EP1S25F1020C6

IC FPGA 706 I/O 1020FBGA
Part Description

Stratix® Field Programmable Gate Array (FPGA) IC 706 1944576 25660 1020-BBGA

Quantity 657 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1020-FBGA (33x33)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1020-BBGANumber of I/O706Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2566Number of Logic Elements/Cells25660
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits1944576

Overview of EP1S25F1020C6 – Stratix® FPGA — 25,660 logic elements, approximately 1.94 Mbits RAM, 706 I/Os, 1020-BBGA

The EP1S25F1020C6 is an Intel Stratix® field programmable gate array (FPGA) in a 1020-BBGA (1020-FBGA, 33×33) package, offered as a commercial-grade, surface-mount device. It combines a substantial logic fabric with on-chip embedded memory and a high I/O count to address complex digital designs.

Designed for applications that require integrated logic, memory and advanced I/O, this Stratix device delivers architectural capabilities documented in the Stratix Device Handbook, including programmable logic elements, memory modes, DSP/multiplier blocks, and advanced clocking resources.

Key Features

  • Logic Capacity — 25,660 logic elements provide the programmable fabric for implementing custom datapaths, control logic, and glue logic within a single device.
  • Embedded Memory — Approximately 1.94 Mbits of on-chip RAM support large buffering, FIFOs, and on-chip data storage; the datasheet references TriMatrix memory and multiple memory modes for flexible memory architectures.
  • I/O Density — 706 programmable I/O pins enable high pin-count system integration, supporting extensive external interfacing and parallel connectivity.
  • DSP and Multiplier Resources — The Stratix architecture documentation includes dedicated multiplier/DSP block interfaces and multiplier blocks for signal-processing and arithmetic-intensive workloads.
  • Clocking and PLLs — The device family material covers enhanced and fast PLLs, global and hierarchical clocking networks to support complex clocking schemes and multiple clock domains.
  • Package & Mounting — 1020-BBGA (supplier device package: 1020-FBGA, 33×33) in a surface-mount format for PCB assembly in space-constrained systems.
  • Power Supply — Core voltage range specified at 1.425 V to 1.575 V to match targeted system power rails.
  • Operating Range & Compliance — Commercial-grade operation from 0 °C to 85 °C and RoHS compliant.

Typical Applications

  • High-speed communications — Use the device’s high I/O count and Stratix I/O structure for protocol bridging, packet processing, and interface aggregation.
  • Signal processing and DSP — Dedicated multiplier and DSP block resources support filtering, FFTs, and other arithmetic-heavy functions.
  • Embedded system integration — Large on-chip RAM and plentiful logic elements enable centralized glue logic, buffering, and local control functions.
  • Prototyping and evaluation — The Stratix architecture and documented configuration/testing features in the device handbook facilitate design validation and iterative development.

Unique Advantages

  • Substantial programmable logic: 25,660 logic elements enable consolidation of multiple functions into a single FPGA, reducing board-level component count.
  • Significant on-chip memory: Approximately 1.94 Mbits of embedded RAM supports large buffers and data staging without immediate external memory dependence.
  • High I/O integration: 706 I/O pins allow flexible external interfacing for multi-channel systems or dense connector implementations.
  • Architectural building blocks: Documented Stratix features such as TriMatrix memory, multiplier/DSP blocks, and advanced PLLs provide proven building blocks for complex designs.
  • Commercial-grade readiness: Specified for 0 °C to 85 °C operation and RoHS compliance for standard commercial applications.
  • Compact BGA package: 1020-BBGA (33×33) balances pin density and PCB area for space-conscious designs.

Why Choose EP1S25F1020C6?

EP1S25F1020C6 positions itself as a capable Stratix FPGA option for designers needing a mid-to-high density programmable device with integrated memory and extensive I/O. Its combination of 25,660 logic elements, approximately 1.94 Mbits of RAM, DSP/multiplier resources, and advanced clocking elements offers a balanced platform for communications, signal processing, and embedded system integration.

For teams seeking a commercial-grade, RoHS-compliant Stratix device in a compact 1020-BBGA package, this part delivers documented architectural support and on-chip resources that simplify system design and help consolidate multiple functions onto a single FPGA.

Request a quote or submit a quote for EP1S25F1020C6 to receive pricing and availability information for your next design cycle.

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