EP1S20F780C6
| Part Description |
Stratix® Field Programmable Gate Array (FPGA) IC 586 1669248 18460 780-BBGA, FCBGA |
|---|---|
| Quantity | 1,478 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 780-FBGA (29x29) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 780-BBGA, FCBGA | Number of I/O | 586 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1846 | Number of Logic Elements/Cells | 18460 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1669248 |
Overview of EP1S20F780C6 – Stratix FPGA, 780-FBGA (29×29)
The EP1S20F780C6 is a Stratix® Field Programmable Gate Array (FPGA) IC from Intel, offered in a 780-FBGA (29×29) package. It delivers a high logic element count and substantial on-chip RAM alongside a large I/O complement for complex, programmable digital designs.
Built on the Stratix device family architecture, this device targets commercial applications that require dense logic capacity, flexible high-speed I/O, and integrated memory and DSP resources as documented in the Stratix device handbook.
Key Features
- Core Capacity 18,460 logic elements provide significant programmable logic resources for implementing complex digital functions and custom processing pipelines.
- Embedded Memory Approximately 1.67 Mbits of on-chip RAM (1,669,248 total RAM bits) to support buffering, packet processing, and on-chip data storage.
- I/O Density & Capabilities 586 I/O pins for high channel count designs; the Stratix family documentation includes support for advanced I/O structures such as double-data-rate I/O and high-speed differential interfaces.
- Clocking & DSP Resources Architecture references in the device handbook include PLLs, clock networks, and multiplier/DSP block resources suitable for synchronized designs and arithmetic-intensive functions.
- Package & Mounting 780-BBGA, FCBGA package (supplier device package: 780-FBGA, 29×29) with surface-mount mounting for compact board footprint and high pin count routing.
- Power Supply Core voltage supply range of 1.425 V to 1.575 V to match system power-rail planning and ensure stable device operation within specified limits.
- Commercial Temperature Grade Rated for operation from 0 °C to 85 °C, suitable for commercial-grade electronics and controlled-environment applications.
- Design & Testability Device handbook references include configuration and testing features such as JTAG boundary-scan and an embedded logic analyzer capability to aid prototyping and debug.
- Compliance RoHS compliant for alignment with lead-free manufacturing and regulatory requirements.
Typical Applications
- High-Speed Communications Leverage the device’s large I/O count and Stratix I/O architecture for protocol bridging, packet processing, and interface aggregation in commercial networking equipment.
- Signal Processing & DSP Use the combination of abundant logic elements, on-chip RAM, and documented multiplier/DSP resources for fixed-point DSP, filtering, and custom accelerators.
- Memory Interface & Storage Controllers On-chip memory and external RAM interfacing features make the device suitable for controller logic and buffering in storage and memory-access applications.
- Test, Measurement & Prototyping JTAG boundary-scan and embedded logic analyzer features referenced in the Stratix handbook enable visibility and validation during development and production testing.
Unique Advantages
- High Logic Density: 18,460 logic elements allow implementation of sizable custom logic and multiple functional blocks on a single device, reducing board-level complexity.
- Substantial On-Chip Memory: Approximately 1.67 Mbits of embedded RAM reduces reliance on external memory for many buffering and scratchpad needs.
- Exceptional I/O Count: 586 I/Os support dense connectivity and multi-channel interfaces without immediate need for I/O expansion.
- Advanced Clocking and DSP Support: Stratix architecture documentation includes PLLs and multiplier blocks to simplify synchronized and arithmetic-heavy designs.
- Compact, High-Pin-Count Package: The 780-FBGA (29×29) package provides a small board footprint while exposing a large number of signals for routing flexibility.
- Documented Design & Test Flow: The Stratix device handbook details configuration, timing, and test features to assist development, validation, and production readiness.
Why Choose EP1S20F780C6?
EP1S20F780C6 combines a high logic element count, meaningful on-chip RAM, and a large I/O complement in a compact FBGA package—making it a strong candidate for commercial systems that demand programmable logic density alongside robust I/O connectivity. The device is supported by comprehensive Stratix family documentation covering architecture, clocking, memory modes, I/O structure, and configuration/testability.
This part is well suited to engineers developing commercial-grade communications, signal processing, and controller designs who need programmable resources, integrated memory, and documented architecture to accelerate development and deployment.
Request a quote or submit a quote to receive pricing and availability information for the EP1S20F780C6.

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