EP1S20F780C6N

IC FPGA 586 I/O 780FBGA
Part Description

Stratix® Field Programmable Gate Array (FPGA) IC 586 1669248 18460 780-BBGA, FCBGA

Quantity 1,306 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package780-FBGA (29x29)GradeCommercialOperating Temperature0°C – 85°C
Package / Case780-BBGA, FCBGANumber of I/O586Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1846Number of Logic Elements/Cells18460
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits1669248

Overview of EP1S20F780C6N – Stratix® Field Programmable Gate Array (FPGA), 780-BBGA FCBGA

The EP1S20F780C6N is a Stratix-series field programmable gate array offered in a 780-ball FCBGA package (29×29). It provides a high-density programmable fabric with 18,460 logic elements, approximately 1.67 Mbits of embedded memory, and 586 user I/O pins, targeted for commercial-temperature FPGA designs.

Built on the Stratix architecture, this device includes on-chip memory, DSP and multiplier resources, programmable clocking and PLL networks, and comprehensive I/O support—enabling complex digital signal processing, memory interfacing, and high-speed I/O applications where a high logic count and extensive connectivity are required.

Key Features

  • Logic Capacity 18,460 logic elements and 1,846 LABs support large-scale combinational and sequential logic implementations.
  • Embedded Memory Approximately 1.67 Mbits of on-chip RAM for frame buffers, FIFOs, and on-device data storage.
  • High I/O Count 586 user I/O pins enable dense external interface connectivity and multi-channel designs.
  • Programmable Clocking Integrated PLLs and hierarchical/global clock networks provide flexible clock management for multi-domain systems (as described in the Stratix handbook).
  • DSP & Multiplier Resources Dedicated DSP block interface and multiplier block support arithmetic-intensive processing and signal chain implementations.
  • I/O Structure & High-Speed Support Advanced I/O features described in the device handbook include double-data-rate I/O options, programmable drive strength, slew-rate control, and high-speed differential I/O support.
  • Configuration & Test JTAG (IEEE 1149.1) boundary-scan support, SignalTap II embedded logic analyzer, and multiple configuration schemes (including partial reconfiguration) are documented for design debug and in-field update workflows.
  • Package & Power Surface-mount 780-BBGA FCBGA package (29×29) with specified core supply range of 1.425 V to 1.575 V and commercial operating temperature from 0 °C to 85 °C.
  • Standards & Reliability RoHS-compliant component status.

Typical Applications

  • Digital Signal Processing DSP block interface and multiplier resources make the device suitable for compute-heavy signal processing tasks and algorithm acceleration.
  • High-Speed I/O Systems The high I/O count and documented high-speed differential I/O support are well matched to multi-channel data acquisition and high-throughput interface designs.
  • Memory-Intensive Designs On-chip TriMatrix memory and internal RAM resources support buffering, packet queues, and external memory interfacing needs.
  • Prototyping & Complex Logic Integration Large logic capacity and flexible clocking make the device appropriate for system prototypes and designs requiring dense programmable logic and multiple clock domains.

Unique Advantages

  • High Logic Density: 18,460 logic elements provide the capacity to integrate complex logic, state machines, and processing pipelines on a single device.
  • Substantial On-Chip Memory: Approximately 1.67 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage needs.
  • Extensive I/O Resources: 586 I/O pins enable broad peripheral and bus connectivity without extensive multiplexing or external expanders.
  • Flexible Clocking & Synchronization: Integrated PLLs and hierarchical clock networks (documented in the device handbook) support multi-domain timing architectures.
  • Comprehensive Configuration & Debug Support: Built-in JTAG boundary-scan and supported embedded logic analysis features facilitate development, testing, and in-field updates.
  • Commercial Temperature Range & RoHS Compliance: Specified 0 °C to 85 °C operation and RoHS compliance align the device with standard commercial product requirements.

Why Choose EP1S20F780C6N?

The EP1S20F780C6N combines a high logic element count, substantial embedded memory, and a very large I/O complement in a compact 780-ball FCBGA package, making it a practical choice for complex, connectivity-rich FPGA designs in the commercial temperature range. Its Stratix architecture—documented with capabilities for advanced clocking, DSP blocks, multipliers, and high-speed I/O—supports a broad set of digital signal processing, memory interface, and multi-channel I/O applications.

For engineering teams needing scalable programmable logic with extensive on-chip resources and configuration/debug features, the EP1S20F780C6N provides a balanced platform that aligns device-level capabilities with system design requirements and development workflows.

Request a quote or submit a pricing inquiry to receive availability and lead-time information for the EP1S20F780C6N. Our team can provide detailed ordering and support information to help integrate this Stratix FPGA into your design.

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