EP1S25F780C7

The EP1S25F780C7 is a Stratix® family FPGA from Intel, delivered in a 780-BBGA surface-mount package (supplier package: 780-FBGA, 29×29). It integrates 25,660 logic elements across 2,566 LABs, approximately 1.94 Mbits of embedded RAM, and a high-density I/O count of 597 signal pins.

This device targets high-density digital designs that require substantial logic capacity, on-chip memory, and large I/O pin counts. It operates from a core supply range of 1.425 V to 1.575 V and is rated for commercial temperature operation (0 °C to 85 °C), with RoHS compliance for lead-free assembly.

Key Features

• Core Logic  25,660 logic elements distributed across 2,566 LABs, providing substantial programmable fabric for custom digital logic and control.
• Embedded Memory  Approximately 1.94 Mbits of on-chip RAM to support buffering, FIFOs, and local storage without external memory.
• I/O Capacity  597 I/O pins enable multi-channel interfaces and dense external connectivity directly from the device.
• Package & Mounting  780-BBGA package (supplier package: 780-FBGA, 29×29) designed for surface-mount PCB assembly and compact system integration.
• Power Supply  Core voltage supply specified at 1.425 V to 1.575 V for defined power and timing characteristics.
• Operating Conditions  Commercial grade operation over 0 °C to 85 °C for standard embedded and commercial systems.
• Environmental Compliance  RoHS compliant to support lead-free manufacturing workflows.

Typical Applications

• High-density digital systems  Deploy the FPGA’s 25,660 logic elements and embedded RAM to implement complex custom logic, protocol handling, or control functions.
• Multi-channel I/O interfaces  Use the 597 I/Os for aggregating or bridging large numbers of parallel or serialized signals without external I/O expanders.
• Memory-centric logic  Leverage approximately 1.94 Mbits of on-chip RAM for packet buffering, FIFO staging, and other embedded storage needs.
• Compact board-level integration  The 780-BBGA (29×29) package and surface-mount mounting enable dense PCB layouts where board space is at a premium.

Unique Advantages

• High logic density: 25,660 logic elements provide the capacity to implement sizeable custom logic blocks and complex state machines in a single device.
• Large on-chip memory: Approximately 1.94 Mbits of embedded RAM reduces reliance on external memory for many buffering and local storage tasks.
• Extensive I/O count: 597 I/Os simplify system design when interfacing multiple peripherals, sensors, or parallel data lanes.
• Compact BGA package: The 780-BBGA (29×29) footprint balances I/O density and board integration for space-constrained systems.
• Defined power envelope: Core supply range of 1.425 V–1.575 V supports predictable power delivery and timing analysis.
• Commercial deployment: Rated for 0 °C to 85 °C operation and RoHS compliant for standard commercial product lifecycles.

Why Choose EP1S25F780C7?

EP1S25F780C7 is positioned for designers who need substantial programmable logic, on-chip memory, and a high I/O count in a single Stratix FPGA package. Its combination of 25,660 logic elements, approximately 1.94 Mbits of embedded RAM, and 597 I/Os enables consolidated implementations that reduce external components and simplify board-level architecture.

Backed by the Stratix device documentation, this Intel FPGA suits teams developing complex digital systems where integration density, predictable power requirements, and commercial-grade operation are priorities. It delivers a scalable platform while maintaining the assembly and environmental compliance required for standard commercial products.

Request a quote or submit an inquiry for EP1S25F780C7 to get pricing and availability details for your design.