EP1S20F780C5N

IC FPGA 586 I/O 780FBGA
Part Description

Stratix® Field Programmable Gate Array (FPGA) IC 586 1669248 18460 780-BBGA, FCBGA

Quantity 1,199 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package780-FBGA (29x29)GradeCommercialOperating Temperature0°C – 85°C
Package / Case780-BBGA, FCBGANumber of I/O586Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1846Number of Logic Elements/Cells18460
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits1669248

Overview of EP1S20F780C5N – Stratix® Field Programmable Gate Array (FPGA)

The EP1S20F780C5N is a Stratix® family FPGA from Intel, delivered in a 780‑FBGA (29×29) surface‑mount package. It combines substantial logic capacity with embedded memory and a high I/O count to address complex programmable logic designs in commercial applications.

With 18,460 logic elements, approximately 1.67 Mbits of embedded RAM, and 586 I/O pins, this device is suited for designs that require dense logic, significant on‑chip storage, and extensive interfacing while operating from a core supply between 1.425 V and 1.575 V and within a 0 °C to 85 °C commercial temperature range.

Key Features

  • Logic Capacity  18,460 logic elements for implementing medium‑to‑large custom logic functions and control algorithms.
  • Embedded Memory  Approximately 1.67 Mbits of on‑chip RAM, supporting system buffering, packet storage, and table lookups.
  • I/O Density  586 I/O pins to support broad parallel interfaces, multi‑lane buses, and extensive peripheral connectivity.
  • Clocking & DSP Resources  Stratix family features such as PLLs and dedicated multiplier/DSP blocks (as documented in the Stratix Device Handbook) provide flexible clock management and arithmetic acceleration.
  • High‑Performance I/O  I/O architecture includes support for Double‑Data‑Rate I/O pins and advanced I/O standards referenced in the device family documentation.
  • Configuration & Debug  Device family support for JTAG boundary‑scan, SignalTap II embedded logic analysis, multiple configuration schemes, and partial/remote reconfiguration options is documented in the Stratix handbook.
  • Package & Supply  780‑FBGA (29×29) FCBGA package for compact board integration; surface‑mount mounting and a core voltage range of 1.425 V to 1.575 V.
  • Commercial Grade & Compliance  Commercial operating range (0 °C to 85 °C) and RoHS compliance.

Typical Applications

  • Network & Communications  Use the device’s high I/O count, PLLs, and on‑chip memory for interface bridging, packet buffering, and custom packet processing functions.
  • Signal Processing & DSP  Implement filtering, transforms, and accelerated arithmetic using the family’s multiplier/DSP resources and embedded memory for intermediate storage.
  • System Integration & Prototyping  Leverage the device’s logic density and flexible I/O to prototype complex SoC‑style functions or integrate multiple subsystems onto a single programmable device.
  • Embedded Control & I/O Expansion  Provide glue logic, protocol conversion, and large parallel interface support for advanced embedded systems and instrumentation.

Unique Advantages

  • High logic density: 18,460 logic elements enable compact implementation of sophisticated control and processing functions, reducing the need for multiple discrete ICs.
  • Significant on‑chip memory: Approximately 1.67 Mbits of embedded RAM supports buffering, lookup tables, and data staging with minimal external memory dependency.
  • Extensive I/O: 586 I/O pins provide flexibility for multi‑lane interfaces and numerous peripheral connections without board‑level multiplexing compromises.
  • Flexible clocking and DSP support: Family features such as PLLs and dedicated DSP/multiplier blocks facilitate deterministic timing and efficient numeric processing.
  • Compact FCBGA package: 780‑FBGA (29×29) delivers a high pin‑count solution in a space‑efficient surface‑mount form factor.
  • Documented configuration & debug capabilities: Family documentation details JTAG, SignalTap II, partial reconfiguration, and remote update modes to streamline development and in‑field updates.

Why Choose EP1S20F780C5N?

The EP1S20F780C5N positions itself as a versatile Stratix FPGA option for commercial designs that demand a balance of logic capacity, on‑chip memory, and broad I/O connectivity. Its supported clocking, DSP resources, and configuration/debug capabilities—described in the Stratix Device Handbook—make it suitable for system integration, signal processing, and communication applications where board space and integration matter.

Choose this device when your design requires a programmable platform with substantial embedded RAM, nearly 18.5k logic elements, and hundreds of I/Os in a 780‑FBGA package, backed by Intel/Stratix family documentation for development and deployment.

Request a quote or submit an inquiry to receive pricing and availability information for EP1S20F780C5N.

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