EP1S20F672I7N

IC FPGA 426 I/O 672FBGA
Part Description

Stratix® Field Programmable Gate Array (FPGA) IC 426 1669248 18460 672-BBGA

Quantity 106 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package672-FBGA (27x27)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case672-BBGANumber of I/O426Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1846Number of Logic Elements/Cells18460
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits1669248

Overview of EP1S20F672I7N – Stratix Field Programmable Gate Array (FPGA), 672-BBGA

The EP1S20F672I7N is a Stratix® FPGA in a 672-ball BGA package designed for industrial applications requiring reconfigurable logic and substantial on-chip resources. Its architecture delivers a balance of logic density, embedded memory, and I/O capacity suitable for demanding system designs that must operate across a wide temperature range.

With 18,460 logic elements, approximately 1.67 Mbits of embedded memory, and 426 I/Os, this device targets designs that need high integration, flexible I/O, and on-chip memory for buffering, protocol handling, and custom processing.

Key Features

  • Core Logic  18,460 logic elements provide programmable capacity for implementing complex digital logic and state machines.
  • Embedded Memory  Approximately 1.67 Mbits of on-chip RAM to support frame buffering, FIFOs, and local data storage without external memory for many use cases.
  • I/O Capacity  426 I/O pins offer extensive connectivity for parallel buses, control signals, and interface routing in high-density systems.
  • Package & Mounting  672-ball BGA (supplier device package: 672-FBGA, 27×27) in a surface-mount form factor for compact board implementation.
  • Power  Core voltage range of 1.425 V to 1.575 V to match system power domains and regulator choices.
  • Industrial Temperature Range  Rated for −40 °C to 100 °C operation, suitable for industrial environments and extended-temperature applications.
  • Standards & Tools Support  Datasheet documents IEEE Std. 1149.1 (JTAG) boundary-scan support and on-chip logic analysis capability (SignalTap II), aiding board bring-up and debug.
  • High-Speed I/O & Clocking  Device documentation includes support for high-speed differential I/O, PLLs and clock networks, and external RAM interfacing for synchronous system integration.
  • Environmental Compliance  RoHS compliant.

Typical Applications

  • Industrial Control  Use in motor control, PLC interfaces, and process-control logic where extended temperature operation and high I/O counts are required.
  • Data Buffering & Protocol Bridging  On-chip RAM and abundant I/Os enable packet buffering, protocol conversion, and custom interface bridging without immediate dependence on external memory.
  • High-Speed I/O Systems  Suitable for designs that require differential I/O and programmable clocking resources for timing-critical signal paths and interfaces.

Unique Advantages

  • Substantial Logic Density:  18,460 logic elements allow implementation of complex control, processing, and glue-logic functions in a single device, reducing board-level component count.
  • Integrated On-Chip Memory:  Approximately 1.67 Mbits of embedded RAM reduces reliance on external RAM for many buffering and temporary storage needs, simplifying BOM and layout.
  • Extensive I/O Count:  426 I/Os provide flexibility to interface multiple peripherals and buses directly, enabling highly integrated system designs.
  • Industrial Reliability:  Specified for −40 °C to 100 °C operation and supplied in a robust BGA package for reliable operation in industrial environments.
  • Debug & Configuration Support:  JTAG boundary-scan and on-chip logic analysis (SignalTap II) support facilitate faster bring-up, in-system debug, and iterative development.
  • RoHS Compliant:  Environmental compliance supports broader regulatory acceptance and manufacturing requirements.

Why Choose EP1S20F672I7N?

The EP1S20F672I7N positions itself as a high-capacity, industrial-grade Stratix FPGA that combines significant logic resources, embedded memory, and a large I/O footprint in a compact 672-BBGA package. Its documented support for JTAG boundary-scan, on-chip logic analysis, high-speed I/O, and comprehensive clocking resources makes it suitable for teams developing complex, timing-sensitive designs that demand on-board programmability and robust debug capabilities.

This device is a practical option for engineering teams and procurement seeking a reconfigurable, RoHS-compliant FPGA that supports extended temperature operation and high integration to simplify system architecture and reduce external components.

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