EP1S25F672C8

IC FPGA 473 I/O 672FBGA
Part Description

Stratix® Field Programmable Gate Array (FPGA) IC 473 1944576 25660 672-BBGA

Quantity 775 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package672-FBGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case672-BBGANumber of I/O473Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2566Number of Logic Elements/Cells25660
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits1944576

Overview of EP1S25F672C8 – Stratix® FPGA – 25,660 logic elements, 672-BBGA

The EP1S25F672C8 is a Stratix® field-programmable gate array (FPGA) IC from Intel, packaged in a 672-BBGA footprint. It provides a high-density logic fabric with a substantial complement of embedded RAM and a large count of I/O pins for complex system integration.

Designed for commercial-temperature applications, this device targets designs that require extensive programmable logic, on-chip memory, and flexible I/O — enabling tasks such as high-performance logic integration, protocol bridging, and advanced signal processing when combined with Stratix architecture capabilities described in the device handbook.

Key Features

  • Logic Capacity  Approximately 25,660 logic elements to implement large combinational and sequential logic functions.
  • Embedded Memory  Approximately 1.94 Mbits of on-chip RAM for buffering, FIFOs, and local data storage.
  • I/O Density  473 user I/O pins to support broad interfacing options with external peripherals and subsystems.
  • Power Supply  Core supply voltage range of 1.425 V to 1.575 V to match system power-rail design requirements.
  • Package & Mounting  672-BBGA package (supplier device package: 672-FBGA, 27×27) in a surface-mount form factor for compact board layouts.
  • Operating Range  Commercial grade operation from 0 °C to 85 °C suitable for standard embedded and commercial electronics.
  • Compliance  RoHS-compliant for environmentally responsible design and manufacturing.
  • Stratix Family Capabilities  As documented in the Stratix device handbook, the family provides architecture elements such as logic array blocks, embedded memory modes, PLLs and clock networks, DSP/multiplier resources, and advanced I/O structure for high-speed interfaces (refer to Stratix documentation for architectural details).

Typical Applications

  • High-Density Logic Integration  Implement glue logic, protocol conversion, and complex state machines where a large logic element count and many I/Os are required.
  • Embedded Memory Buffering  Use the on-chip RAM for frame buffering, packet buffering, and small data stores in communications and networking modules.
  • Signal Processing Acceleration  Leverage the Stratix architecture’s DSP and multiplier resources (as described in the family handbook) for math- and DSP-intensive tasks alongside configurable logic.
  • Custom Interface & Bridge Designs  Large I/O availability and flexible I/O structure make this device suitable for bridging between disparate buses and peripherals on modern PCBs.

Unique Advantages

  • High Logic Density:  ~25,660 logic elements provide the headroom to consolidate multiple discrete functions into a single programmable device, reducing BOM and board complexity.
  • Substantial On-Chip RAM:  Approximately 1.94 Mbits of embedded memory enables local buffering and state retention without immediate dependence on external memory.
  • Extensive I/O:  473 I/O pins allow direct connectivity to a wide range of peripherals and parallel interfaces, minimizing external interface logic.
  • Compact, Surface-Mount Package:  672-BBGA (672-FBGA 27×27) provides a high-pin-count solution in a compact footprint for dense PCB layouts.
  • Commercial-Grade Reliability:  Rated for 0 °C to 85 °C operation to suit mainstream embedded and commercial electronics use-cases.
  • RoHS Compliance:  Meets RoHS requirements to support environmentally compliant product designs.

Why Choose EP1S25F672C8?

The EP1S25F672C8 delivers a balanced combination of logic density, embedded memory, and I/O capacity in a compact 672-BBGA surface-mount package. It is well suited for engineers building commercial embedded systems that require extensive programmable logic, local memory, and broad external interfacing while maintaining compliance with RoHS.

Backed by the Stratix device family architecture and documentation, this FPGA is appropriate for teams needing scalable, programmable hardware building blocks and integration into existing design flows that leverage the family’s clocking, DSP, and I/O capabilities.

Request a quote or submit an inquiry to receive pricing, availability, and assistance for incorporating EP1S25F672C8 into your next design.

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