EP1S20F672C7N
| Part Description |
Stratix® Field Programmable Gate Array (FPGA) IC 426 1669248 18460 672-BBGA |
|---|---|
| Quantity | 250 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 672-FBGA (27x27) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 672-BBGA | Number of I/O | 426 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1846 | Number of Logic Elements/Cells | 18460 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1669248 |
Overview of EP1S20F672C7N – Stratix® Field Programmable Gate Array (FPGA) 672-BBGA
The EP1S20F672C7N is a Stratix® family field-programmable gate array (FPGA) from Intel presented in a 672-ball BGA package. It provides a balance of programmable logic, embedded RAM, and a high I/O count intended for commercial-grade digital designs.
Architected around the Stratix device family, this FPGA combines approximately 18,460 logic elements, roughly 1.67 Mbits of embedded memory, and 426 I/Os to support complex, custom digital functions where reprogrammability and integration are required.
Key Features
- Core Logic Approximately 18,460 logic elements organized across 1,846 LABs for implementing custom digital logic and finite-state machines.
- Embedded Memory Total on-chip RAM of 1,669,248 bits — approximately 1.67 Mbits of embedded memory available for buffering, FIFOs, and local storage.
- I/O Capacity 426 general-purpose I/O pins to support broad interfacing needs and parallel connectivity.
- Stratix Architecture Built on the Stratix family architecture; the device documentation references PLLs and clock networks, multiplier blocks, DSP block interfaces, TriMatrix memory, and advanced I/O structures for system design.
- Power and Supply Core voltage supply range of 1.425 V to 1.575 V to match required power rails for operation.
- Package and Mounting 672-ball BGA (supplier package: 672-FBGA, 27×27) in a surface-mount form factor for dense PCB implementations.
- Commercial Grade & Compliance Commercial-grade device with operating temperature range of 0 °C to 85 °C and RoHS compliance.
Typical Applications
- Custom digital logic Implement glue logic, protocol handling, and state machines using the device’s ~18,460 logic elements and flexible routing.
- Memory-centric designs Leverage approximately 1.67 Mbits of embedded memory for buffering, packet storage, and local data manipulation.
- I/O-intensive interfaces Use the 426 I/Os to bridge parallel buses, connect to multiple peripherals, or implement wide data paths on a single FPGA.
Unique Advantages
- Substantial logic capacity: The approximately 18,460 logic elements enable broad functional integration without immediate need for additional programmable devices.
- On-chip RAM for local buffering: Approximately 1.67 Mbits of embedded memory reduces dependence on external RAM for many buffering and FIFO requirements.
- High I/O count: 426 I/Os simplify board-level routing for multi-channel or parallel-interface applications.
- Standard commercial temperature: Rated for 0 °C to 85 °C to match typical commercial deployment environments.
- Compact BGA package: 672-ball FBGA (27×27) supports high-density PCB layouts and surface-mount assembly processes.
- Regulatory compliance: RoHS-compliant construction supports environmental requirements for commercial products.
Why Choose EP1S20F672C7N?
The EP1S20F672C7N positions itself as a versatile Stratix FPGA for commercial designs that require a combination of programmable logic, embedded memory, and extensive I/O. Its balance of approximately 18,460 logic elements, roughly 1.67 Mbits of on-chip RAM, and 426 I/Os makes it suitable for consolidated digital subsystems and interface bridging on a single device.
Packaged in a 672-ball BGA and operating over a commercial temperature range, this device is appropriate for development and production where Stratix architecture features—such as PLLs, multiplier/DSP blocks, and advanced I/O structures—are desired and where RoHS compliance is required.
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