EP1S20F780C6N
| Part Description |
Stratix® Field Programmable Gate Array (FPGA) IC 586 1669248 18460 780-BBGA, FCBGA |
|---|---|
| Quantity | 1,306 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 780-FBGA (29x29) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 780-BBGA, FCBGA | Number of I/O | 586 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1846 | Number of Logic Elements/Cells | 18460 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1669248 |
Overview of EP1S20F780C6N – Stratix® Field Programmable Gate Array (FPGA), 780-BBGA FCBGA
The EP1S20F780C6N is a Stratix-series field programmable gate array offered in a 780-ball FCBGA package (29×29). It provides a high-density programmable fabric with 18,460 logic elements, approximately 1.67 Mbits of embedded memory, and 586 user I/O pins, targeted for commercial-temperature FPGA designs.
Built on the Stratix architecture, this device includes on-chip memory, DSP and multiplier resources, programmable clocking and PLL networks, and comprehensive I/O support—enabling complex digital signal processing, memory interfacing, and high-speed I/O applications where a high logic count and extensive connectivity are required.
Key Features
- Logic Capacity 18,460 logic elements and 1,846 LABs support large-scale combinational and sequential logic implementations.
- Embedded Memory Approximately 1.67 Mbits of on-chip RAM for frame buffers, FIFOs, and on-device data storage.
- High I/O Count 586 user I/O pins enable dense external interface connectivity and multi-channel designs.
- Programmable Clocking Integrated PLLs and hierarchical/global clock networks provide flexible clock management for multi-domain systems (as described in the Stratix handbook).
- DSP & Multiplier Resources Dedicated DSP block interface and multiplier block support arithmetic-intensive processing and signal chain implementations.
- I/O Structure & High-Speed Support Advanced I/O features described in the device handbook include double-data-rate I/O options, programmable drive strength, slew-rate control, and high-speed differential I/O support.
- Configuration & Test JTAG (IEEE 1149.1) boundary-scan support, SignalTap II embedded logic analyzer, and multiple configuration schemes (including partial reconfiguration) are documented for design debug and in-field update workflows.
- Package & Power Surface-mount 780-BBGA FCBGA package (29×29) with specified core supply range of 1.425 V to 1.575 V and commercial operating temperature from 0 °C to 85 °C.
- Standards & Reliability RoHS-compliant component status.
Typical Applications
- Digital Signal Processing DSP block interface and multiplier resources make the device suitable for compute-heavy signal processing tasks and algorithm acceleration.
- High-Speed I/O Systems The high I/O count and documented high-speed differential I/O support are well matched to multi-channel data acquisition and high-throughput interface designs.
- Memory-Intensive Designs On-chip TriMatrix memory and internal RAM resources support buffering, packet queues, and external memory interfacing needs.
- Prototyping & Complex Logic Integration Large logic capacity and flexible clocking make the device appropriate for system prototypes and designs requiring dense programmable logic and multiple clock domains.
Unique Advantages
- High Logic Density: 18,460 logic elements provide the capacity to integrate complex logic, state machines, and processing pipelines on a single device.
- Substantial On-Chip Memory: Approximately 1.67 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage needs.
- Extensive I/O Resources: 586 I/O pins enable broad peripheral and bus connectivity without extensive multiplexing or external expanders.
- Flexible Clocking & Synchronization: Integrated PLLs and hierarchical clock networks (documented in the device handbook) support multi-domain timing architectures.
- Comprehensive Configuration & Debug Support: Built-in JTAG boundary-scan and supported embedded logic analysis features facilitate development, testing, and in-field updates.
- Commercial Temperature Range & RoHS Compliance: Specified 0 °C to 85 °C operation and RoHS compliance align the device with standard commercial product requirements.
Why Choose EP1S20F780C6N?
The EP1S20F780C6N combines a high logic element count, substantial embedded memory, and a very large I/O complement in a compact 780-ball FCBGA package, making it a practical choice for complex, connectivity-rich FPGA designs in the commercial temperature range. Its Stratix architecture—documented with capabilities for advanced clocking, DSP blocks, multipliers, and high-speed I/O—supports a broad set of digital signal processing, memory interface, and multi-channel I/O applications.
For engineering teams needing scalable programmable logic with extensive on-chip resources and configuration/debug features, the EP1S20F780C6N provides a balanced platform that aligns device-level capabilities with system design requirements and development workflows.
Request a quote or submit a pricing inquiry to receive availability and lead-time information for the EP1S20F780C6N. Our team can provide detailed ordering and support information to help integrate this Stratix FPGA into your design.

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