EP1S25F1020I6

The EP1S25F1020I6 is a Stratix® family Field Programmable Gate Array (FPGA) offered in a 1020-ball BGA package. It delivers a high-density programmable fabric with 25,660 logic elements and abundant I/O for complex custom digital designs.

Designed for industrial applications, this device provides approximately 1.94 Mbits of embedded memory, up to 706 I/O pins, and supports a core supply window of 1.425 V to 1.575 V. Its specified operating range of −40 °C to 100 °C and RoHS compliance make it suitable for temperature-challenging, environmentally conscious designs.

Key Features

• Core Logic Capacity 25,660 logic elements for implementing wide-ranging combinational and sequential logic functions.
• Embedded Memory Approximately 1.94 Mbits of on-chip RAM to support buffers, FIFOs, and local data storage.
• I/O Resources Up to 706 user I/O pins to interface with dense peripheral, sensor, or bus topologies.
• Package & Mounting 1020-ball BBGA (supplier package listed as 1020-FBGA, 33 × 33) in a surface-mount form factor for compact, high-density boards.
• Power Supply Core voltage supply specified between 1.425 V and 1.575 V for predictable power provisioning.
• Operating Temperature Industrial operating range from −40 °C to 100 °C for deployment in temperature-demanding environments.
• Regulatory Compliance RoHS-compliant material declarations to meet modern environmental requirements.

Typical Applications

• Industrial Control Systems — Implement custom control logic, motor interfacing, and I/O aggregation using the device’s industrial temperature rating and extensive I/O count.
• Communications & Networking — Use the high logic density and on-chip memory for protocol processing, packet buffering, and custom transceiver logic.
• Test & Measurement Equipment — Leverage abundant I/Os and embedded RAM for data acquisition, real-time processing, and instrumentation control.

Unique Advantages

• High Logic Density: 25,660 logic elements provide the capacity to consolidate multiple functions into a single programmable device, reducing system complexity.
• Significant On-Chip Memory: Approximately 1.94 Mbits of embedded RAM enables local data storage for buffering and low-latency data paths.
• Extensive I/O Count: Up to 706 I/O pins support dense peripheral connectivity and flexible board-level partitioning.
• Industrial Temperature Range: Rated from −40 °C to 100 °C to support deployments in harsh or temperature-variable environments.
• Compact BGA Package: 1020-ball BBGA (1020-FBGA, 33 × 33) enables high-density PCB layouts while maintaining surface-mount assembly compatibility.
• Defined Core Supply Window: Tight 1.425 V to 1.575 V core-voltage specification simplifies power supply design and margining.

Why Choose EP1S25F1020I6?

The EP1S25F1020I6 positions itself as a high-density Stratix FPGA suited to industrial applications that require significant programmable logic, embedded memory, and a large number of I/Os. Its combination of 25,660 logic elements, roughly 1.94 Mbits of on-chip RAM, and up to 706 I/Os makes it appropriate for consolidating complex digital functions onto a single device.

With an industrial temperature rating, RoHS compliance, and a compact 1020-ball BGA package, this device offers a balance of performance, integration, and manufacturability for engineering teams building robust, environmentally compliant systems.

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