EP1S20F780C5

IC FPGA 586 I/O 780FBGA
Part Description

Stratix® Field Programmable Gate Array (FPGA) IC 586 1669248 18460 780-BBGA, FCBGA

Quantity 531 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package780-FBGA (29x29)GradeCommercialOperating Temperature0°C – 85°C
Package / Case780-BBGA, FCBGANumber of I/O586Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1846Number of Logic Elements/Cells18460
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits1669248

Overview of EP1S20F780C5 – Stratix® FPGA, 780‑BBGA FCBGA, 1.425–1.575 V

The EP1S20F780C5 is a Stratix® field programmable gate array (FPGA) supplied in a 780‑ball FCBGA package. It delivers high logic density, substantial embedded memory, and a large I/O count for commercial embedded and system designs.

Built on the Stratix device family architecture documented in the device handbook, this part targets applications that require extensive parallel logic, multi‑bank I/O connectivity, and integration of custom digital functions while operating within a 1.425 V to 1.575 V core supply and a commercial 0 °C to 85 °C temperature range.

Key Features

  • Logic Capacity — 18,460 logic elements for implementing complex state machines, datapaths, and control logic.
  • Embedded Memory — Approximately 1.67 Mbits of on‑chip RAM to support frame buffers, FIFOs, and intermediate storage without external memory in many designs.
  • High I/O Count — 586 I/O pins to support wide parallel interfaces, multi‑bank signaling, and dense external connectivity.
  • Package & Mounting — 780‑BBGA FCBGA package (supplier package 780‑FBGA, 29 × 29) with surface‑mount mounting for compact board integration.
  • Power & Temperature — Core voltage supply range 1.425 V to 1.575 V and commercial operating temperature range 0 °C to 85 °C.
  • Standards & Compliance — RoHS compliant to meet common environmental requirements for commercial electronics.
  • Stratix Family Architecture (per device handbook) — Family documentation describes features such as PLLs and clock networks, TriMatrix memory modes, DSP block interfaces, configurable I/O including double‑data‑rate support, JTAG boundary‑scan, and embedded debug (SignalTap II).

Typical Applications

  • High‑density I/O bridging — Use the EP1S20F780C5 to aggregate and translate multiple parallel interfaces where hundreds of signals must be routed and managed.
  • Custom logic acceleration — Implement application‑specific datapaths and control logic using the 18,460 logic elements and on‑chip memory for low‑latency processing.
  • Prototype and system integration — Leverage Stratix architecture capabilities for prototyping complex digital systems and for integration of IP that requires substantial logic and memory resources.

Unique Advantages

  • High logic density: 18,460 logic elements enable large designs and consolidation of multiple functions into a single FPGA, reducing board complexity.
  • Embedded memory for on‑chip buffering: Approximately 1.67 Mbits of RAM supports FIFOs, frame buffers, and scratch storage without immediate need for external memory.
  • Extensive I/O connectivity: 586 I/Os provide flexible interfacing options for high‑pin‑count peripherals and parallel buses.
  • Compact BGA packaging: 780‑ball FCBGA (29 × 29) balances high pin count with a compact footprint for dense PCB layouts.
  • Documented Stratix architecture: The Stratix device handbook details clocking, memory modes, DSP interfaces, and configuration/debug infrastructure useful for complex system design and verification.
  • RoHS compliant: Conforms to common environmental requirements for commercial electronic assemblies.

Why Choose EP1S20F780C5?

The EP1S20F780C5 positions itself as a compact, high‑capacity member of the Stratix FPGA family suitable for designers who need substantial logic resources, ample embedded memory, and a large number of I/Os in a single commercial‑grade device. Its 780‑ball FCBGA packaging and surface‑mount form factor make it appropriate for space‑efficient board layouts.

Choose this part when your design requires integrated digital density and flexible interfacing combined with the documented architecture and configuration/debug features of the Stratix family. The combination of logic elements, embedded RAM, and I/O count supports scalable designs and integration of complex functions while adhering to commercial temperature and RoHS requirements.

Request a quote or submit an inquiry to obtain pricing, availability, and delivery options for the EP1S20F780C5. Provide your required quantities and any specific packaging or test needs to receive a formal quotation.

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