EP1S25B672C7

The EP1S25B672C7 is a Stratix® family FPGA from Intel providing a programmable logic platform with 25,660 logic elements and approximately 1.94 Mbits of on-chip RAM. Packaged in a 672-ball BGA (35×35) with 473 I/O, this commercial-grade device is built for designs that require substantial logic density, embedded memory, and a high I/O count.

This device operates from a 1.425 V to 1.575 V core supply and a commercial operating temperature range of 0 °C to 85 °C, and is RoHS compliant. Documentation for the Stratix device family details architecture elements such as logic array blocks, PLLs, clock networks, DSP interfaces, and configuration/test features.

Key Features

• Core Logic  25,660 logic elements organized across 2,566 logic array blocks (LABs), suitable for high-density programmable logic implementations.
• Embedded Memory  Approximately 1.94 Mbits of on-chip RAM for data buffering, state storage, and memory-mapped logic functions.
• I/O Capacity  473 user I/O pins to support complex, high-pin-count interfaces and board-level connectivity.
• Package & Mounting  672-BBGA (672-BGA, 35×35) surface-mount package for compact board integration with high I/O density.
• Power  Core supply voltage range of 1.425 V to 1.575 V to match system power rails and design constraints.
• Operating Conditions & Grade  Commercial grade device specified for 0 °C to 85 °C operation; RoHS compliant.
• Configuration & Test  Stratix family documentation includes support for IEEE 1149.1 (JTAG) boundary-scan, configuration schemes, partial reconfiguration, and embedded logic analysis capabilities.
• Clocking and DSP Support  Device family features extensive PLLs, clock networks, and DSP block interfaces as described in the Stratix handbook.

Typical Applications

• High-density digital systems  Use the EP1S25B672C7 where large amounts of programmable logic and on-chip RAM are required to implement complex digital functions.
• Interface-intensive designs  Leverage 473 I/O pins for multi-channel connectivity, high-pin-count peripherals, and board-level interface consolidation.
• Custom compute and acceleration  Implement algorithm-specific datapaths and DSP interfaces using the device’s logic resources and DSP block architecture.
• Prototyping and development  Employ the Stratix device’s configuration and boundary-scan features for iterative hardware development and in-system testing.

Unique Advantages

• High logic capacity: 25,660 logic elements provide substantial programmable resources to integrate multiple functions on a single device and reduce BOM count.
• Substantial on-chip memory: Approximately 1.94 Mbits of embedded RAM minimizes external memory needs for buffering and state storage.
• Large I/O complement: 473 I/O pins allow flexible system interfacing and reduce the need for external I/O expanders.
• Compact high-density package: 672-BBGA (35×35) offers a space-efficient footprint for high-pin-count designs.
• Design and test features: Stratix family support for JTAG, configuration schemes, and embedded analysis aids development, validation, and field updates.
• Standards-compliant and regulatory-ready: RoHS compliance supports regulatory requirements for lead-free production.

Why Choose EP1S25B672C7?

The EP1S25B672C7 delivers a balanced combination of logic density, embedded memory, and I/O capacity in a commercial-grade Stratix FPGA package. Its specification set—25,660 logic elements, ~1.94 Mbits of RAM, 473 I/O, and a 672-BBGA package—targets designs that require considerable on-chip resources while maintaining a compact board footprint.

This device is well suited to engineering and procurement teams seeking a programmable platform from the Stratix family with documented architecture for clocking, DSP interfaces, configuration, and test. Its RoHS compliance and defined operating conditions provide clear parameters for system integration and lifecycle planning.

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