EP1S20F780C7

The EP1S20F780C7 is a Stratix® FPGA from Intel, delivering a high-density programmable logic solution within the Stratix device family. It provides 18,460 logic elements, approximately 1.67 Mbits of embedded memory, and a 586-pin I/O footprint in a 780-BBGA (FCBGA) package.

Designed for commercial-grade applications, this surface-mount FPGA operates from a core supply range of 1.425 V to 1.575 V and is specified for operation from 0 °C to 85 °C. The device is RoHS compliant and includes Stratix family features such as advanced clocking, memory modes, and on-chip DSP/multiplier resources referenced in the device handbook.

Key Features

• Logic Capacity  18,460 logic elements provide the programmable fabric required for mid-to-high complexity logic implementations.
• Embedded Memory  Approximately 1.67 Mbits of on-chip RAM to support buffering, FIFOs, and small memory structures within your design.
• High I/O Count  586 I/Os enable extensive board-level connectivity and support for multiple external interfaces.
• Package & Mounting  780-BBGA (FCBGA) package, supplier package 780-FBGA (29×29), in a surface-mount form factor for standard PCB assembly.
• Power Supply  Core voltage range of 1.425 V to 1.575 V for integration with typical FPGA power architectures.
• Commercial Temperature Range  Rated for 0 °C to 85 °C operation for commercial-grade system deployments.
• Stratix Family Functionality  Device handbook references include logic array blocks, PLLs and clock networks, memory modes, multiplier/DSP blocks, and advanced I/O structures such as double-data-rate support and external RAM interfacing.
• Configuration & Test  Stratix family documentation lists configuration options, JTAG boundary-scan support, and embedded logic analysis capabilities for in-system test and debug.
• Standards & Compliance  RoHS compliant to support regulatory requirements for lead-free assemblies.

Typical Applications

• High‑speed I/O systems  Use the device's 586 I/Os and Stratix I/O capability for designs requiring multiple external interfaces and DDR-style memory connections.
• DSP and signal processing  Leverage on‑chip multiplier/DSP resources referenced in the Stratix handbook for acceleration of arithmetic and filtering operations.
• Embedded logic and glue‑logic  18,460 logic elements and on-chip RAM enable complex control, protocol bridging, and custom logic integration at board level.
• Configuration and prototyping  JTAG and configuration modes described in the Stratix documentation make the device suitable for development, debug, and in-field update scenarios.

Unique Advantages

• High logic density: 18,460 logic elements accommodate substantial custom logic and state-machine implementations without external CPLDs.
• Significant embedded memory: Approximately 1.67 Mbits of on-chip RAM reduces dependence on external memory for buffering and small data stores.
• Extensive I/O integration: 586 I/Os simplify system integration by supporting multiple parallel interfaces and diverse signaling requirements.
• Comprehensive Stratix feature set: Family-level features such as PLLs, clock networks, DSP blocks, and advanced I/O modes (as documented in the device handbook) enable a broad range of system designs.
• Commercial-grade readiness: Specified 0 °C to 85 °C operating range and RoHS compliance support mainstream electronics manufacturing and deployment.
• Board-level packaging: 780-BBGA (FCBGA) surface-mount package provides a compact footprint for high-density PCB layouts.

Why Choose EP1S20F780C7?

The EP1S20F780C7 positions itself as a capable Stratix family FPGA that balances logic capacity, embedded memory, and high I/O count for commercial applications. Its documented Stratix features—clocking resources, memory modes, DSP/multiplier blocks, and configuration/test capabilities—support complex designs that require on-chip processing and extensive interfacing.

This device is suited to teams and projects that require a programmable platform with measurable resources (18,460 logic elements, ~1.67 Mbits RAM, 586 I/Os), a 780‑ball BGA footprint, and operation within standard commercial temperature and voltage envelopes. The Stratix device handbook content provides detailed architectural and timing guidance to support design and verification activities.

If you would like pricing, availability, or a formal quote for EP1S20F780C7, please request a quote or submit a procurement inquiry and our team will respond with the next steps.