EP1S25F1020C6N

The EP1S25F1020C6N is an Intel Stratix® Field Programmable Gate Array (FPGA) supplied in a 1020-BBGA package. It integrates 25,660 logic elements and approximately 1.94 Mbits of on-chip RAM to support complex digital logic, memory buffering, and embedded processing functions.

With 706 user I/Os, a supplier device package of 1020-FBGA (33×33), and an operating voltage range of 1.425 V to 1.575 V, this commercial-grade Stratix device targets applications that require dense programmable logic, significant embedded memory, and a large number of I/O connections within a surface-mount BGA footprint.

Key Features

• Programmable Logic Capacity — 25,660 logic elements to implement complex digital functions and custom processing pipelines.
• Embedded Memory — Approximately 1.94 Mbits of on-chip RAM for buffering, packet storage, and local data retention.
• I/O Density — 706 user I/O pins to support wide parallel interfaces and multiple external connections.
• Package & Mounting — 1020-BBGA package (supplier package: 1020-FBGA, 33×33) with surface-mount mounting suitable for compact board designs.
• Power Supply — Core supply range between 1.425 V and 1.575 V for system power planning and regulator selection.
• Operating Temperature & Grade — Commercial grade with an operating temperature range of 0°C to 85°C for general-purpose electronic systems.
• Standards Compliance — RoHS-compliant material status for environmental and regulatory alignment.
• Architectural Foundation — Stratix family device architecture and supporting design documentation for advanced logic, memory, PLLs, and I/O capabilities as described in the Stratix Device Handbook.

Typical Applications

• High-speed I/O subsystem — Use the device’s 706 I/Os for external memory interfaces and wide parallel or multi-channel I/O paths.
• DSP and signal processing — Leverage the device’s logic density and on-chip RAM for implementing DSP pipelines and intermediate buffering.
• Custom protocol bridging — Implement protocol translation, aggregation, or custom logic between multiple peripheral and system interfaces.
• Embedded logic for communications equipment — Deploy programmable logic and memory for packet processing, framing, and timing functions in communications devices.

Unique Advantages

• Substantial logic resources: 25,660 logic elements allow consolidation of multiple functions into a single FPGA, reducing BOM and board complexity.
• Significant on-chip memory: Approximately 1.94 Mbits of embedded RAM supports local data buffering and memory-intensive logic without immediate reliance on external DRAM.
• High I/O count: 706 user I/Os enable flexible interfacing with peripherals, parallel buses, and external memory devices.
• Compact BGA footprint: 1020-BBGA (1020-FBGA, 33×33) provides a high-density package option for space-constrained boards while retaining many I/Os.
• Commercial temperature range: Rated 0°C to 85°C for general embedded and industrial-adjacent applications where commercial-grade operation is appropriate.
• RoHS compliance: Meets common environmental material requirements, simplifying regulatory considerations.

Why Choose EP1S25F1020C6N?

The EP1S25F1020C6N delivers a balanced combination of programmable logic, embedded memory, and extensive I/O in a surface-mount BGA package. Its Stratix architecture and documented feature set make it suitable for designers who need to implement complex custom logic, buffer and process data on-chip, and connect to many external interfaces within a compact board area.

This device is a practical choice for engineering teams building communication subsystems, signal-processing modules, or high-density interface controllers that require on-chip memory and significant logic resources backed by vendor documentation for implementation and testing.

Request a quote or submit a procurement inquiry to obtain pricing, availability, and ordering information for the EP1S25F1020C6N.