EP1S20F484C6N

The EP1S20F484C6N is a Stratix® family field programmable gate array offering a balance of programmable logic, embedded memory, and high I/O density in a 484-ball BGA package. It delivers a configurable hardware platform suitable for designs that require substantial logic capacity, on-chip RAM, and a large number of I/O pins.

Key architectural elements include 1,846 LABs and 18,460 logic elements, approximately 1.67 Mbits of embedded RAM, and 361 I/O pins, making this device appropriate for custom logic, protocol bridging, and memory-rich embedded functions within commercial-temperature applications.

Key Features

• Logic Capacity – 18,460 logic elements organized across 1,846 LABs for implementing complex digital logic and state machines.
• Embedded Memory – Approximately 1.67 Mbits of on-chip RAM, providing local storage for buffering, FIFOs, and data-path implementations.
• I/O Density – 361 I/O pins to support wide parallel interfaces, multiple buses, and diverse peripheral connections.
• Power and Supply – Core supply voltage range from 1.425 V to 1.575 V to match system power rails and design constraints.
• Package – 484-ball BGA (484-FBGA, 23×23 mm) surface-mount package for compact board integration and high pin count routing.
• Operating Range – Commercial temperature grade with specified operating range from 0 °C to 85 °C.
• RoHS Compliance – Device is RoHS compliant.

Typical Applications

• Custom Logic and Prototyping – Implement state machines, glue logic, and custom accelerators using the device’s 18,460 logic elements and abundant LAB resources.
• High-Speed I/O and Interface Bridging – Use the 361 available I/Os to connect multiple parallel or serialized interfaces and perform protocol translation on-board.
• Embedded Data Processing – Leverage approximately 1.67 Mbits of embedded RAM for buffering, temporary data storage, and data-path implementations in real-time systems.
• System Integration – Consolidate multiple discrete functions into a single FPGA to reduce BOM and simplify PCB layout in commercial electronic products.

Unique Advantages

• Substantial Logic Density: 18,460 logic elements and 1,846 LABs provide headroom for complex designs without immediate need to partition across devices.
• On-Chip Memory Capacity: Approximately 1.67 Mbits of embedded RAM supports local buffering and data-path operations, reducing external memory dependence for many applications.
• High I/O Count: 361 I/Os enable broad connectivity to peripherals, sensors, and external memories, facilitating flexible system architectures.
• Compact BGA Package: 484-ball FCBGA (23×23 mm) balances high pin count with a small board footprint for space-constrained designs.
• Commercial Temperature Grade: Specified operation from 0 °C to 85 °C aligns with standard commercial electronics deployment.
• Regulatory Alignment: RoHS compliance supports environmentally conscious manufacturing and supply-chain requirements.

Why Choose EP1S20F484C6N?

The EP1S20F484C6N combines mid-range Stratix FPGA logic capacity with meaningful on-chip memory and a high I/O count in a compact 484-ball BGA package. It is positioned for designers needing an integrated programmable solution for commercial-temperature applications where consolidation of logic, interfaces, and memory into a single device reduces board complexity and BOM.

With defined supply-voltage requirements and clear thermal grades, the device provides predictable electrical and environmental boundaries for systems engineering. Its combination of LABs, logic elements, embedded RAM, and I/O makes it a practical choice for development teams implementing custom processing, interface bridging, and high-density digital designs.

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