EP1S25F1020C5N

IC FPGA 706 I/O 1020FBGA
Part Description

Stratix® Field Programmable Gate Array (FPGA) IC 706 1944576 25660 1020-BBGA

Quantity 1,867 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1020-FBGA (33x33)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1020-BBGANumber of I/O706Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2566Number of Logic Elements/Cells25660
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits1944576

Overview of EP1S25F1020C5N – Stratix Field Programmable Gate Array (FPGA) 1020-BBGA

The EP1S25F1020C5N is a Stratix-series FPGA in a 1020-BBGA (33×33) surface-mount package from Intel. It provides a high-density programmable logic fabric with 25,660 logic elements and approximately 1.94 Mbits of embedded memory, making it suitable for commercial electronic designs that require sizable on-chip logic and memory resources.

Designed within the Stratix device family, this device offers a large I/O count and programmable supply range to support complex system integration while operating across a commercial temperature range.

Key Features

  • Logic Capacity  25,660 logic elements for implementing complex combinational and sequential logic.
  • Embedded Memory  Approximately 1.94 Mbits of on-chip RAM for buffering, state storage, and LUT-based structures.
  • High I/O Count  706 I/O pins to support extensive external interfaces and parallel connectivity.
  • Power Supply  Core supply range from 1.425 V to 1.575 V for device power planning and system integration.
  • Package & Mounting  1020-BBGA (supplier package listed as 1020-FBGA, 33×33) surface-mount package for dense board-level integration.
  • Operating Grade & Temperature  Commercial-grade device specified for 0 °C to 85 °C operation.
  • Stratix Family Architecture (per device handbook)  Family-level features documented in the Stratix Device Handbook include programmable clocking (PLLs & clock networks), a dedicated DSP block interface, flexible memory modes, and an advanced I/O structure to support differential and high-speed I/O standards.
  • Compliance  RoHS compliant.

Typical Applications

  • High-density digital systems  Use the device’s 25,660 logic elements to implement complex control, datapath, and protocol logic in compact designs.
  • On-chip buffering and state storage  Leverage approximately 1.94 Mbits of embedded RAM for FIFOs, packet buffers, and temporary data storage.
  • Multi-interface platforms  Utilize the 706 I/Os to connect multiple external devices, sensors, or buses in systems requiring broad I/O flexibility.
  • Commercial embedded designs  Suitable for a range of commercial applications operating within a 0 °C to 85 °C range where high logic density and substantial I/O are required.

Unique Advantages

  • High logic density: 25,660 logic elements reduce the need for multiple devices and simplify partitioning of complex logic functions.
  • Substantial on-chip memory: Approximately 1.94 Mbits of embedded RAM supports local buffering and state machines without immediate reliance on external memory.
  • Broad I/O capability: 706 I/Os enable flexible connectivity and support for multiple parallel interfaces on a single device.
  • Stratix family features: Architectural elements described in the Stratix Device Handbook—such as PLLs, DSP block interfaces, and advanced I/O structure—provide system-level building blocks for timing, signal processing, and interface integration.
  • Commercial-grade suitability: Rated for 0 °C to 85 °C operation, matching common commercial product environments.
  • RoHS compliance: Aligns with common environmental and manufacturing requirements.

Why Choose EP1S25F1020C5N?

The EP1S25F1020C5N positions itself as a high-density Stratix FPGA option for commercial designs that require a balance of sizable logic resources, on-chip memory, and extensive I/O. Its placement in the Stratix family means designers can reference the device handbook for family-level architecture details—PLLs, memory modes, DSP interfaces, and advanced I/O structures—when planning system integration.

This device is suited to engineering teams looking to consolidate logic, memory, and I/O into a single programmable device while adhering to commercial temperature and RoHS requirements. Its package and power specifications support compact board layouts and predictable power planning for production designs.

Request a quote or submit an inquiry for pricing and availability to evaluate EP1S25F1020C5N for your next commercial FPGA design.

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