EP1S20F780C7N
| Part Description |
Stratix® Field Programmable Gate Array (FPGA) IC 586 1669248 18460 780-BBGA, FCBGA |
|---|---|
| Quantity | 762 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 780-FBGA (29x29) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 780-BBGA, FCBGA | Number of I/O | 586 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1846 | Number of Logic Elements/Cells | 18460 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1669248 |
Overview of EP1S20F780C7N – Stratix® FPGA, ~18,460 Logic Elements, 780-FBGA
The EP1S20F780C7N is a Stratix® Field Programmable Gate Array (FPGA) in a 780-ball FCBGA package, delivering a combination of high logic density and extensive I/O for commercial embedded designs. Based on the Stratix device family architecture, this device provides a scalable fabric of logic array blocks, embedded memory, and clocking features suitable for complex custom logic and system integration tasks.
Typical use cases include high-channel-count digital systems and applications that require significant on-chip logic, abundant I/O, and robust clocking and memory resources. The device’s single-supply voltage window and commercial temperature grade support standard board-level deployments.
Key Features
- Logic Capacity Approximately 18,460 logic elements supported by 1,846 LABs to implement complex custom digital logic and control functions.
- Embedded Memory Approximately 1.67 Mbits of on-chip RAM for buffering, FIFOs, and local storage.
- I/O Density 586 user I/O pins to support wide data buses, multiple interfaces, and high channel counts.
- Power Supply Specified core voltage range of 1.425 V to 1.575 V for consistent device operation within the defined supply window.
- Package & Mounting 780-BBGA (780-FBGA 29×29) FCBGA format in a surface-mount package for compact board integration.
- Operating Range & Grade Commercial temperature rating (0 °C to 85 °C) for standard embedded and commercial applications.
- Stratix Family Capabilities (series-level) Stratix device handbook references family-level features such as logic array blocks, TriMatrix memory modes, multiplier blocks, PLLs and clock networks, and high-speed I/O support for advanced timing and interface requirements.
- Environmental Compliance RoHS compliant.
Typical Applications
- High‑channel data aggregation Use the large I/O count and embedded memory to implement wide parallel data capture and aggregation interfaces.
- Custom signal processing Leverage the device’s logic density and on-chip RAM to implement tailored DSP pipelines and temporary data buffers.
- Interface bridging and protocol conversion Deploy the abundant I/O and configurable logic to bridge between diverse bus standards and custom peripherals.
- Test and measurement systems Implement custom timing, control, and data-handling logic for instrumentation that requires deterministic, FPGA-based processing.
Unique Advantages
- High logic density: Approximately 18,460 logic elements enable compact implementation of complex state machines, datapaths, and control logic.
- Generous I/O resources: 586 I/O pins provide flexibility to connect multiple peripherals, buses, and external memories without external multiplexing.
- On‑chip memory for buffering: Approximately 1.67 Mbits of embedded RAM reduces external memory dependence for many buffering and FIFO needs.
- Family-level timing and clock features: Stratix architecture includes PLL and clock network capabilities (as documented in the Stratix device handbook) to support complex clocking requirements.
- Compact FCBGA package: 780-ball FCBGA (29×29) offers a dense, board-friendly form factor for space-constrained applications.
- Commercial readiness: Rated for 0 °C to 85 °C and RoHS compliant for mainstream embedded product deployment.
Why Choose EP1S20F780C7N?
The EP1S20F780C7N positions itself as a high-density commercial Stratix FPGA option for designers needing significant logic resources, abundant I/O, and on-chip memory in a compact FCBGA package. It is suited to engineers implementing custom datapaths, protocol bridges, and multi-channel interfaces where integration and pin count are critical.
Built on the Stratix device family architecture—with documented capabilities for memory modes, multiplier blocks, and advanced clocking—this device provides a practical balance of performance and integration for commercial embedded systems, test equipment, and data-handling designs.
Request a quote or submit an inquiry for availability and pricing to evaluate EP1S20F780C7N for your next design project.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018