EP1S25F780C5

IC FPGA 597 I/O 780FBGA
Part Description

Stratix® Field Programmable Gate Array (FPGA) IC 597 1944576 25660 780-BBGA

Quantity 354 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package780-FBGA (29x29)GradeCommercialOperating Temperature0°C – 85°C
Package / Case780-BBGANumber of I/O597Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2566Number of Logic Elements/Cells25660
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits1944576

Overview of EP1S25F780C5 – Stratix FPGA, 25,660 logic elements, ~1.94 Mbits RAM, 597 I/Os, 780-BBGA

The EP1S25F780C5 is a Stratix® Field Programmable Gate Array (FPGA) IC from Intel, delivering a substantial pool of configurable logic and on-chip memory in a 780-ball BGA package. Built on the Stratix device architecture, this device targets designs that require dense logic resources, significant embedded RAM, flexible I/O, and advanced clocking and DSP support described in the Stratix device handbook.

This commercial-grade FPGA is suited for applications that need programmable system integration, multi-clock domains and high I/O counts while operating within a 0 °C to 85 °C temperature range and a core supply window of 1.425 V to 1.575 V.

Key Features

  • Core Logic 25,660 logic elements provide a large capacity for implementing custom digital logic, state machines and control functions.
  • Embedded Memory Approximately 1.94 Mbits of on-chip RAM support buffering, FIFOs and lookup tables, with Stratix memory modes and TriMatrix memory architecture referenced in the device handbook.
  • I/O Resources 597 user I/O pins accommodate wide parallel interfaces and large external connectivity requirements; the Stratix family documentation includes support for high-speed differential and DDR I/O modes.
  • Clocking and Timing Stratix PLLs and clock network capabilities (including enhanced and fast PLLs) enable complex clocking schemes and multi-clock domain designs.
  • DSP and Arithmetic Blocks Device-level support for multiplier blocks and DSP block interfaces provides building blocks for signal processing and arithmetic acceleration.
  • Configuration & Test Stratix family features such as IEEE 1149.1 JTAG boundary-scan and on-device logic analysis (SignalTap II) are described in the device handbook for configuration and debug workflows.
  • Power & Electrical Core supply voltage range is 1.425 V to 1.575 V, enabling integration into systems with tight supply specifications.
  • Package & Mounting 780-BBGA package (supplier device package: 780-FBGA, 29 × 29 mm) with surface-mount assembly for dense board-level integration.
  • Grade & Environmental Commercial grade device, RoHS compliant, with operating temperature from 0 °C to 85 °C.

Typical Applications

  • High-speed I/O interfaces — Use the high I/O count and Stratix I/O capabilities to implement interface bridging, parallel buses and DDR signaling.
  • Memory buffering and packet processing — Approximately 1.94 Mbits of embedded RAM and configurable memory modes support buffering, FIFO and packet buffering tasks.
  • DSP and algorithm acceleration — Multiplier and DSP block interfaces described for the Stratix family enable fixed-point and streaming signal-processing blocks.
  • System prototyping and integration — Large logic capacity and advanced clocking resources support complex custom logic, protocol consolidation and multi-clock designs.

Unique Advantages

  • High logic density: 25,660 logic elements provide the capacity to implement large, integrated digital functions on a single device, reducing BOM and board count.
  • Substantial embedded memory: Approximately 1.94 Mbits of on-chip RAM enables local buffering and memory-heavy functions without immediate external memory dependence.
  • Extensive I/O: 597 I/Os support broad connectivity for wide buses, parallel interfaces and multi-channel systems.
  • Family-level clocking and DSP support: Stratix device architecture includes PLLs, clock networks and DSP/multiplier blocks for implementing multi-clock and signal-processing systems.
  • Package integration: The 780-BBGA (780-FBGA, 29 × 29 mm) package provides a compact, surface-mount solution for dense PCB implementations.
  • Compliance and commercial readiness: RoHS compliant and specified for 0 °C to 85 °C operation to meet typical commercial deployment requirements.

Why Choose EP1S25F780C5?

The EP1S25F780C5 combines a high count of logic elements, meaningful on-chip RAM and a very large I/O complement in a single commercial-grade Stratix FPGA. Its specification set—core voltage range, package format and documented Stratix architecture features such as PLLs, DSP blocks and advanced I/O—makes it a practical choice for designers consolidating complex digital functions and high-bandwidth interfaces onto one programmable device.

This device is well suited to teams building high-density digital systems, memory-buffering engines, protocol bridges and signal-processing blocks who need a configurable platform with established family-level architecture and tooling described in the Stratix device handbook.

Request a quote or submit an inquiry to evaluate EP1S25F780C5 for your next design and to receive availability and pricing information.

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