EP1S20F484I6

IC FPGA 361 I/O 484FBGA
Part Description

Stratix® Field Programmable Gate Array (FPGA) IC 361 1669248 18460 484-BBGA, FCBGA

Quantity 187 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-BBGA, FCBGANumber of I/O361Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1846Number of Logic Elements/Cells18460
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits1669248

Overview of EP1S20F484I6 – Stratix® Field Programmable Gate Array (FPGA)

The EP1S20F484I6 is a Stratix® family FPGA offering a mid-range logic density and on-chip memory for complex digital designs. It delivers 18,460 logic elements and approximately 1.67 Mbits of embedded RAM in a compact 484‑FBGA (23×23) surface-mount package.

Designed for industrial applications, this device provides a broad set of architecture features from the Stratix device handbook — including advanced clocking, memory modes, and I/O capabilities — enabling system designers to integrate compute, memory and high‑speed I/O functionality into single-chip solutions.

Key Features

  • Logic Density — 18,460 logic elements to implement medium-complexity FPGA designs and custom logic functions.
  • Embedded Memory — Approximately 1.67 Mbits of on-chip RAM organized for flexible memory modes, supporting single- and dual-port usage and byte alignment.
  • I/O Capacity — 361 I/O pins with Stratix I/O structure that supports double-data-rate interfaces, programmable drive strength, and advanced I/O standards.
  • Clocking and PLLs — Stratix family clock networks with enhanced and fast PLL support for flexible, deterministic clock distribution and multi-domain designs.
  • DSP & Multiplier Blocks — Dedicated multiplier/DSP resources and adder/output blocks described in the Stratix device handbook for optimized arithmetic and signal-processing functions.
  • Memory Architecture — TriMatrix memory architecture with multiple memory modes, parity support and shift-register capability for on-chip data storage and buffering.
  • Configuration & Test — IEEE 1149.1 (JTAG) boundary-scan support and embedded logic analysis capabilities outlined in the Stratix handbook for in-system debug and configuration.
  • Power & Supply — Core supply range of 1.425 V to 1.575 V to match system power rails and ensure consistent device operation.
  • Package & Temperature — 484‑BBGA / FCBGA (23×23) surface-mount package rated for industrial operating temperatures from −40 °C to 100 °C.
  • RoHS Compliant — Meets RoHS environmental requirements for lead-free assembly and regulatory compliance.

Typical Applications

  • Communications Equipment — Use the device’s high I/O count and advanced clocking/PLL features to implement protocol bridging, packet processing, and interface adaptation in networking hardware.
  • Industrial Automation — Leverage extensive logic elements and on-chip RAM for control, motor drive logic, and deterministic I/O handling in factory and process automation systems.
  • Signal Processing — Deploy DSP/multiplier blocks and embedded memory for filtering, aggregation, and real-time data processing applications in instrumentation and test equipment.

Unique Advantages

  • Substantial Logic Capacity: 18,460 logic elements let you implement complex control and datapath logic without immediately resorting to larger device families.
  • Integrated Memory Footprint: Approximately 1.67 Mbits of embedded RAM reduces dependency on external memory for buffering and state storage.
  • High I/O Count: 361 I/O pins provide flexibility for multi‑lane interfaces, external memory connections, and mixed-signal front ends.
  • Robust Clocking Options: Stratix PLL and clock network features enable multi-domain clocking and low-jitter sources for synchronous designs.
  • Industrial Temperature Rating: Operation from −40 °C to 100 °C supports deployment in harsh and temperature-variable industrial environments.
  • Compact, High-Density Package: 484‑FBGA (23×23) surface-mount package balances board-space efficiency with high pin count for dense system designs.

Why Choose EP1S20F484I6?

The EP1S20F484I6 combines a mid-range logic element count with significant on-chip memory and a high I/O pin count in a compact 484‑FBGA package, making it well suited for industrial and communications designs that require integrated logic, memory, and flexible I/O. Its Stratix architecture features — including advanced PLLs, TriMatrix memory modes, and DSP resources — give designers deterministic clocking and on-chip processing building blocks.

This device is a practical choice for engineering teams needing a balance of integration, thermal range, and configurability without stepping up to larger device families. It supports established Stratix configuration and test methodologies to simplify development and in-system debugging across product lifecycles.

Request a quote or submit a procurement inquiry to check pricing and availability for the EP1S20F484I6 and to obtain detailed ordering information.

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