EP1S20F672C6
| Part Description |
Stratix® Field Programmable Gate Array (FPGA) IC 426 1669248 18460 672-BBGA |
|---|---|
| Quantity | 1,559 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 672-FBGA (27x27) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 672-BBGA | Number of I/O | 426 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1846 | Number of Logic Elements/Cells | 18460 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1669248 |
Overview of EP1S20F672C6 – Stratix® Field Programmable Gate Array (FPGA) IC 426 1669248 18460 672-BBGA
The EP1S20F672C6 is a Stratix® series Field Programmable Gate Array offered in a 672-ball BGA package. This commercial-grade, surface-mount FPGA integrates a substantial programmable fabric with dedicated memory and a large I/O count suitable for complex logic, memory interfacing, and high-pin-count designs.
Built on Stratix device architecture, the device provides a balance of on-chip embedded memory, logic resources, and clocking/I/O structures to support system designs that require flexible hardware programmability and significant I/O connectivity.
Key Features
- Programmable Logic 18,460 logic elements provide the core programmable resources for implementing custom logic, state machines, and combinational/sequential functions.
- Embedded Memory Approximately 1.67 Mbits of on-chip RAM for frame buffers, FIFOs, lookup tables, and other embedded storage requirements.
- I/O Capacity 426 I/O pins enable high connector density and broad external interfacing for parallel buses, external memory, and peripheral connections.
- Power Supply Core voltage supply range of 1.425 V to 1.575 V, allowing precise core-power provisioning within the specified operating window.
- Package & Mounting 672-ball FBGA (27 × 27 mm footprint) package in a surface-mount form factor for compact PCB integration and high pin-count routing.
- Operating Temperature Commercial operating range from 0 °C to 85 °C for standard environmental conditions.
- Standards & Compliance RoHS-compliant materials support regulatory requirements for lead-free assembly.
- Stratix Family Capabilities (from device handbook) Architecture and functional features documented for the Stratix family include advanced I/O structures, PLLs and clock networks, DSP block interfaces, memory modes, and configuration/testing features such as JTAG and SignalTap II.
Typical Applications
- High-speed data interfacing Use the device’s large I/O count and Stratix I/O architecture for external memory interfaces, parallel buses, and complex I/O routing.
- Digital signal processing and DSP accelerators Leverage the Stratix family DSP block interfaces and embedded memory to implement signal processing pipelines, buffering, and data formatting.
- Prototyping and custom logic implementation Deploy the programmable logic resources and on-chip RAM to validate custom algorithms, controllers, and mixed-function digital blocks.
- Clocking-heavy systems Apply integrated PLLs and clock network features for designs that require multiple clock domains, clock management, and timing control.
Unique Advantages
- Substantial logic capacity: 18,460 logic elements provide a large, flexible fabric for implementing complex state machines and logic functions, reducing the need for multiple discrete devices.
- Significant embedded memory: Approximately 1.67 Mbits of on-chip RAM supports local buffering and data storage, simplifying board-level memory requirements.
- High I/O count: 426 I/Os enable direct connection to numerous peripherals and parallel interfaces, minimizing additional interface components.
- Robust Stratix architecture: Family-level features such as advanced I/O modes, PLLs, DSP interfaces, and configuration/testing support provide design flexibility and system-level capabilities.
- Compact, high-pin-count package: The 672-FBGA (27 × 27 mm) package balances pin density with a surface-mount form factor for PCB space optimization.
- Regulatory readiness: RoHS compliance facilitates use in lead-free manufacturing processes.
Why Choose EP1S20F672C6?
The EP1S20F672C6 positions itself as a capable Stratix FPGA option for commercial designs that require a combination of significant programmable logic, embedded memory, and extensive I/O. Its documented Stratix family features—such as advanced clocking, DSP block interfaces, and sophisticated I/O support—align with development needs for complex digital systems and hardware-accelerated functions.
Designers and teams seeking a commercially graded FPGA with a 672-ball FBGA footprint, clearly defined voltage and temperature ranges, and RoHS compliance will find this device suitable for applications where integration, configurability, and on-chip resources reduce board-level complexity and speed time-to-prototype.
If you would like pricing, availability, or a formal quote for the EP1S20F672C6, submit a request and our team will respond with a quote and ordering details.

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