EP1S20F780C7N

IC FPGA 586 I/O 780FBGA
Part Description

Stratix® Field Programmable Gate Array (FPGA) IC 586 1669248 18460 780-BBGA, FCBGA

Quantity 762 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package780-FBGA (29x29)GradeCommercialOperating Temperature0°C – 85°C
Package / Case780-BBGA, FCBGANumber of I/O586Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1846Number of Logic Elements/Cells18460
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits1669248

Overview of EP1S20F780C7N – Stratix® FPGA, ~18,460 Logic Elements, 780-FBGA

The EP1S20F780C7N is a Stratix® Field Programmable Gate Array (FPGA) in a 780-ball FCBGA package, delivering a combination of high logic density and extensive I/O for commercial embedded designs. Based on the Stratix device family architecture, this device provides a scalable fabric of logic array blocks, embedded memory, and clocking features suitable for complex custom logic and system integration tasks.

Typical use cases include high-channel-count digital systems and applications that require significant on-chip logic, abundant I/O, and robust clocking and memory resources. The device’s single-supply voltage window and commercial temperature grade support standard board-level deployments.

Key Features

  • Logic Capacity  Approximately 18,460 logic elements supported by 1,846 LABs to implement complex custom digital logic and control functions.
  • Embedded Memory  Approximately 1.67 Mbits of on-chip RAM for buffering, FIFOs, and local storage.
  • I/O Density  586 user I/O pins to support wide data buses, multiple interfaces, and high channel counts.
  • Power Supply  Specified core voltage range of 1.425 V to 1.575 V for consistent device operation within the defined supply window.
  • Package & Mounting  780-BBGA (780-FBGA 29×29) FCBGA format in a surface-mount package for compact board integration.
  • Operating Range & Grade  Commercial temperature rating (0 °C to 85 °C) for standard embedded and commercial applications.
  • Stratix Family Capabilities (series-level)  Stratix device handbook references family-level features such as logic array blocks, TriMatrix memory modes, multiplier blocks, PLLs and clock networks, and high-speed I/O support for advanced timing and interface requirements.
  • Environmental Compliance  RoHS compliant.

Typical Applications

  • High‑channel data aggregation  Use the large I/O count and embedded memory to implement wide parallel data capture and aggregation interfaces.
  • Custom signal processing  Leverage the device’s logic density and on-chip RAM to implement tailored DSP pipelines and temporary data buffers.
  • Interface bridging and protocol conversion  Deploy the abundant I/O and configurable logic to bridge between diverse bus standards and custom peripherals.
  • Test and measurement systems  Implement custom timing, control, and data-handling logic for instrumentation that requires deterministic, FPGA-based processing.

Unique Advantages

  • High logic density: Approximately 18,460 logic elements enable compact implementation of complex state machines, datapaths, and control logic.
  • Generous I/O resources: 586 I/O pins provide flexibility to connect multiple peripherals, buses, and external memories without external multiplexing.
  • On‑chip memory for buffering: Approximately 1.67 Mbits of embedded RAM reduces external memory dependence for many buffering and FIFO needs.
  • Family-level timing and clock features: Stratix architecture includes PLL and clock network capabilities (as documented in the Stratix device handbook) to support complex clocking requirements.
  • Compact FCBGA package: 780-ball FCBGA (29×29) offers a dense, board-friendly form factor for space-constrained applications.
  • Commercial readiness: Rated for 0 °C to 85 °C and RoHS compliant for mainstream embedded product deployment.

Why Choose EP1S20F780C7N?

The EP1S20F780C7N positions itself as a high-density commercial Stratix FPGA option for designers needing significant logic resources, abundant I/O, and on-chip memory in a compact FCBGA package. It is suited to engineers implementing custom datapaths, protocol bridges, and multi-channel interfaces where integration and pin count are critical.

Built on the Stratix device family architecture—with documented capabilities for memory modes, multiplier blocks, and advanced clocking—this device provides a practical balance of performance and integration for commercial embedded systems, test equipment, and data-handling designs.

Request a quote or submit an inquiry for availability and pricing to evaluate EP1S20F780C7N for your next design project.

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