EP1S20F672C6

IC FPGA 426 I/O 672FBGA
Part Description

Stratix® Field Programmable Gate Array (FPGA) IC 426 1669248 18460 672-BBGA

Quantity 1,559 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package672-FBGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case672-BBGANumber of I/O426Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1846Number of Logic Elements/Cells18460
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits1669248

Overview of EP1S20F672C6 – Stratix® Field Programmable Gate Array (FPGA) IC 426 1669248 18460 672-BBGA

The EP1S20F672C6 is a Stratix® series Field Programmable Gate Array offered in a 672-ball BGA package. This commercial-grade, surface-mount FPGA integrates a substantial programmable fabric with dedicated memory and a large I/O count suitable for complex logic, memory interfacing, and high-pin-count designs.

Built on Stratix device architecture, the device provides a balance of on-chip embedded memory, logic resources, and clocking/I/O structures to support system designs that require flexible hardware programmability and significant I/O connectivity.

Key Features

  • Programmable Logic  18,460 logic elements provide the core programmable resources for implementing custom logic, state machines, and combinational/sequential functions.
  • Embedded Memory  Approximately 1.67 Mbits of on-chip RAM for frame buffers, FIFOs, lookup tables, and other embedded storage requirements.
  • I/O Capacity  426 I/O pins enable high connector density and broad external interfacing for parallel buses, external memory, and peripheral connections.
  • Power Supply  Core voltage supply range of 1.425 V to 1.575 V, allowing precise core-power provisioning within the specified operating window.
  • Package & Mounting  672-ball FBGA (27 × 27 mm footprint) package in a surface-mount form factor for compact PCB integration and high pin-count routing.
  • Operating Temperature  Commercial operating range from 0 °C to 85 °C for standard environmental conditions.
  • Standards & Compliance  RoHS-compliant materials support regulatory requirements for lead-free assembly.
  • Stratix Family Capabilities (from device handbook)  Architecture and functional features documented for the Stratix family include advanced I/O structures, PLLs and clock networks, DSP block interfaces, memory modes, and configuration/testing features such as JTAG and SignalTap II.

Typical Applications

  • High-speed data interfacing  Use the device’s large I/O count and Stratix I/O architecture for external memory interfaces, parallel buses, and complex I/O routing.
  • Digital signal processing and DSP accelerators  Leverage the Stratix family DSP block interfaces and embedded memory to implement signal processing pipelines, buffering, and data formatting.
  • Prototyping and custom logic implementation  Deploy the programmable logic resources and on-chip RAM to validate custom algorithms, controllers, and mixed-function digital blocks.
  • Clocking-heavy systems  Apply integrated PLLs and clock network features for designs that require multiple clock domains, clock management, and timing control.

Unique Advantages

  • Substantial logic capacity: 18,460 logic elements provide a large, flexible fabric for implementing complex state machines and logic functions, reducing the need for multiple discrete devices.
  • Significant embedded memory: Approximately 1.67 Mbits of on-chip RAM supports local buffering and data storage, simplifying board-level memory requirements.
  • High I/O count: 426 I/Os enable direct connection to numerous peripherals and parallel interfaces, minimizing additional interface components.
  • Robust Stratix architecture: Family-level features such as advanced I/O modes, PLLs, DSP interfaces, and configuration/testing support provide design flexibility and system-level capabilities.
  • Compact, high-pin-count package: The 672-FBGA (27 × 27 mm) package balances pin density with a surface-mount form factor for PCB space optimization.
  • Regulatory readiness: RoHS compliance facilitates use in lead-free manufacturing processes.

Why Choose EP1S20F672C6?

The EP1S20F672C6 positions itself as a capable Stratix FPGA option for commercial designs that require a combination of significant programmable logic, embedded memory, and extensive I/O. Its documented Stratix family features—such as advanced clocking, DSP block interfaces, and sophisticated I/O support—align with development needs for complex digital systems and hardware-accelerated functions.

Designers and teams seeking a commercially graded FPGA with a 672-ball FBGA footprint, clearly defined voltage and temperature ranges, and RoHS compliance will find this device suitable for applications where integration, configurability, and on-chip resources reduce board-level complexity and speed time-to-prototype.

If you would like pricing, availability, or a formal quote for the EP1S20F672C6, submit a request and our team will respond with a quote and ordering details.

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