EP1S20F484I6N

IC FPGA 361 I/O 484FBGA
Part Description

Stratix® Field Programmable Gate Array (FPGA) IC 361 1669248 18460 484-BBGA, FCBGA

Quantity 110 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-BBGA, FCBGANumber of I/O361Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1846Number of Logic Elements/Cells18460
Number of GatesN/AECCN3A001A2AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits1669248

Overview of EP1S20F484I6N – Stratix® FPGA, 484-BBGA (FCBGA)

The EP1S20F484I6N is a Stratix® Field Programmable Gate Array (FPGA) IC from Intel, supplied in a 484-BBGA (FCBGA) surface-mount package. The device integrates approximately 18,460 logic elements across 1,846 logic array blocks, about 1.67 Mbits of embedded RAM, and 361 general-purpose I/O pins to support complex, high-density designs.

Built and documented as part of the Stratix device family, the part is suitable for industrial-grade applications requiring a programmable fabric with on-chip memory and extensive I/O. The device operates from a core supply range of 1.425 V to 1.575 V and across an operating temperature range of −40 °C to 100 °C.

Key Features

  • Core Logic  Approximately 18,460 logic elements organized across 1,846 logic array blocks (LABs), enabling implementation of sizable custom digital logic and control functions.
  • On-Chip Memory  Approximately 1.67 Mbits of embedded RAM, supporting a range of memory modes and local data buffering as described in the Stratix device handbook.
  • I/O Capacity  361 I/O pins provided in the 484-BBGA package to support multi-channel interfaces and external device connectivity.
  • Package & Mounting  484-BBGA (FCBGA) surface-mount package; supplier device package listed as 484-FBGA (23×23) for compact, high-density board designs.
  • Power  Core voltage supply specified from 1.425 V to 1.575 V to match system power-rail budgeting and regulator selection.
  • Industrial Temperature Range  Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
  • Stratix Family Architecture  As documented in the Stratix device handbook, the family includes structured logic array blocks, memory modes, PLLs and clock networks, advanced I/O structure and DSP/multiplier resources for system-level integration.
  • Standards Compliance  RoHS-compliant construction for materials and environmental regulations.

Typical Applications

  • High-speed data processing  On-chip logic, embedded RAM, and Stratix family DSP/multiplier resources support algorithm acceleration, data formatting, and real-time packet processing.
  • Communications & Networking  Large I/O count and programmable I/O structure allow implementation of multi-channel interfaces and protocol bridging in networking equipment.
  • Memory interfacing & buffering  Embedded RAM and documented external RAM interfacing modes make the device suitable for buffering and memory-controller functions.
  • Custom hardware acceleration  Programmable fabric with substantial logic and memory supports offloading compute-intensive or latency-sensitive tasks from host processors.

Unique Advantages

  • Scalable programmable fabric: The combination of 18,460 logic elements and 1,846 LABs provides a sizable resource pool for complex logic implementations without external ASIC development.
  • Significant on-chip memory: Approximately 1.67 Mbits of embedded RAM reduces dependence on external memory for many buffering and stateful processing tasks.
  • High I/O density: 361 available I/Os in a compact 484-BBGA package simplifies multi-channel interfacing and reduces board-level routing complexity.
  • Industrial operating range: −40 °C to 100 °C rating supports deployment in industrial environments with wide temperature swings.
  • Design documentation: Part of the Stratix family with comprehensive device handbook material covering architecture, clocking, memory modes, and I/O structure to support system design.
  • RoHS compliant: Materials and construction meet RoHS requirements for regulatory compliance.

Why Choose EP1S20F484I6N?

The EP1S20F484I6N positions itself as a robust Stratix-family FPGA option for engineers who need a substantial logic resource set, embedded memory, and a high I/O count in a compact 484-BBGA package. Its industrial temperature rating and defined core voltage range make it suitable for production systems that require predictable electrical and thermal behavior.

Design teams targeting communications, real-time data processing, memory interfacing, or custom acceleration can leverage the device’s on-chip resources and the Stratix family documentation to shorten development cycles and integrate multiple functions into a single programmable device.

Request a quote or submit an inquiry to receive pricing, availability and lead-time information for EP1S20F484I6N.

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