EP1S20F780C6

IC FPGA 586 I/O 780FBGA
Part Description

Stratix® Field Programmable Gate Array (FPGA) IC 586 1669248 18460 780-BBGA, FCBGA

Quantity 1,478 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package780-FBGA (29x29)GradeCommercialOperating Temperature0°C – 85°C
Package / Case780-BBGA, FCBGANumber of I/O586Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1846Number of Logic Elements/Cells18460
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits1669248

Overview of EP1S20F780C6 – Stratix FPGA, 780-FBGA (29×29)

The EP1S20F780C6 is a Stratix® Field Programmable Gate Array (FPGA) IC from Intel, offered in a 780-FBGA (29×29) package. It delivers a high logic element count and substantial on-chip RAM alongside a large I/O complement for complex, programmable digital designs.

Built on the Stratix device family architecture, this device targets commercial applications that require dense logic capacity, flexible high-speed I/O, and integrated memory and DSP resources as documented in the Stratix device handbook.

Key Features

  • Core Capacity  18,460 logic elements provide significant programmable logic resources for implementing complex digital functions and custom processing pipelines.
  • Embedded Memory  Approximately 1.67 Mbits of on-chip RAM (1,669,248 total RAM bits) to support buffering, packet processing, and on-chip data storage.
  • I/O Density & Capabilities  586 I/O pins for high channel count designs; the Stratix family documentation includes support for advanced I/O structures such as double-data-rate I/O and high-speed differential interfaces.
  • Clocking & DSP Resources  Architecture references in the device handbook include PLLs, clock networks, and multiplier/DSP block resources suitable for synchronized designs and arithmetic-intensive functions.
  • Package & Mounting  780-BBGA, FCBGA package (supplier device package: 780-FBGA, 29×29) with surface-mount mounting for compact board footprint and high pin count routing.
  • Power Supply  Core voltage supply range of 1.425 V to 1.575 V to match system power-rail planning and ensure stable device operation within specified limits.
  • Commercial Temperature Grade  Rated for operation from 0 °C to 85 °C, suitable for commercial-grade electronics and controlled-environment applications.
  • Design & Testability  Device handbook references include configuration and testing features such as JTAG boundary-scan and an embedded logic analyzer capability to aid prototyping and debug.
  • Compliance  RoHS compliant for alignment with lead-free manufacturing and regulatory requirements.

Typical Applications

  • High-Speed Communications  Leverage the device’s large I/O count and Stratix I/O architecture for protocol bridging, packet processing, and interface aggregation in commercial networking equipment.
  • Signal Processing & DSP  Use the combination of abundant logic elements, on-chip RAM, and documented multiplier/DSP resources for fixed-point DSP, filtering, and custom accelerators.
  • Memory Interface & Storage Controllers  On-chip memory and external RAM interfacing features make the device suitable for controller logic and buffering in storage and memory-access applications.
  • Test, Measurement & Prototyping  JTAG boundary-scan and embedded logic analyzer features referenced in the Stratix handbook enable visibility and validation during development and production testing.

Unique Advantages

  • High Logic Density: 18,460 logic elements allow implementation of sizable custom logic and multiple functional blocks on a single device, reducing board-level complexity.
  • Substantial On-Chip Memory: Approximately 1.67 Mbits of embedded RAM reduces reliance on external memory for many buffering and scratchpad needs.
  • Exceptional I/O Count: 586 I/Os support dense connectivity and multi-channel interfaces without immediate need for I/O expansion.
  • Advanced Clocking and DSP Support: Stratix architecture documentation includes PLLs and multiplier blocks to simplify synchronized and arithmetic-heavy designs.
  • Compact, High-Pin-Count Package: The 780-FBGA (29×29) package provides a small board footprint while exposing a large number of signals for routing flexibility.
  • Documented Design & Test Flow: The Stratix device handbook details configuration, timing, and test features to assist development, validation, and production readiness.

Why Choose EP1S20F780C6?

EP1S20F780C6 combines a high logic element count, meaningful on-chip RAM, and a large I/O complement in a compact FBGA package—making it a strong candidate for commercial systems that demand programmable logic density alongside robust I/O connectivity. The device is supported by comprehensive Stratix family documentation covering architecture, clocking, memory modes, I/O structure, and configuration/testability.

This part is well suited to engineers developing commercial-grade communications, signal processing, and controller designs who need programmable resources, integrated memory, and documented architecture to accelerate development and deployment.

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