EP1S40F1020C7

IC FPGA 773 I/O 1020FBGA
Part Description

Stratix® Field Programmable Gate Array (FPGA) IC 773 3423744 41250 1020-BBGA

Quantity 163 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1020-FBGA (33x33)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1020-BBGANumber of I/O773Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs4125Number of Logic Elements/Cells41250
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits3423744

Overview of EP1S40F1020C7 – Stratix® Field Programmable Gate Array (FPGA) IC 773 3423744 41250 1020-BBGA

The EP1S40F1020C7 is a Stratix family Field Programmable Gate Array (FPGA) manufactured by Intel. It delivers a balanced platform of logic capacity, embedded memory, and a high pin count to support complex, I/O‑rich designs.

Built around the Stratix architecture described in the Stratix Device Handbook, this device targets communications, signal processing and system‑level integration where a combination of approximately 41,250 logic elements, roughly 3.42 Mbits of embedded memory, and 773 I/O pins are required.

Key Features

  • Logic Capacity  Approximately 41,250 logic elements (4125 LABs), providing a sizeable fabric for medium‑to‑large FPGA designs.
  • Embedded Memory  Approximately 3.42 Mbits of on‑chip RAM (3,423,744 total RAM bits) to support buffering, packet storage, and local data structures.
  • High I/O Count  773 I/O pins for extensive peripheral, memory, and high‑speed interface connectivity.
  • Stratix Architecture Features  Includes the architecture elements documented in the Stratix Device Handbook such as logic array blocks, TriMatrix memory structures, PLLs and clock networks, and a comprehensive I/O structure.
  • Package & Mounting  1020‑BBGA package; supplier device package listed as 1020‑FBGA (33×33). Surface‑mount device suitable for PCB assembly.
  • Power & Voltage  Core supply range of 1.425 V to 1.575 V for device power rail planning and system power sequencing.
  • Commercial Temperature Grade  Designed for operation from 0 °C to 85 °C, aligning with commercial applications and environments.
  • Configuration & Test Support  Device family documentation covers configuration modes, JTAG boundary‑scan, SignalTap II embedded logic analysis and related testing features.
  • RoHS Compliance  RoHS‑compliant material set for regulatory and assembly considerations.

Typical Applications

  • Networking & Communications  High I/O density and on‑chip memory make the device suitable for packet processing, interface bridging, and protocol handling.
  • Signal Processing & DSP  Large logic capacity with embedded RAM supports custom DSP pipelines, filtering, and data path acceleration.
  • Embedded System Integration  Use as a central programmable fabric to consolidate glue logic, custom peripherals, and system control functions.
  • Test & Measurement  Flexible I/O and internal resources enable custom data capture, preprocessing, and interface adaptation for instrumentation.

Unique Advantages

  • Substantial Logic Resource: The device’s ~41,250 logic elements support complex state machines, parallel datapaths, and moderate system integration within a single FPGA.
  • On‑Chip Memory for Local Data Handling: Approximately 3.42 Mbits of embedded RAM reduces reliance on external memory for short‑term buffering and deterministic data storage.
  • Extensive I/O Connectivity: 773 I/Os enable direct attachment of multiple interfaces, high‑pin‑count peripherals, and broad system interconnect without extensive external demultiplexing.
  • Documented Stratix Architecture: Backed by the Stratix Device Handbook, the device benefits from detailed architecture and configuration guidance for design and verification.
  • Commercial Temperature Range: Rated 0 °C to 85 °C to match typical commercial system requirements and deployment scenarios.
  • Regulatory Readiness: RoHS compliance supports modern manufacturing and environmental requirements.

Why Choose EP1S40F1020C7?

The EP1S40F1020C7 is positioned for designers who need a high‑capacity Stratix FPGA with abundant I/O and on‑chip memory for intermediate to advanced system designs. Its combination of approximately 41,250 logic elements, roughly 3.42 Mbits of embedded RAM, and 773 I/Os delivers integration and flexibility for communication, processing, and system control tasks.

Supported by the Stratix device documentation, this Intel‑manufactured part offers predictable electrical and configuration characteristics (including a defined core supply range and commercial temperature grading) that simplify system design, power planning, and verification for production deployment.

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