EP1S25F672C6
| Part Description |
Stratix® Field Programmable Gate Array (FPGA) IC 473 1944576 25660 672-BBGA |
|---|---|
| Quantity | 39 Available (as of May 4, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 672-FBGA (27x27) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 672-BBGA | Number of I/O | 473 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2566 | Number of Logic Elements/Cells | 25660 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1944576 |
Overview of EP1S25F672C6 – Stratix® FPGA, 25,660 logic elements, approximately 1.94 Mbits RAM, 672-BBGA
The EP1S25F672C6 is an Intel Stratix® Field Programmable Gate Array (FPGA) supplied in a 672-BBGA package. It provides a scalable Stratix architecture with a large logic fabric, embedded memory, and high I/O density targeted for commercial applications requiring programmable digital logic and on-chip resources.
Typical use cases include high-density digital processing, external memory interfacing and high-speed I/O designs where integration of logic, memory and I/O in a compact surface-mount package reduces board complexity and BOM count.
Key Features
- Logic Capacity 25,660 logic elements (LEs) suitable for implementing complex digital functions and custom logic blocks.
- Embedded Memory Approximately 1.94 Mbits of on-chip RAM to support buffers, FIFOs, and local data storage.
- I/O Density 473 I/O pins to support broad external interfacing and high-pin-count systems.
- Package & Mounting 672-BBGA package (supplier package: 672-FBGA, 27×27) designed for surface-mount assembly to save board area.
- Voltage & Power Core supply range of 1.425 V to 1.575 V to match system power domains.
- Operating Grade & Temperature Commercial grade, rated for operation from 0 °C to 85 °C.
- Standards & Compliance RoHS compliant for regulatory and environmental alignment.
- Stratix Family Architecture (series-level) Device documentation for the Stratix family describes logic array blocks, embedded memory modes, PLLs and clock networks, DSP/multiplier resources, and advanced I/O features that apply across the family.
Typical Applications
- High-density digital processing Implement custom datapaths, control logic and protocol processing using a large number of logic elements and on-chip RAM.
- High-speed I/O systems Support designs requiring substantial external interfacing and pin counts with 473 I/Os in a compact package.
- Memory interface and buffering Use the on-chip RAM for buffering, FIFOs and local data storage in systems that interface with external RAM or streaming data sources.
- Prototyping and evaluation Develop and validate complex logic and system-level functions on a commercial-grade Stratix device backed by Stratix device documentation.
Unique Advantages
- Significant logic resources: 25,660 logic elements provide capacity for sizeable custom logic implementations without partitioning across multiple devices.
- Substantial on-chip memory: Approximately 1.94 Mbits of embedded RAM reduces reliance on external memory for intermediate storage and buffering.
- High I/O count in a compact footprint: 473 I/Os in a 672-BBGA (27×27) package allow dense external connectivity while conserving PCB area.
- Commercial operating range: Rated for 0 °C to 85 °C, suitable for a wide range of commercial deployments.
- Controlled core supply: Defined voltage supply range (1.425 V to 1.575 V) simplifies power sequencing and integration with system rails.
- RoHS compliance: Matches environmental and regulatory requirements for lead-free manufacturing.
Why Choose EP1S25F672C6?
The EP1S25F672C6 combines a large logic element count, meaningful embedded memory and a high I/O complement in a compact 672-BBGA surface-mount package, making it a practical choice for commercial systems that demand integrated programmable logic and on-chip resources. Its voltage and thermal ratings align with typical commercial system designs, and the device benefits from the Stratix family documentation and development ecosystem.
This part is well suited to engineers and design teams seeking a single-device solution to consolidate logic, buffering and I/O tasks, offering scalability for moderately complex designs and straightforward integration into surface-mount production flows.
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