EP1S40F1020I6AA

The EP1S40F1020I6AA is an industrial-grade Stratix® FPGA offered in a 1020-ball BGA package, designed for high-density, high-connectivity embedded designs. Built on the Stratix II device family documented in the device handbook, this part combines substantial logic capacity, on-chip memory, and a large number of I/O to address complex logic, interface, and signal-processing tasks in industrial applications.

Key Features

• Core Logic Density Approximately 41,250 logic elements enabling complex logic integration and large custom designs.
• Embedded Memory Approximately 3.42 Mbits of on-chip RAM for buffering, state storage, and local data processing.
• High I/O Count 773 user I/O pins to support wide parallel buses, multiple interfaces, and external memory connections.
• Stratix II Architecture Based on the Stratix II device family (device handbook), which documents architecture elements such as DSP blocks, PLLs and clock networks, advanced I/O structure, and TriMatrix memory.
• Package & Mounting 1020-BBGA (supplier package: 1020-FBGA, 33×33) in a surface-mount form factor for high-density PCB integration.
• Power Supply Core voltage range: 1.425 V to 1.575 V to match required FPGA power rails.
• Industrial Temperature Range Rated for operation from −40 °C to 100 °C suitable for industrial environments.
• Regulatory Compliance RoHS compliant.

Typical Applications

• Industrial Control & Automation — Ideal for embedded controllers and I/O-heavy systems that require robust operation across −40 °C to 100 °C and many interface pins for sensors and actuators.
• High-Density Custom Logic — Implement large state machines, custom acceleration, and bespoke control logic using the device’s ~41,250 logic elements and embedded RAM.
• Digital Signal Processing — Leverage the Stratix II family’s documented DSP and clocking resources for filtering, transforms, and other real-time signal-processing functions.
• High-Speed Interface and Memory Bridging — Use the extensive I/O count and documented external RAM interfacing capabilities for wide buses, memory controllers, and connectivity to complex peripherals.

Unique Advantages

• High logic capacity: Enables consolidation of multiple functions into a single device, reducing board-level complexity.
• Substantial on-chip memory: Approximately 3.42 Mbits of embedded RAM for efficient local storage and reduced external memory dependency.
• Extensive I/O availability: 773 I/O pins simplify system partitioning and reduce the need for external interface chips.
• Industrial-grade operation: Rated from −40 °C to 100 °C for reliable performance in demanding environments.
• Compact BGA integration: 1020-ball BGA (1020-FBGA, 33×33) balances high pin count with a compact PCB footprint for dense system designs.
• Standards and environmental compliance: RoHS compliant for supply-chain and regulatory alignment.

Why Choose EP1S40F1020I6AA?

The EP1S40F1020I6AA positions itself as a high-density, industrial-grade FPGA option within the Stratix II family, combining more than 41k logic elements, multiple megabits of embedded RAM, and a very large I/O complement. Its documented architecture (Stratix II device handbook) supports advanced clocking, DSP functionality, and high-speed I/O features suited to demanding embedded and interface-centric designs.

This part is well suited to engineers and procurement teams building industrial automation, high-density logic, signal-processing, or memory-interface solutions that require robust thermal performance, extensive connectivity, and a compact BGA package. The EP1S40F1020I6AA offers scalability and integration potential for medium-to-large FPGA-based designs backed by the Stratix II device documentation.

Request a quote or submit an RFQ for EP1S40F1020I6AA to obtain pricing and availability information tailored to your project requirements.