the capacity to implement complex finite-state machines, datapaths, and control logic within a single device.
• Embedded Memory for On-Chip Data Storage:  Approximately 1.94 Mbits of on-chip RAM reduces dependence on external memory for many buffering and storage tasks.
• High I/O Count:  473 I/Os enable dense peripheral connections and multi-channel interfaces without immediate need for additional I/O expanders.
• Family-Level Clocking & DSP Features:  Stratix documentation details PLLs, clock networks, and DSP block interfaces that support precise timing and arithmetic-intensive functions.
• Commercial-Grade Thermal Envelope:  0 °C to 85 °C operating range aligns with commercial product deployments and standard thermal design practices.
• RoHS Compliance:  Meets RoHS requirements for environmentally conscious designs.

Why Choose EP1S25F672C7?

EP1S25F672C7 positions itself as a Stratix-family FPGA option for engineers who need a balanced combination of logic density, embedded memory, and extensive I/O in a commercial-grade BGA package. The device leverages the Stratix architecture elements documented in the device handbook—clocking, memory modes, DSP interfaces, and robust I/O capabilities—making it suitable for designs that require integrated compute and interface resources.

Supported by family-level configuration and test features, and supplied in a 672-ball FBGA package, this device is targeted at development and production systems where on-chip resources and a high pin count reduce system complexity and board-level component count.

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