EP1S20F780I6

The EP1S20F780I6 is an Intel Stratix® family FPGA providing a high-density, industrial-grade programmable logic platform. The device combines 18,460 logic elements with abundant on-chip memory and I/O to support complex, performance-oriented designs.

Designed for industrial applications, this FCBGA package offers extensive I/O (586 pins), a tight core voltage range (1.425 V–1.575 V), and an extended operating temperature range (−40 °C to 100 °C), making it suitable for demanding embedded, communications, and control systems that require robust, reprogrammable logic.

Key Features

• Logic Density  18,460 logic elements provide significant capacity for custom hardware acceleration, protocol implementation, and complex state machines.
• Embedded Memory  Approximately 1.67 Mbits of on-chip RAM (1,669,248 bits) for FIFOs, buffers, and local data storage supporting high-throughput designs.
• High I/O Count  586 I/O pins enable wide parallel interfaces, multi-channel data paths, and rich peripheral connectivity.
• Industrial Grade  Industrial grade specification with an operating temperature range from −40 °C to 100 °C for reliable operation in harsh environments.
• Package & Mounting  780-ball BGA package (780-FBGA, 29×29) in a surface-mount form factor for dense PCB implementations.
• Power Supply  Defined core voltage window of 1.425 V to 1.575 V for predictable power sequencing and supply planning.
• RoHS Compliant  Meets RoHS requirements for environmental compliance.
• Stratix Architecture Features  As a Stratix family device, the part leverages documented Stratix architecture resources—including advanced clocking, PLL support, DSP interfaces, and rich I/O structure—documented in the Stratix device handbook.

Typical Applications

• Industrial Control  Implementation of motor control, state machines, and real-time control logic using robust logic capacity and extended temperature rating.
• Communications & Networking  Wide I/O and substantial on-chip RAM allow packet buffering and custom protocol handling in networking modules and interface bridges.
• Embedded Signal Processing  Custom accelerators and preprocessing pipelines leveraging the device’s logic density and embedded memory for moderate DSP workloads.
• High-Density I/O Systems  Systems requiring many parallel interfaces, wide buses, or multiple peripheral channels benefit from the 586 I/O pins.

Unique Advantages

• High logic capacity: 18,460 logic elements enable complex designs without immediate migration to higher-tier devices.
• Substantial on-chip memory: Approximately 1.67 Mbits of embedded RAM reduces dependence on external memory for buffering and local data storage.
• Extensive I/O integration: 586 I/O pins simplify board-level connectivity and reduce the need for external I/O expanders.
• Industrial robustness: Specified for −40 °C to 100 °C operation to support deployment in temperature-sensitive environments.
• Predictable power envelope: Narrow core voltage specification (1.425 V–1.575 V) aids in power-supply design and sequencing.
• Packaged for dense layouts: 780-ball FCBGA (29×29) provides a compact footprint for space-constrained PCBs.

Why Choose EP1S20F780I6?

The EP1S20F780I6 balances logic capacity, embedded memory, and a large I/O complement within an industrial-grade Stratix FPGA package. It is well-suited for engineers designing mid-to-high complexity applications that require reprogrammable logic, substantial on-chip RAM, and reliable operation across an extended temperature range.

With documented Stratix architecture features and compliance to RoHS, the EP1S20F780I6 delivers a scalable platform for industrial control, communications, and embedded processing projects where integration density and deterministic power requirements matter.

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