EP1S40F1020C7
| Part Description |
Stratix® Field Programmable Gate Array (FPGA) IC 773 3423744 41250 1020-BBGA |
|---|---|
| Quantity | 163 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 1020-FBGA (33x33) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1020-BBGA | Number of I/O | 773 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 4125 | Number of Logic Elements/Cells | 41250 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 3423744 |
Overview of EP1S40F1020C7 – Stratix® Field Programmable Gate Array (FPGA) IC 773 3423744 41250 1020-BBGA
The EP1S40F1020C7 is a Stratix family Field Programmable Gate Array (FPGA) manufactured by Intel. It delivers a balanced platform of logic capacity, embedded memory, and a high pin count to support complex, I/O‑rich designs.
Built around the Stratix architecture described in the Stratix Device Handbook, this device targets communications, signal processing and system‑level integration where a combination of approximately 41,250 logic elements, roughly 3.42 Mbits of embedded memory, and 773 I/O pins are required.
Key Features
- Logic Capacity Approximately 41,250 logic elements (4125 LABs), providing a sizeable fabric for medium‑to‑large FPGA designs.
- Embedded Memory Approximately 3.42 Mbits of on‑chip RAM (3,423,744 total RAM bits) to support buffering, packet storage, and local data structures.
- High I/O Count 773 I/O pins for extensive peripheral, memory, and high‑speed interface connectivity.
- Stratix Architecture Features Includes the architecture elements documented in the Stratix Device Handbook such as logic array blocks, TriMatrix memory structures, PLLs and clock networks, and a comprehensive I/O structure.
- Package & Mounting 1020‑BBGA package; supplier device package listed as 1020‑FBGA (33×33). Surface‑mount device suitable for PCB assembly.
- Power & Voltage Core supply range of 1.425 V to 1.575 V for device power rail planning and system power sequencing.
- Commercial Temperature Grade Designed for operation from 0 °C to 85 °C, aligning with commercial applications and environments.
- Configuration & Test Support Device family documentation covers configuration modes, JTAG boundary‑scan, SignalTap II embedded logic analysis and related testing features.
- RoHS Compliance RoHS‑compliant material set for regulatory and assembly considerations.
Typical Applications
- Networking & Communications High I/O density and on‑chip memory make the device suitable for packet processing, interface bridging, and protocol handling.
- Signal Processing & DSP Large logic capacity with embedded RAM supports custom DSP pipelines, filtering, and data path acceleration.
- Embedded System Integration Use as a central programmable fabric to consolidate glue logic, custom peripherals, and system control functions.
- Test & Measurement Flexible I/O and internal resources enable custom data capture, preprocessing, and interface adaptation for instrumentation.
Unique Advantages
- Substantial Logic Resource: The device’s ~41,250 logic elements support complex state machines, parallel datapaths, and moderate system integration within a single FPGA.
- On‑Chip Memory for Local Data Handling: Approximately 3.42 Mbits of embedded RAM reduces reliance on external memory for short‑term buffering and deterministic data storage.
- Extensive I/O Connectivity: 773 I/Os enable direct attachment of multiple interfaces, high‑pin‑count peripherals, and broad system interconnect without extensive external demultiplexing.
- Documented Stratix Architecture: Backed by the Stratix Device Handbook, the device benefits from detailed architecture and configuration guidance for design and verification.
- Commercial Temperature Range: Rated 0 °C to 85 °C to match typical commercial system requirements and deployment scenarios.
- Regulatory Readiness: RoHS compliance supports modern manufacturing and environmental requirements.
Why Choose EP1S40F1020C7?
The EP1S40F1020C7 is positioned for designers who need a high‑capacity Stratix FPGA with abundant I/O and on‑chip memory for intermediate to advanced system designs. Its combination of approximately 41,250 logic elements, roughly 3.42 Mbits of embedded RAM, and 773 I/Os delivers integration and flexibility for communication, processing, and system control tasks.
Supported by the Stratix device documentation, this Intel‑manufactured part offers predictable electrical and configuration characteristics (including a defined core supply range and commercial temperature grading) that simplify system design, power planning, and verification for production deployment.
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